Abstract: In one embodiment of the present disclosure, a phased array antenna system includes a first portion carrying an antenna lattice including a plurality of antenna elements, wherein the plurality of antenna elements are arranged in a first configuration, and a second portion carrying a beamformer lattice including a plurality of beamformer elements, wherein the plurality of beamformer elements are arranged in a second configuration different from the first configuration, wherein each of the plurality of antenna elements are electrically coupled to one of the plurality of beamformer elements.

Abstract: The present disclosure provides a display substrate, a method for manufacturing the display substrate, and a display device. The display substrate includes a first conductive line extending in a first direction on a base substrate, a second conductive line extending in a second direction crossing the first direction on the base substrate, and an insulation layer arranged between the first conductive line and the second conductive line. The display substrate further includes a buffer layer arranged between the first conductive line and the base substrate, a groove extending in the first direction is formed in the buffer layer, the first conductive line is arranged in the groove, and a surface of the first conductive line away from the base substrate is flush with a surface of the buffer layer away from the base substrate.

Abstract: A circuit board for a non-combustion flavor inhaler includes a substrate and an electrically conductive ink pattern printed on the substrate. The substrate includes paper. A percentage weight loss of the paper from room temperature to 290° C. is less than 20% of a percentage weight loss of the paper from room temperature to 900° C. under a condition that allows air to flow at a flow rate of 100 mL/min while elevating a temperature of the air at a speed of 10° C./min.

Abstract: A lead-free solder alloy includes 2.0% by mass or more and 4.0% by mass or less of Ag, 0.3% by mass or more and 0.7% by mass or less of Cu, 1.2% by mass or more and 2.0% by mass or less of Bi, 0.5% by mass or more and 2.1% by mass or less of In, 3.0% by mass or more and 4.0% by mass or less of Sb, 0.001% by mass or more and 0.05% by mass or less of Ni, 0.001% by mass or more and 0.01% by mass or less of Co, and the balance being Sn.

Abstract: A device for manufacturing a stretchable substrate structure according to an embodiment includes a carrier substrate receiving portion configured to receive a carrier substrate therein, a stretchable substrate receiving portion configured to receive a stretchable substrate in a direction facing the carrier substrate, and a diaphragm configured to be deformed by air pressure provided on one surface, wherein the diaphragm comes in contact with an entire surface of the stretchable substrate in a plane direction when deformed, such that the stretchable substrate is combined to the carrier substrate by deforming according to the deformed shape of the diaphragm.

Abstract: A component carrier having a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure and having a cavity delimited at least partially by a first polymer, and a component embedded in the cavity of the stack and being at least partially covered by a second polymer, wherein an anchoring interface is formed at an interface between the first polymer and the second polymer at which the first polymer and the second polymer are mechanically anchored with each other.

Abstract: An electronic device includes a supporting board, an electrical board and electronic units. The supporting board includes a circuit layer. The electrical board has a board body, through holes through the board body, an electrical layer on the board body, and primary conductive elements respectively in the through holes. The board body has opposite first and second surfaces. The through holes communicate with the first surface and the second surface. The primary conductive elements electrically connect the electrical layer to the circuit layer. The electronic units are arranged on the first surface. Each electronic unit partially overlaps with one corresponding through hole in a projection direction of the electrical board. Each electronic unit has an electronic component and a secondary conductive element electrically connecting the electronic component to the electrical layer. The secondary conductive elements and the primary conductive elements are arranged in dislocation in the projection direction.

Abstract: There is disclosed a driving circuit board for a display device. The driving circuit board is foldable. The driving circuit board is provided with a through hole which penetrates through the driving circuit board and which is located at a foldable portion of the driving circuit board. The disclosure also provides a display device.

Abstract: A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a component including a terminal made of a first electrically conductive material and being embedded in the stack, a recess in the stack exposing at least a part of the terminal, an interface structure on the at least partially exposed terminal and an electrically conductive structure on the interface structure made of a second electrically conductive material.

Abstract: An intermediate substrate is provided with a plurality of conductive posts and support members arranged at opposite sides of a coreless circuit structure and insulating layers encapsulating the conductive posts and the support members. Through the arrangement of the support members and the insulating layers, the intermediate substrate can meet the rigidity requirement so as to effectively resist warping and achieve an application of fine-pitch circuits.

Abstract: A display device includes a display panel in a wraparound form and comprising two wraparound edges opposite to each other and two non-wraparound edges opposite to each other. The display device further includes a flexible circuit board having a surface and a bonding region at a periphery of the surface. The flexible circuit board is electrically bonded to one of the two non-wraparound edges through the bonding region for driving the display panel.

Abstract: A printed wiring board according to an aspect of the present invention includes a base film having insulation properties and a conductive pattern including multiple wiring portions laminated, the conductive pattern running on at least one surface of the base film, wherein each wiring portion includes a first conductive portion and a second conductive portion coating an outer surface of the first conductive portion, wherein an average width of each wiring portion is 10 ?m or greater to 50 ?m or smaller, and an average thickness of the second conductive portion is 1 ?n or greater to smaller than 8.5 ?m.

Abstract: An electronic component package includes a substrate and an electronic component mounted to the substrate, the electronic component including a bond pad. A first antenna terminal is electrically connected to the bond pad, the first antenna terminal being electrically connected to a second antenna terminal of the substrate. A package body encloses the electronic component, the package body having a principal surface. An antenna is formed on the principal surface by applying an electrically conductive coating. An embedded interconnect extends through the package body between the substrate and the principal surface and electrically connects the second antenna terminal to the antenna. Applying an electrically conductive coating to form the antenna is relatively simple thus minimizing the overall package manufacturing cost. Further, the antenna is relatively thin thus minimizing the overall package size.

Abstract: A printed wiring board includes a first insulating layer, a conductor layer on the first insulating layer, and a second insulating layer formed on the first insulating layer and covering the conductor layer. The conductor layer includes first, second and third circuits, the first circuit has first width of 15 ?m or less, the first and second circuits have second space between the first and second circuits such that the second space has second width of 14 ?m or less, the first and third circuits have third space between the first and third circuits such that the third space has third width of 20 ?m or more, and the first circuit has first lower and upper surfaces, and second and third side walls such that second angle between the second wall and the first lower surface is larger than third angle between the third wall and the first lower surface.

Abstract: A wiring substrate includes a first insulating layer, a first conductor layer, a second insulating layer, a second conductor layer, a connection conductor, and a coating film. The first conductor layer includes a conductor pad and a wiring pattern such that the conductor pad is formed in contact with the connection conductor and that the wiring pattern is covered by the coating film, the conductor pad has a surface facing the second insulating layer and having first surface roughness higher than surface roughness of a surface of the wiring pattern, and the coating film has opening exposing a portion of the surface of the conductor pad from the coating film and having area larger than area of interface between the conductor pad and the connection conductor and that the connection conductor is formed on the portion of the surface of the conductor pad and is separated from the coating film.

Abstract: Current measurement devices for printed circuit board mounting are disclosed herein. The current measurement devices include a hollow and flexible core to improve response to a primary signal and decrease weight. The current measurement device includes a housing with guides to maintain alignment of the core. An electromagnetic shield may be placed between the circumference of the core and the housing. The housing may include apertures to facilitate washing. The current measurement device may include a primary conductor external to the housing.

Abstract: In a printed wiring board, one transmitting circuit and N (N is an integer of 3 or more) receiving circuits are coupled by a multi-point wiring. First to N-th branch points are provided in sequence in the multi-point wiring having one end coupled to the transmitting circuit. Wirings branched at the respective branch points are coupled to the respective receiving circuits. Here, a wiring length from a coupling point of the transmitting circuit to a first branch point is configured to be longer than a wiring length from the first branch point to the second branch point. Wiring lengths between the adjacent branch points at and after a second branch point are configured to be shorter than the wiring length from the first branch point to the second branch point.

Abstract: A display device includes the following elements: a base substrate having an active area and a non-active area; a plurality of pads disposed on the non-active area; and a printed circuit disposed on the plurality of pads. The printed circuit may include the following elements: a support layer; a first conductive layer and a second conductive layer respectively disposed on two opposite surfaces of the support layer. The second conductive layer may include the following elements: a first conductive member; a second conductive member; and a space between the first conductive member and the second conductive member. The first conductive member and the second conductive member may be electrically connected to the first conductive layer through contact holes. A side surface of the base substrate may be positioned between two edges of the space in a direction parallel to the support layer.

Abstract: An elastic mounting board that includes: a first elastic substrate; an elastic wiring on a first main surface of the first elastic substrate; an electrode electrically connected to the elastic wiring; and a functional component mounted in a mounting portion of the first elastic substrate and electrically connected to the elastic wiring, in which the mounting portion having the functional component is folded back such that the functional component will face a first main surface side of the elastic mounting board and the electrode will face a second main surface side of the elastic mounting board.

Abstract: Laminate structures and configurations of fiducials for laminates structures for electronic devices are disclosed. Fiducials are formed in laminate structures to provide increased visibility and contrast, thereby improving detection of the fiducials with optical detection equipment of automated machines commonly used in the electronics industry. Fiducials are disclosed that are defined by openings in laminate structures that extend to depths within the laminate structures to provide sufficient contrast. Openings for fiducials may be arranged to extend through multiple metal layers and dielectric layers of the laminate structures. The fiducials may be formed by laser drilling or other subtractive processing techniques.