Abstract: Embodiments are described that leverage variability of a chip. Different areas of a chip vary in terms of reliability under a same operating condition. The variability may be captured by measuring errors over different areas of the chip. A physical factor that affects or controls the likelihood of an error on the chip can be varied. For example, the voltage supplied to a chip may be provided at different levels. At each level of the physical factor, the chip is tested for errors within the regions. Some indication of the error statistics for the regions is stored and then used to adjust power used by the chip, to adjust reliability behavior of the chip, to allow applications to control how the chip is used, to compute a signature uniquely identifying the chip, etc.

Abstract: A memory interface device has an address input(s) configured to receive address information from an address stream of a host controller; an address output(s) configured to drive address information, and is coupled to a plurality of memory devices; an address match table comprising at least a revised address corresponding to a spare memory location; a control module configured to determine address information from an address stream from an address command bus coupled to a host controller during a run time operation; and a multiplexer coupled to the address input and coupled to the address output.

Abstract: A semiconductor device comprises a sense amplifier circuit amplifying a signal transmitted through the bit line, first/second data lines transmitting the signal amplified by the sense amplifier circuit, a read amplifier circuit driven by a first voltage and amplifying the signal; first/second switch circuits controlling connection between the above components, first/second voltage setting circuits setting the second/third data lines to a second voltage lower than the first voltage. A predetermined voltage obtained by adding the second voltage to a threshold voltage of a transistor in the second/third switch circuit is applied to the gate terminal thereof, and ends of the data lines are connected to the source and drain terminals thereof.

Abstract: A memory device having complementary global and local bit-lines, the complementary local bit-lines being connectable to the complementary global bit-lines by means of a local write receiver which is configured for creating a full voltage swing on the complementary local bit lines from a reduced voltage swing on the complementary global bit lines. The local write receiver comprises a connection mechanism for connecting the local to the global bit-lines and a pair of cross-coupled inverters directly connected to the complementary local bit lines for converting the reduced voltage swing to the full voltage swing on the complementary local bit lines.

Abstract: A semiconductor device includes a plurality of memory mats, each of which includes a plurality of word lines, a plurality of bit lines, a plurality of memory cells that are arranged at intersections of the word lines and the bit lines, and a plurality of dummy word lines, each of which is sandwiched between two corresponding ones of the word lines; a main dummy word line to which the dummy word lines included in the memory mats are commonly electrically connected; and a dummy-word-line control circuit that detects an electric potential of the main dummy word line when a test signal is activated, and outputs an error signal when the electric potential exceeds a predetermined threshold value. According to the present invention, because an electric potential of each of the dummy word lines is directly detected, an address of the word line, which has a short circuit with the dummy word line, can be reliably detected in a short time.

Abstract: A memory controller can provide current to a heater in a flash memory to reduce cycling induced errors. If necessary, after heating, the memory may be refreshed. In non-battery powered systems, data may be removed from the memory prior to heating and restored to the memory after heating.

Abstract: A sub word line driver and a semiconductor integrated circuit device having the same are provided. The semiconductor integrated circuit device includes adjacent four sub word line drivers configured to drive four sub word lines in response to signals of four main word lines, wherein first and second sub word line drivers of adjacent sub word line drivers share one keeper transistor with each other, and third and fourth sub word line drivers of the adjacent sub word line drivers share one keeper transistor with each other.

Abstract: A memory device comprising a plurality of static random access memory (SRAM) bit cells, and a word line driver coupled to provide a word line signal to the bit cells. The word line driver receives a global word line signal that remains active while the word line signal is asserted and subsequently de-asserted, and the word line signal is coupled between a positive supply voltage (VDD) and a supply voltage below ground (VN).

Abstract: A first field-effect transistor provided over a substrate in which an insulating region is provided over a first semiconductor region and a second semiconductor region is provided over the insulating region; an insulating layer provided over the substrate; a second field-effect transistor that is provided one flat surface of the insulating layer and includes an oxide semiconductor layer; and a control terminal are provided. The control terminal is formed in the same step as a source and a drain of the second field-effect transistor, and a voltage for controlling a threshold voltage of the first field-effect transistor is supplied to the control terminal.

Abstract: Memory devices and methods for operating a memory include filtering a histogram of sensed data of the memory, and adjusting a parameter used to sense the memory using the filtered histogram. Filtering can be accomplished by averaging or summing, and may include weighting the sums or averages.

Abstract: Disclosed is a method reading memory device information from a nonvolatile memory device having a three-dimensional (3D) memory cell array including an original plane storing data associated with the information in a first group of memory cells and a replica plane storing the data in replica in a second group of memory cells. The method applies a selection read voltage to a selected word line connected to first and second groups of memory cells while applying a non-selection read voltage to other word lines, and simultaneously reading first data from the first group of memory cells and second data from the second group of memory cells.

Abstract: Some embodiments include a memory device and a method of programming memory cells of the memory device. One such method can include applying a signal to a line associated with a memory cell, the signal being generated based on digital information. The method can also include, while the signal is applied to the line, determining whether a state of the memory cell is near a target state when the digital information has a first value, and determining whether the state of the memory cell has reached the target state when the digital information has a second value. Other embodiments including additional memory devices and methods are described.

Abstract: Subject matter disclosed herein relates to a memory device, and more particularly to write performance of a phase change memory.

Abstract: Magneto-resistive memory bit cells in an array have high or low resistance states storing logic values. During read operations, a bias source is coupled to an addressed memory word, coupling a parameter related to cell resistance to a sense amplifier at each bit position. The sense amplifiers determine whether the parameter value is greater or less than a reference value between the high and low resistance states. The reference value is derived by averaging or splitting a difference of resistances of reference cells at high and/or low resistance states. Bias current is conducted over address lines with varying resistance, due to different distances between the sense amplifiers and addressed memory words, which is canceled by inserting into the comparison circuit a resistance from a dummy addressing array, equal to the resistance of the conductor addressing the selected word line and bit position.

Abstract: A memory integrated circuit device is provided. The device includes a plurality of regular address inputs and at least one spare address input configured for a selected mode or an unselected mode. The device includes a plurality of control inputs, a plurality of data inputs, and a plurality of data outputs. The device has a plurality of memory arrays. Each of the memory arrays comprises a plurality of memory cells. Each of the plurality of memory cells is coupled to a data input/output. The device has a spare group of memory cells comprising a plurality of spare memory cells. Each of the plurality of spare memory cells is externally (or internally) addressable using the address match table and configured with the spare address input; whereupon the spare address input is coupled to the address match table to access the spare memory cells.

Abstract: In a non-volatile memory system, a plurality of main memory cells for storing data is arranged in a data cell array and a plurality of reference memory cells is arranged in a reference cell array. The reference cell array includes first reference word lines connected to first reference memory cells and extending, second reference word lines connected to second reference memory cells and extending alternately with the first reference word lines, reference bit lines to which the first and the second reference memory cells are alternately connected in a line and a combined cell having a pair of the first and second reference memory cells and generating a reference signal for processing the data. The first and the second reference memory cells have different cell characteristics. The stability of the reference signal is improved irrespective of the differentiation of the first and the second reference memory cells.

Abstract: According to example embodiments of inventive concepts, a nonvolatile memory device includes a first NAND string and a second NAND string. The first NAND string include a first string selection transistor, a first ground selection transistor having a threshold voltage higher than a threshold voltage of the first string selection transistor, and first memory cells stacked on a substrate. The a second NAND string includes a second string selection transistor, a second ground selection transistor having a threshold voltage higher than a threshold voltage of the second string selection transistor, and second memory cells stacked on the substrate. A first selection line may connect the first string selection line and the first ground selection line, and a second selection line may connect the second selection line and the second ground selection line. The first and second selection lines may be electrically isolated from each other.

Abstract: To include a plurality of core chips to which different pieces of chip information from each other are given in advance. A first refresh command is divided into a plurality of second refresh commands having different timings from each other, and a refresh operation is performed on a core chip for which a count value of the second refresh commands and at least a portion of the chip information match each other. With this configuration, even when the second refresh command is commonly supplied to a plurality of core chips, it is possible to shift a timing for the refresh operation in each of the core chips. Therefore, it is possible to reduce a peak current at the time of the refresh operation.

Abstract: A method and apparatus for organizing memory for a computer system including a plurality of memory devices 2, 3, connected to a logic device 1, particularly a memory system having a plurality of stacked memory dice connected to a logic die, with the logic device 1 having capability to analyze and compensate for differing delays to the stacked devices 2,3,4,5 stacking multiple dice divided into partitions serviced by multiple buses 21,22 connected to a logic die 1, to increase throughput between the devices 2,3 and logic 1 device allowing large scale integration of memory with self-healing capability.

Abstract: A novel semiconductor element contributing to an increase in circuit scale is provided. In the semiconductor element, two different electrical switches are formed using a single oxide semiconductor layer. For example, in the semiconductor element, formation of a channel (a current path) in the vicinity of a bottom surface (a first surface) of the oxide semiconductor layer and formation of a channel in the vicinity of a top surface (a second surface) of the oxide semiconductor layer are independently controlled. Therefore, the circuit area can be reduced as compared to the case two electrical switches are separately provided (for example, the case where two transistors are separately provided). That is, a circuit is formed using the semiconductor element, whereby an increase in the circuit area due to an increase in circuit scale can be suppressed.