Patents Examined by Van Nguyen
  • Patent number: 7048616
    Abstract: The present invention relates to a grinding apparatus for grinding an out-of-round trunnion tire for a rotating kiln. The present invention is mounted on a trunnion roller such that a tracking wheel and a grinder are in tangent with the out-of-round trunnion tire. The mounting bracket supports a means for angling the grinder so that it is in tangent with the out-of-round tire and making it round. The grinder is part of a grinder head assembly which is mounted on the angling means. The grinder head assembly includes the grinder, a housing and a drive mechanism. The drive mechanism includes a motor which drives the grinder wheel so that it grinds the trunnion tire back into round.
    Type: Grant
    Filed: November 18, 2004
    Date of Patent: May 23, 2006
    Inventors: Martin A. Gardzinski, Donato L. Ricci
  • Patent number: 7044833
    Abstract: The present invention discloses an apparatus for transporting wafers. The apparatus includes a tray having a sloped portion on which a wafer having a sidewall can be mounted, a plurality of guides that disposed about the tray, and a plurality of sensors for detecting the position of the sidewall of the wafer with respect to the tray on which it is mounted by sensing the position of the sidewall. The present invention also discloses an apparatus for polishing wafers having the apparatus for transporting wafers comprising the circular tray and a plurality of guides and a plurality of sensors above-mentioned.
    Type: Grant
    Filed: December 2, 2004
    Date of Patent: May 16, 2006
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyun-Joo Yun, Sang-Seon Lee, Jong-Bok Kim, Kwang-Hee Lee, Min-Su Kim, Hyun-Sung Lee
  • Patent number: 7040958
    Abstract: A chemical mechanical polishing (CMP) method is disclosed in which a torque-based end-point algorithm is used to determine when polishing should be stopped. The end-point algorithm is applicable to situations where a ceria (CeO2) based CMP slurry is used for further polishing, pre-patterned and pre-polished workpieces (e.g., semiconductor wafers) which have a high friction over-layer (e.g., HDP-oxide) and a comparatively, lower friction and underlying layer of sacrificial pads (e.g., silicon nitride pads). A mass production wise, reliable and consistent signature point in the friction versus time waveform of a torque-representing signal is found and used to trigger an empirically specified duration of overpolish. A database may be used to define the overpolish time as a function of one or more relevant parameters.
    Type: Grant
    Filed: May 21, 2004
    Date of Patent: May 9, 2006
    Assignee: Mosel Vitelic, Inc.
    Inventors: Wee-chen Richard Gan, Karen Wong, Kuo-Chun Wu
  • Patent number: 7040960
    Abstract: The present invention relates to a method of cutting a bioactive glass object which comprises contacting the bioactive glass object with bioactive glass particles delivered using an air abrasion system.
    Type: Grant
    Filed: March 28, 2002
    Date of Patent: May 9, 2006
    Assignees: King's College London, Imperial College Innovations Limited
    Inventors: Larry L. Hench, Ian D. Thompson, Richard J. Cook, Timothy F. Watson, Paul D. Robinson
  • Patent number: 7042864
    Abstract: Methods and apparatus for enabling a Mobile Node supporting mobile IP to roam without an assigned IP address and receive lookups indicating that a Corresponding Node wants to send information to the Mobile Node are disclosed. A name lookup may be sent from a Corresponding Node to a Home Agent that has previously registered the Mobile Node. The name lookup may be sent through an intermediate device, including a Domain Name Server, such that the intermediate device contacts the Home Agent. During the name lookup process, an IP address is allocated to the Mobile Node and a data path is established between the Home Agent and the Mobile Node via a Foreign Agent. When the lookup is completed successfully, the Home Agent sends the IP address allocated to the Mobile Node in the name lookup process to the device requesting the lookup. The IP address of the Mobile Node may then be used by the Corresponding Node to “push” information to the Mobile Node.
    Type: Grant
    Filed: August 1, 2000
    Date of Patent: May 9, 2006
    Assignee: Cisco Technology, Inc.
    Inventors: Kent K. Leung, Gopal K. Dommety
  • Patent number: 7040007
    Abstract: A crimping tool is provided for connecting a modular plug connector with a telephone/data cable, and an axial connector with a coaxial cable, including a pair of operating arms pivotally connected intermediate their ends to define on opposite sides of the pivot axis a pair of operating end portions and a pair of crimping end portions, respectively, a pair of crimping dies being connected between the crimping end portions and containing first recesses for defining a first crimping chamber adjacent the end extremities of the crimping end portions, the adjacent surfaces of the crimping dies containing opposed second recesses cooperating to define a second crimping chamber arranged between the first crimping chamber and the pivot axis of the operating arms.
    Type: Grant
    Filed: April 8, 2003
    Date of Patent: May 9, 2006
    Assignee: Connectool Inc.
    Inventors: Leslie B. Shutts, Yin Ho Cheng, Huang De Sei
  • Patent number: 7037184
    Abstract: A polishing pad for use in chemical mechanical polishing of substrates that being made of a porous structure comprising a matrix consisting of fibers, such as cotton linter cellulose bound with a thermoset resin, such as phenolic resin. The polishing pad surface has voids in which polishing slurry flows during chemical mechanical polishing of substrates, and in which debris formed during the chemical-mechanical polishing of substrates is temporarily stored for subsequent rinsing away. The polishing surface of the pad is ground to form asperities that aid in slurry transport and polishing, as well as opening the porous structure of the pad. The porous pad contains nanometer-sized filler-particles that reinforce the structure, imparting an increased resistance to wear as compared to prior-art pads. Also disclosed is a method of making the polishing pad.
    Type: Grant
    Filed: January 22, 2003
    Date of Patent: May 2, 2006
    Assignee: Raytech Innovation Solutions, LLC
    Inventors: Angela Petroski, Richard D. Cooper, Paul Fathauer, Marc Andrew Yesnik
  • Patent number: 7039693
    Abstract: Validation of a re-initialized CTC connection between a first channel and a second channel is provided in a computing environment in which a CTC CU function can be provided in either channel after initialization of the CTC connection and can move from one channel to the other after re-initialization of the connection. After initialization, a newly formatted CDR having a device NED and a specific NEQ is stored. After re-initialization, a current CDR with the same format is obtained. The re-initialized CTC connection is validated if the stored set of NED and NEQ values match the current values, in any order.
    Type: Grant
    Filed: September 16, 2002
    Date of Patent: May 2, 2006
    Assignee: International Business Machines Corporation
    Inventors: Patricia G. Driever, John R. Flanagan, Kenneth M. Trowell, Harry M. Yudenfriend
  • Patent number: 7039690
    Abstract: A system and method for accessing registers of a PHY device in a network including an extended protocol software layer between the protocol and application layers, on the one hand, and the MAC driver, on the other hand. The extended protocol layer generates the PHY device register read and write commands and embeds them within standardized Ethernet data packets. The extended PHY device is adapted to distinguish these register read and write command packets from normal data packets and intercept and parse them to retrieve the commands. Likewise, the extended PHY device embeds the read and write acknowledgments in standardized Ethernet data packets that the extended protocol layer, in turn, can distinguish from normal Ethernet data packets and intercept and parse them to retrieve the acknowledgments.
    Type: Grant
    Filed: August 1, 2001
    Date of Patent: May 2, 2006
    Assignee: Lucent Technologies Inc.
    Inventors: William R. Bullman, Ryan S. Holmqvist, Steven E. Strauss
  • Patent number: 7036198
    Abstract: A method of assembling a piezoelectric actuator arrangement comprises providing a piezoelectric element having first and second ends and arranging the piezoelectric element within a sleeve member such that the inner surface of the sleeve member defines, together with the outer surface of the piezoelectric element, a chamber for receiving a first filler material. The first filler material is injected into the chamber and a heating effect is applied to the sleeve member such that the sleeve member deforms to seal against the first filler material.
    Type: Grant
    Filed: January 29, 2002
    Date of Patent: May 2, 2006
    Assignee: Delphi Technologies, Inc.
    Inventors: Martin Paul Hardy, Andrew John Hargreaves, Michael Peter Cooke
  • Patent number: 7039682
    Abstract: The present invention relates to a method and system for providing reconfiguration of network elements after a failure of such an element. A method for managing network configuration data, i.e., usable for automatic reconfiguration of server computers (16A,16B), is disclosed in which location and current status information about a client or controller computer (14A . . . 14C) is sent out such that a respective server type computer (16A,16B) may receive it and automatically reconfigure itself after temporary disruption.
    Type: Grant
    Filed: December 12, 2001
    Date of Patent: May 2, 2006
    Assignee: International Business Machines Corporation
    Inventors: Friedemann Baitinger, Kurt Heinrich Naegele, Karlo Petri, Frank Scholz
  • Patent number: 7036224
    Abstract: A fluid sensor probe such as a temperature probe uses heat shrink tubing to seal and provide strain relief at a proximal end of the probe. The heat shrink tubing uses a layer of hot melt adhesive along its inside surface to form a strong bond and hermetic seal. The heat shrink tubing is applied as an inner tubing around circuit wires extending into the probe and as an outer tubing around the inner tubing and around the proximal end of the probe housing. Together the inner tubing and the outer tubing can hermetically seal a substantial gap between the probe housing and the circuit wires. In a fast response probe, prior to closing the distal end of the probe housing with an end wall, openings are punched in a side wall of the probe housing against a mandrel. The openings permit fluid flow to contact the sensing element within the probe housing. Heat shrink tubing can be used to seal the circuit wires and prevent leakage.
    Type: Grant
    Filed: May 12, 2003
    Date of Patent: May 2, 2006
    Assignee: Mamac Systems, Inc.
    Inventor: S. Asim Gul
  • Patent number: 7037180
    Abstract: An inline-ready method of finishing the surface of a long material (W) capable of preventing any environmental problem from occurring and the mechanical properties of the long material from deteriorating, comprising the steps of holding the long material (W) by two or more elastic endless belts (1) with a specified force, rotating the elastic endless belts (1) in the same direction as or in the reverse direction to the moving direction of the long material by moving the long material (W) and increasing or decreasing the rotating speed of the elastic endless belts (1) more than or less than the moving speed of the long material, and loading powder and granular grinding material (S) between the elastic endless belts (1), characterized in that the grinding material (S) is moved relative to the long material (W) to rub the grinding material (S) against the long material (W) so as to finish the surface of the long material (W).
    Type: Grant
    Filed: March 16, 2005
    Date of Patent: May 2, 2006
    Assignee: Sintokogio, Ltd.
    Inventors: Mitsugi Umemura, Takayuki Nakada
  • Patent number: 7033262
    Abstract: An abrasive substrate is removably provided between a head portion and an abrasive member in a carry type abrasive machine. The abrasive substrate is constituted by a single synthetic resin molded member formed of the same material, and a hardness in a peripheral portion is set to be lower than that in a central portion excluding the peripheral edge portion. A difference in the hardness between the central portion and the peripheral portion is regulated by a concavo-convex surface formed on a surface at the fixing side to the head portion of the carry type abrasive machine. It is desirable that the concavo-convex surface should be constituted by a plurality of rib-shaped projections formed on the same plane. The abrasive substrate of the carry type abrasive machine can be manufactured inexpensively and can carry out a reliable and stable abrasion work.
    Type: Grant
    Filed: September 22, 2003
    Date of Patent: April 25, 2006
    Assignee: YKK Corporation
    Inventors: Toshiaki Takizawa, Yoshinobu Takahashi
  • Patent number: 7032292
    Abstract: A high Q on-chip inductor includes a primary winding and an auxiliary winding that is coupled to receive a proportionally opposite representation of an input of the primary winding. Further, the auxiliary winding has an admittance that is greater than the admittance of the primary winding thereby yielding an asymmetry in the admittances. As such, a push/pull mechanism is obtained in a 2-port system (e.g., 1st and 2nd nodes of the primary winding) that produces a large Q factor for an on-chip inductor.
    Type: Grant
    Filed: March 24, 2003
    Date of Patent: April 25, 2006
    Assignee: Broadcom Corporation
    Inventors: Sissy Kyriazidou, Harry Contopanagos, Reza Rofougaran
  • Patent number: 7028377
    Abstract: A method of producing an ink jet recording head, which includes (1) fixing a passage unit in which a nozzle pate having a nozzle opening, a spacer forming a common ink chamber, and an elastic plate having a thick portion abutting against an end of a piezoelectric vibrating element are stacked, to an opening of a frame having an overhang portion which overhangs to a vicinity of the thick portion, (2) inserting a vibrating element unit into the frame, the vibrating element unit being configured by fixing piezoelectric vibrating elements operating in a longitudinal vibration mode to a fixing substrate, and (3) injecting an adhesive into a groove formed in a region opposing the fixing substrate of the frame.
    Type: Grant
    Filed: April 30, 2003
    Date of Patent: April 18, 2006
    Assignee: Seiko Epson Corporation
    Inventors: Shinji Yasukawa, Minoru Usui, Takahiro Naka, Tsuyoshi Kitahara, Noriaki Okazawa, Hideaki Sonehara
  • Patent number: 7032228
    Abstract: A common device interface for facilitating communication exchanges between physical transport drivers and higher-level software emulations. The common device interface is defined by an input/output control block (IOCB) data structure that allows those portions of different emulations and physical transport drivers that interact with each other to be generic. Thus, the emulation need not know or be concerned with the underlying characteristics of the type of physical transport driver with which it is communicating.
    Type: Grant
    Filed: March 1, 2001
    Date of Patent: April 18, 2006
    Assignee: EMC Corporation
    Inventors: James M. McGillis, Robert DeCrescenzo, Timothy R. Rosner, John Carrel, David Meiri
  • Patent number: 7032230
    Abstract: Virtual function calls in hybrid compiled and interpreted computer programming environments are carried out efficiently by dual virtual function tables. Each class object generated is provided with a compiled virtual function table and an interpreted virtual function table. Each table is symmetrically structured and contiguous with the class object. Calls from an interpreted function access the interpreted virtual function table. Entries in that table point to function data structures which provide for the interpretation of the called function, or for transfer to execution of a compiled version of the called function. Calls from a compiled function access the compiled virtual function table. Entries in the compiled virtual function table point to either executable code representing the called function, or to transition code for transition to the interpreter to interpret the called function.
    Type: Grant
    Filed: August 27, 2001
    Date of Patent: April 18, 2006
    Assignee: International Business Machines Corporation
    Inventors: Trent Gray-Donald, Graeme Johnson, Kevin A. Stoodley, Julian Z. L. Wang
  • Patent number: 7028387
    Abstract: A method of producing a miniaturized set of inductive coils set mutually orthogonally inside a tube. In the method a positional template made of a sheet of substantially rigid material that defines a set of guide apertures, each of which is in the shape of one of the set of inductive coils. The guide apertures are disposed so that when an inductive coil is fitted into each one of the guide apertures the coils will be substantially orthogonal to one another.
    Type: Grant
    Filed: March 26, 2003
    Date of Patent: April 18, 2006
    Assignee: Advanced Neuromodulation Systems, Inc.
    Inventors: Ky Huynh, Jerome J. Boogaard
  • Patent number: 7032224
    Abstract: A method for transferring messages across a communication network is disclosed. A message being received at a message source from a sending application program is segmented into message segments. While this segmentation is occurring, a common message identifier and a unique sequence number are assigned to each message segment. The message segments are transferred from the message source to a message destination, with at least one of the message segments being transferred as the message is being received at the message source. Prior to the entire message being received at the message source and segmented, message segments that have already been segmented from the message are transferred to the message destination. At the message destination, the message segments are received and assembled into a reassembled message A portion of the reassembled message is delivered to a receiving application while the assembling is occurring.
    Type: Grant
    Filed: December 31, 2001
    Date of Patent: April 18, 2006
    Assignee: Slam Dunk Networks, Inc.
    Inventors: Viral Kadakia, Ramakrishna Chinta, Randy Menna