Patents Examined by Tu Hoang
  • Patent number: 7046116
    Abstract: A temperature probe is provided having a sensor element formed from a ceramic substrate and a platinum thin-film resistor arranged thereon. The platinum thin-film resistor is electrically connected with at least two terminal wires, with the at least two terminal wires each being electrically and mechanically connected with a contact pin in a connection area on their side facing away from the sensor element. The diameter of the terminal wires is smaller than the diameter of the contact pins, and the connection area is covered by a glass bead. Use of the temperature probe in a temperature range of about ?70° C. to +600° C. is ideal.
    Type: Grant
    Filed: November 10, 2003
    Date of Patent: May 16, 2006
    Assignee: Heraeus Sensor Technology GmbH
    Inventors: Gerhard Damaschke, Bruno Rudnizki
  • Patent number: 7046117
    Abstract: An integrated signal isolator is provided to isolate first and second circuits. First, second, third, and fourth magnetoresistors of the isolator are coupled together so as to form a Wheatstone bridge. The first second, third, and fourth magnetoresistors are arranged so that the Wheatstone bridge is immune to uniform external magnetic fields having any direction. An input strap generates magnetic fields across the first, second, third and fourth magnetoresistors in response to a signal from the first circuit so that the Wheatstone bridge provides an output to the second circuit that is commensurate with the signal from the first circuit.
    Type: Grant
    Filed: January 15, 2002
    Date of Patent: May 16, 2006
    Assignee: Honeywell International Inc.
    Inventor: Hong Wan
  • Patent number: 7042328
    Abstract: A high power resistor includes a resistance element with first and second leads extending out from the opposite ends thereof. A heat sink of dielectric material is in heat conducting relation to the resistance element. The heat conducting relationship of the resistance element and the heat sink render the resistance element capable of operating as a resistor between the temperatures of ?65° C. to +275° C. The heat sink is adhered to the resistance element and a molding compound is molded around the resistance element.
    Type: Grant
    Filed: May 5, 2005
    Date of Patent: May 9, 2006
    Assignee: Vishay Dale Electronics, Inc.
    Inventors: Greg Schneekloth, Nathan Welk, Brandon Traudt, Joel Smejkal, Ronald J. Miksch, Steve Hendricks, David L. Lange
  • Patent number: 7042331
    Abstract: A thick-film resistor component may include a thick film component formed between a thick-film resistor and an electrically conductive sheet, wherein a portion of the sheet is selectively removed to form resistor contacts while exposing a portion of the thick-film component. Electrical terminals to a thick-film resistor may be sized to reduce stress and/or be selectively positioned relative to the resistor to define a desired resistor value. A thick-film resistor may include one or more resistor segments configured to be selectively open-circuited to incrementally adjust the value of the resistor.
    Type: Grant
    Filed: August 12, 2003
    Date of Patent: May 9, 2006
    Assignee: Delphi Technologies, Inc.
    Inventors: Jiming Zhou, Dwadasi H. Sarma, Carl W. Berlin, John D Myers, M. Ray Fairchild
  • Patent number: 7041944
    Abstract: An apparatus for heating a flowable material comprises a core having a passageway formed therein for the communication of the flowable material, and an electric element coiled in multiple turns against the core in a helical pattern. The electric element, in use, heats the core both resistively and inductively. The electric element has no auxiliary cooling capacity. The electric element may be installed against the outside of the core, with an optional ferromagnetic yoke installed over it, or it may be installed against the inside of the core, embedded in a wear-resistant liner. The yoke and liner may be metallic material deposited such as by hot-spray technology and finished smooth.
    Type: Grant
    Filed: March 31, 2004
    Date of Patent: May 9, 2006
    Assignee: Husky Injection Molding Systems, Ltd.
    Inventors: Jim Izudin Pilavdzic, Stefan Von Buren, Valery G. Kagan
  • Patent number: 7042329
    Abstract: A rotatable variable resistor with a clicking mechanism includes a rotary unit provided with a rotor and a wiper, and a fixed unit provided with a cover, a resistor substrate, and external terminals. The wiper has an arm segment, a clicking projection and a non-clicking projection. The undersurface of the cover is provided with a clicking depression. The distance from the center of rotation of the rotary unit to the top of the clicking projection is different from the distance from the center of rotation to the top of the non-clicking projection. The non-clicking projection may have a flat top portion with a width extending in one direction that is greater than that of the clicking depression such that a sliding track of the top of the clicking projection is located within a sliding track of the non-clicking projection in the radius direction. The clicking depression may alternatively be an aperture.
    Type: Grant
    Filed: May 17, 2004
    Date of Patent: May 9, 2006
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Tatsuya Nishikori
  • Patent number: 7042330
    Abstract: The low resistance value resistor 11 has two electrodes 12,13 of metal strips having a high electrical conductivity. The metal strips are affixed on the resistor body by means of rolling and/or thermal diffusion bonding. A fused solder layer is formed on a surface of each electrode comprised by the metal strip. Thus, sufficient bonding strength and superior current distribution in the resistor body is obtained. Further, a portion of the resistor body is trimmed by removing a portion of the body material along a direction of current flow between the electrodes to adjust a resistance value. Thus, a precise resistor value and superior characteristics of temperature coefficient of resistance (TCR) can be obtained.
    Type: Grant
    Filed: April 14, 2004
    Date of Patent: May 9, 2006
    Assignee: KOA Corporation
    Inventors: Keishi Nakamura, Mikio Tatuguchi
  • Patent number: 7038571
    Abstract: A printed circuit polymer thick film (PTF) resistor includes tolerance control material that substantially surrounds the resistor body and significantly improves the linearity of resistance vs. resistor length, and significantly reduces resistor-to-resistor and board-to-board fabrication variances. In one embodiment, the tolerance control material is the same metallic material as the printed circuit conductors, and is formed in two finger patterns on each side of the resistor body, each finger pattern connected to one terminal pad of the resistor. A layout cell is used for fabricating the PTF resistor. A method is used for fabricating the PTF resistor.
    Type: Grant
    Filed: May 30, 2003
    Date of Patent: May 2, 2006
    Assignee: Motorola, Inc.
    Inventors: Gregory J. Dunn, Jovica Savic, Remy J. Chelini
  • Patent number: 7038572
    Abstract: A method and apparatus for a stacked power chip resistor is disclosed. The invention provides for multiple power chip resistors to be stacked, providing for encapsulant such as glass to separate each power chip resistor and a metal barrier such as nickel plating on each end of the stacked power chip resistor to provide for electrical and mechanical connection of each power chip resistor in the stack.
    Type: Grant
    Filed: March 19, 2001
    Date of Patent: May 2, 2006
    Assignee: Vishay Dale Electronics, Inc.
    Inventors: Louis Peter Huber, Ziv Shoshani
  • Patent number: 7034653
    Abstract: A semiconductor resistor comprises a resistor body formed on a semiconductor substrate and first and second conductive terminals electrically connected to the resistor body at opposite ends thereof. The semiconductor resistor further includes at least first and second conductive paths between at least one of the first and second conductive terminals and the resistor body. The at least one conductive terminal is configured such that a resistance of the at least one conductive terminal between the at least first and second conductive paths is substantially matched to a resistance of the resistor body between the at least first and second conductive paths. In this manner, a current distribution between the at least first and second conductive paths is substantially matched.
    Type: Grant
    Filed: January 30, 2004
    Date of Patent: April 25, 2006
    Assignee: Agere Systems Inc.
    Inventors: Dipankar Bhattacharya, John Christopher Kriz, Stefan Allen Siegel, Joseph E. Simko, Yehuda Smooha
  • Patent number: 7034257
    Abstract: A method modifies friction between an object and ice or snow. The method utilizes a heating element to apply a pulse of thermal energy to an interface between the object and the ice or snow; the first pulse is sufficient to melt an interfacial layer of ice at the interface. Water forming the interfacial layer refreezes to form a bond between the object and the ice or snow. The steps of the method may be repeated to form a second bond between the object and the ice or snow.
    Type: Grant
    Filed: September 9, 2004
    Date of Patent: April 25, 2006
    Assignee: The Trustees of Dartmouth College
    Inventor: Victor Petrenko
  • Patent number: 7034652
    Abstract: The present invention provides a multifunction resistor having an improved voltage variable material (“VVM”). More specifically, the present invention provides a polymer VVM that has been formulated with a high percentage loading of conductive and/or semiconductive particles. A known length of the relatively conductive VVM is placed between adjacent electrodes to produce a desired Ohmic normal state resistance. When an electrostatic discharge event occurs, the VVM of the multifunctional resistor becomes highly conductive and dissipates the ESD threat. One application for this “resistor” is the termination of a transmission line, which prevents unwanted reflections and distortion of high frequency signals.
    Type: Grant
    Filed: July 10, 2002
    Date of Patent: April 25, 2006
    Assignee: Littlefuse, Inc.
    Inventors: Stephen J. Whitney, Hugh Hyatt, Louis Rector
  • Patent number: 7034260
    Abstract: A method of producing a heating element made from molybdenum silicide and alloys thereof, and which includes aluminum oxide on its surface. A material is produced that contains substantially Mo(Si1-xAlx)2 and Al2O3 by mixing a mixture of a silicon and molybdenum compound with an aluminum compound. Either of the silicon and molybdenum compounds include Mo(Si1-yAly)2 and are mixed with one or both of an aluminum compound in the form of Al2O3 or Al(OH)3 and optionally the compounds SiO2, Si, and MoO3, or by virtue of the mixture of the silicon and molybdenum compound containing MoO3 and Al and Si and/or SiO2. The input components together have a degree of purity corresponding to at least 98%. The mixture reacts exothermically and/or by being sintered, so that exchange reactions take place to form the compounds Mo(Si1-xAlx)2 and Al2O3, where x lies in the range of 0.4–0.6.
    Type: Grant
    Filed: April 4, 2003
    Date of Patent: April 25, 2006
    Assignee: Sandvik AB
    Inventors: Mats Sundberg, Anders Magnusson
  • Patent number: 7030344
    Abstract: A defroster for a heat exchanger includes a heat transfer plate on the heat exchanger; a thin film heater arranged on the heat transfer plate; and a power supply wire connected to the film heater for supplying power to the film heater. The defroster can be fabricated by forming a masking layer with a certain shape on an electrically resistant substrate; patterning a thin film heater on the substrate based on the shape of the masking layer; adhering the film heater to a heat transfer plate; and connecting a power supply to the film heater. Accordingly, it is possible to improve a defrosting performance of the heat exchanger and use an environment-friendly, alternative refrigerant with the relatively, low temperature defroster of the heat exchanger.
    Type: Grant
    Filed: December 30, 2003
    Date of Patent: April 18, 2006
    Assignee: LG Electronics Inc.
    Inventors: Nam-Soo Cho, Sung Jhee, Jang Seok Lee
  • Patent number: 7030727
    Abstract: A high voltage variable resistor device includes film resistors of fixed divided resistors and a variable divided resistor, fixed resistors, a variable resistor for adjusting focus voltage, and a variable resistor for adjusting screen voltage, which are formed on the surface of an insulation substrate. The fixed divided resistors have a meandering pattern and a high resistance. One end of the fixed divided resistor is connected to a high-voltage input terminal, and the other end is connected to one end of the variable divided resistor. The variable divided resistor has an arc pattern, and its other end is connected to one end of the fixed divided resistor. The other end of the fixed divided resistor is connected to a voltage detection terminal. The fixed divided resistor having a wide width pattern having a low resistance is connected between the voltage detection terminal and a ground terminal.
    Type: Grant
    Filed: December 17, 2004
    Date of Patent: April 18, 2006
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Tsugunichi Nagaoka, Yasuhiko Shimanaka
  • Patent number: 7030728
    Abstract: A resistor layout and method of forming the resistor are described which achieves improved resistor characteristics, such as resistor stability and voltage coefficient of resistance. A resistor is formed from a conducting material such as doped silicon or polysilicon. The resistor has a rectangular first resistor element, a second resistor element, a third resistor element, a fourth resistor element, and a fifth resistor element. A layer of protective dielectric is then formed over the first, second, and third resistor elements leaving the fourth and fifth resistor elements exposed. The conducting material in the exposed fourth and fifth resistor elements is then changed to a silicide, such as titanium silicide or cobalt silicide, using a silicidation process. The higher conductivity silicide forms low resistance contacts between the second and fourth resistor elements and between the third and fifth resistor elements.
    Type: Grant
    Filed: April 26, 2004
    Date of Patent: April 18, 2006
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Kong-Beng Thei, Chih-Hsien Lin, Shyh-Chyi Wong
  • Patent number: 7027481
    Abstract: A method and apparatus for melting vitrifiable materials employs a melting tank for containing a molten bath with an upper surface. The tank has a floor and side walls and channels for discharging molten materials. A crown is situated above the floor and vitrifiable materials are introduced onto the upper surface of the molten bath. A plurality of electrodes having a selected shape and position are situated inside the tank for melting the vitrifiable materials with electric current. The electrodes rest on the floor and extend across the furnace to the opposite wall so as to reduce the head of the molten bath and consequently reduce melting time and energy consumption.
    Type: Grant
    Filed: April 8, 2003
    Date of Patent: April 11, 2006
    Assignee: Trend Group SpA
    Inventor: Giuseppe Bisazza
  • Patent number: 7026910
    Abstract: So that the parts and connections of a component, particularly a Giant Magneto-Resistor, may withstand external forces, a meander group (13M, 14M) with at least one meander element (13.1, . . . , 13.n, 14.1, . . . , 14.n) is positioned in both connection elements (13, 14) between a component cell (1) and the straight functional connection element (13A, 14A). A capacitor unit (2) is mounted on the meander group (13M) of the first connection element (13) and on the meander group (14M; of the second connection element (14).
    Type: Grant
    Filed: July 8, 2002
    Date of Patent: April 11, 2006
    Assignee: AB Electronik GmbH
    Inventor: Peter Apel
  • Patent number: 7022955
    Abstract: The present invention relates to a container for the microwave heating of a food product in which a sheet of barrier material is sealed around a food product to a blank having one or more panels which can be folded to assemble a container. The sheet of barrier material forms a pocket inside which a food product may be disposed. The sheet of barrier material is sealed to one of the panels, so that a peripheral outer portion is formed to separate the food product from the remaining panel or panels. The barrier material may be moisture impervious, and may be sealed to the blank using a vacuum platen or heat-sealing methods. A microwave susceptor can be disposed on the blank, which is made from a material suitable for microwave heating such as a polymer and paperboard laminate.
    Type: Grant
    Filed: May 21, 2004
    Date of Patent: April 4, 2006
    Inventor: Jeffrey T. Watkins
  • Patent number: 7022949
    Abstract: A multiple-zone power control system for controlling electric heating elements, including a power control unit having multiple control zones, a touch-sensitive function key, and a touch-sensitive on/off key for activating and deactivating one of the control zones. When all of the control zones are deactivated, the touch-sensitive key must be touched for at least a cold start duration in order to activate the designated control zone. Alternatively, the designated control zone is prevented from being activated if the touch-sensitive function key is touched while the touch-sensitive on/off key is being touched. The control system also includes two power controllers connected by a communication bus. When one of the power controllers initiates a lockout condition, the other power controller initiates a corresponding lockout condition. Multiple heating elements can be controlled together using a single set of control keys. A element size key toggles between different combinations of heating elements to control.
    Type: Grant
    Filed: April 12, 2004
    Date of Patent: April 4, 2006
    Assignee: Electrolux Home Products, Inc.
    Inventor: Sanjay Shukla