Abstract: In order to improve a flatness of a work in single wafer type double-side polishing in which one wafer is polished with one carrier, a carrier larger in diameter than upper and lower surface plates that rotate is inserted between the surface plates, and a wafer smaller in diameter than the surface plates is held with the carrier. The carrier is rotated by plural eccentric gears that mesh with external gear teeth formed on the outer peripheral surface of the carrier at plural positions along a circumferential direction thereof and revolve around positions spaced from the centers as centers in synchronism with each other or one another at the plural positions of meshing. The carrier rotates about its center and moves circularly around the center of the surface plates spaced from the center thereof. The upper surface plate is reciprocated in a direction perpendicular to the central axis when required.

Abstract: A piezoelectric/electrostrictive device includes a base having a pair of right and left movable parts and a fixing part disposed at one end thereof, and piezoelectric/electrostrictive elements disposed on the sides of the movable parts of the base. Accordingly, the piezoelectric/electrostrictive device is fabricated to have a construction with fewer components. The piezoelectric/electrostrictive device having a construction with fewer components is provided by adopting a base having an integral structure formed by bending an original plate stamped into a shape that delineates a plane development of the base.

Abstract: In one embodiment, a fluid ejection device comprises a substrate having a first surface, and a fluid slot in the first surface. The device further comprises a fluid ejector formed over the first surface of the substrate, and a chamber layer formed over the first surface of the substrate. The chamber layer defines a chamber about the fluid ejector, wherein fluid flows from the fluid slot towards the to be ejected therefrom. The chamber layer has a discontinuity, wherein the discontinuity is positioned over the fluid slot.

Abstract: To manufacture a compact and high-performance thin-film piezoelectric bimorph element at low cost, first and second piezoelectric thin films (2, 3) are formed by sputtering on the both surfaces of a metal thin plate (1) which are opposing relation to each other along the thickness thereof, while the respective states of polarizations of the first and second piezoelectric thin films (2, 3) are controlled. A pair of electrode films (5) are formed on the respective surfaces of the first and second piezoelectric thin films (2, 3) opposite to the metal thin plate (1).

Abstract: An apparatus including first and second sections of a sanding block slidably interconnected and adapted for use with a continuous belt, and a resilient member interposed between the first section and second sections such that the resilient member both selectively repels the first and second sections one from the other while securing the first and second sections in a desired position relative to one another. The resilient member is rotatably connected to the first section of the sanding block such that the resilient member moves between alternate rotational positions. The resilient member produces variable pressure on the second section of sanding block depending on the rotational position of the resilient member. The resilient member includes a lever for securing the second section of sanding block in a position relative to the first section of sanding block.

Abstract: A method for making a terminal includes forming a reinforcement enclosed around the pieces of the distal end of the terminal to combine and connect the pieces. Thus, the pieces of the distal end of the terminal are connected closely by the reinforcement to form a compact conic body without forming an opening in the distal end of the terminal, so that the distal end of the terminal has a greater structural strength, thereby preventing the distal end of the terminal from being broken or worn out due to mutual hit when the distal end of the terminal is inserted into a female terminal in a misalignment manner.

Abstract: An apparatus for planarizing a work piece includes an easily assembled work carrier. The carrier includes a carrier insert having a work piece bladder clamped to a carrier backing plate with a plurality of clamps to form a plurality of web plenums. The outer edge of the bladder is supported by a rib that is coupled to a carrier plenum. By adjusting the pressure in the carrier plenum, the pressure exerted on the edge of a work piece during a planarization operation can be adjusted. The carrier also includes a floating wear ring that surrounds the work piece bladder and a work piece mounted on that bladder. By adjusting the force exerted by the wear ring on a polishing pad, independently of the pressure exerted by the rib at the edge of the bladder, the material removal rate near the edge of the work piece can be controlled.

Abstract: A face grinder assembly is disclosed for removing irregularities from tire. The face grinder assembly includes an outer frame and a slide frame slidably attached to the outer frame. The slide frame is capable of vertical movement relative to the outer frame between a working position and a non-working position. A sub-assembly carried by the slide frame includes a grinding stone. The sub-assembly is configured to define a clearance for the tire in the non-working position of the slide frame.

Abstract: A rotary cutting saw includes a base disk; and a plurality of abrasive segments which are fixed to an outer circumferential surface of the base disk, and which have respective outer surfaces cooperating with each other to constitute an outer circumferential surface of the rotary cutting saw; wherein each of the abrasive segments has at least one recess opening in the outer surface thereof; wherein each of the at least one recess has a radially outer portion and a radially inner portion which is located inwardly of the radially outer portion as viewed in a radial direction of the base disk; and wherein the radially outer portion has a width that is constant in the radial direction, and the radially inner portion has a width that varies in the radial direction.

Abstract: A method for manufacturing a multilayer ceramic capacitor includes the steps of forming a ceramic slurry, forming ceramic green sheets from the ceramic slurry, printing internal electrode patterns on the ceramic green sheets, generating a laminated body by stacking the ceramic green sheets provided with the internal electrode patterns printed thereon, dicing the laminated body to thereby form chip-shaped ceramic bodies and sintering the chip-shaped ceramic bodies. The ceramic slurry includes a glass component containing one or more additive elements selected from the group consisting of Mn, V, Cr, Mo, Fe, Ni, Cu and Co.

Abstract: An inline-ready method of finishing the surface of a long material (W) capable of preventing any environmental problem from occurring and the mechanical properties of the long material from deteriorating, comprising the steps of holding the long material (W) by two or more elastic endless belts (1) with a specified force, rotating the elastic endless belts (1) in the same direction as or in the reverse direction to the moving direction of the long material by moving the long material (W) and increasing or decreasing the rotating speed of the elastic endless belts (1) more than or less than the moving speed of the long material, and loading powder and granular grinding material (S) between the elastic endless belts (1), characterized in that the grinding material (S) is moved relative to the long material (W) to rub the grinding material (S) against the long material (W) so as to finish the surface of the long material (W).

Abstract: A wafer processing machine comprising a turntable, a plurality of chuck tables mounted on the turntable, a grinding means for grinding a wafer held on the chuck table, and a multipurpose polishing means for polishing the ground surface of a wafer held on a chuck table, wherein the multipurpose polishing means comprises a mounter for detachably mounting a polishing tool, a spindle unit for rotating the mounter, a spindle unit support means for supporting the spindle unit in such a manner that the spindle unit can move in a direction perpendicular to the holding surfaces of the chuck tables and in a direction parallel to the holding surfaces of the chuck tables, a first polishing-feed means for moving the spindle unit in a direction perpendicular to the holding surfaces of the chuck tables, and a second polishing-feed means for moving the spindle unit in a direction parallel to the holding surfaces of the chuck tables.

Abstract: An apparatus for polishing a wafer comprising a rotatable polishing pad having a center of rotation and a rinse delivery conduit positioned adjacent to the polishing pad and substantially in radial alignment with the center. The rinse delivery conduit includes a plurality of nozzles to dispense a rinsing liquid. In one embodiment, the plurality of nozzles are configured and positioned to generate a higher flow rate of the rinsing liquid at the end of the rinse delivery conduit proximate to the center than at the end of the rinse delivery conduit distal to the center. In another embodiment, the rinse delivery conduit has a proximal end which is substantially adjacent the center and the distal end which is approximately adjacent an outer periphery of the pad.

Abstract: A movable machine, for example a saw, has a light construction using composite materials such as fiber reinforced resins and a closed cell foam. The saw may have a housing formed from multiple skins of the composite materials in which is located the closed cell foam. Metallic inserts may be used to bond to either or both of the foam and the composite skin to accept working components. A saw is also described which uses gears sharing the same support element.

Abstract: A device for the precision working of planar surfaces, in particular for the plane finishing, has a tool (13), which has an outer and an inner operating surface (36, 44). These are designed like cup wheels, which fit into one another, and are rotatable together, however, can be axially fed independent of one another. This is done with respect to the outer operating surface (36) by means of the spindle drive of a honing machine, which is preferably designed as a linear motor, whereas the inner operating surface (44) is fed through the feed drive (28) of the honing machine, which feed drive extends inside of the spindle and of the tool.

Abstract: An apparatus for planarizing a work piece includes an easily assembled work carrier. The carrier includes a carrier insert having a work piece bladder clamped to a carrier backing plate with a plurality of clamps to form a plurality of web plenums. The outer edge of the bladder is supported by a rib that is coupled to a carrier plenum. By adjusting the pressure in the carrier plenum, the pressure exerted on the edge of a work piece during a planarization operation can be adjusted. The carrier also includes a floating wear ring that surrounds the work piece bladder and a work piece mounted on that bladder. By adjusting the force exerted by the wear ring on a polishing pad, independently of the pressure exerted by the rib at the edge of the bladder, the material removal rate near the edge of the work piece can be controlled.

Abstract: A method for manufacturing a substrate, a polishing process for a substrate, a method of reducing microwaviness for a substrate, each including the step of polishing a substrate to be polished with a polishing composition containing an abrasive and water with a polishing pad of which surface member has an average pore size of from 1 to 35 ?m; and a method of reducing scratches for a substrate, comprising the step of polishing a substrate to be polished with a polishing composition comprising an abrasive, an oxidizing agent, an acid, a salt thereof, or a mixture thereof and water, with a polishing pad of which surface member has an average pore size of from 1 to 35 ?m. The method for manufacturing a substrate can be used for finish polishing of a memory hard disk or for polishing of a semiconductor element.

Abstract: A polishing pad for polishing curved surfaces has a pad element having an axis, a central opening adjoining the axis and forming an inner edge, and an outer peripheral edge, first engaging means provided on the outer peripheral edge for engaging an outer periphery of a curved supporting body, and second engaging means provided on the inner edge of the pad element and engageable with a central opening of the curved supporting body, the first and second engaging means being harder than the pad element.

Abstract: Configuring a segment identifier in a customer premise equipment (CPE) connected to a network. Several OAM loopback cells containing possible segment identifiers in the headers may be transmitted. If an accurate segment identifier is used, the corresponding loopback cell may be received again in the CPE as an end system at the other end of the virtual circuit may loopback the cell. Thus, the CPE may be configured with the segment identifier corresponding to the received loopback cell. Once configured, new additional cells may be transmitted with the configured segment identifier.

Abstract: An electric motor having an armature which includes a coating of thermally conductive plastic applied in a conventional injection molding process. The armature also includes a fan which is integrally formed from the thermally conductive plastic applied to the armature. This completely eliminates the need to apply one or more coatings of a trickle resin to the armature. It also eliminates the need to separately form and secure a fan by a suitable adhesive to the armature, which together significantly simplifies the manufacturing and cost of the armature. The plastic coating also better fills the spaces between the magnet wires, thus promoting even more efficient cooling and better holding of the magnet wires stationary relative to one another. The thermally conductive plastic coating may be mixed with other suitable materials to provide a density approximately equal to the magnet wires. This eliminates the need to balance the armature after the injection molding step.