Abstract: The method for forming a carbon resistance in a printed wiring board comprises, in a method for forming a carbon resistance in the circuit of a printed wiring board,a process of depositing a thermoset carbon resistance layer coated on a laminated film on the surface of the circuit, a process of thermosetting the carbon resistance layer along the disposal position necessary for the circuit, and a process of removing the uncured layer of the carbon resistance layer from the circuit surface after the thermosetting process.

Abstract: The method for forming a carbon resistance in a printed wiring board is characterized in that, in a method for forming a carbon resistance in the circuit of a printed wiring board, a carbon resistance to be disposed in the circuit which is formed in a laminated film is previously deposited on and correspondingly to the surface of said circuit, and the protective film of the carbon resistance of the laminated film is removed.

Abstract: A predetermined conductor pattern is formed on a sacrificial substrate. The substrate and conductors are covered with an elastomeric material, which is generally an uncured liquid. The elastomer is cured to form a solid. Then the sacrificial substrate is dissolved away leaving the conductor pattern embedded in the elastomeric material.

Abstract: Conductive surfaces such as copper and/or tungsten surfaces, particularly copper circuitry areas of printed circuit board substrates or fused tungsten circuitry areas of fused tungsten-ceramic packages, are activated for receipt of electroless nickel plating thereon by providing the surfaces with particulate zinc metal, particularly by contact of the surfaces with an aqueous suspension of particulate zinc metal.

Abstract: A stripping method is provided to remove processed photoresist images from printed circuit substrates without damage to underlying high density circuitry. A solid particulate blast process is used to remove the resist images wherein the polymeric particles having a Mho hardness in the range from 2.0 to 4.0 are used as the blast media.

Abstract: A method for producing extremely smooth metal coatings on zincated aluminum substrates using a special double zincating procedure and/or a specially formulated electroless metal plating bath employing a unique plating process.

Abstract: Methods of improving the thickness and characteristics of galvanizing processes are disclosed. Several methods are disclosed which promote growth of the .zeta. layer in a double dipping galvanizing process. In one process a metal article is dipped in a molten-zinc bath at 430.degree.-480.degree. C. The article is then air-cooled or semi-air-cooled before it is dipped in a molten zinc bath containing no less than 0.1% aluminum at 390.degree.-460.degree. C. In another method, after molten-zinc-plating a metal article at 480.degree.-500.degree. C., the article is plated in a molten zinc bath containing no less than 0.1% of aluminum at 390.degree.-460.degree. C. In a third method, the surface of a metal article is blasted to form a surface having a roughness of at least 20 .mu.m before plating the article in a molten-zinc bath at 430.degree.-480.degree. C. The article is then plated in a molten zinc bath containing no less than 0.1% of aluminum at 390.degree.-450.degree. C.

Abstract: A method for producing an oxygen detection element having uniform pores and an excellent durability against toxic matter contained in the measurement gas. The method includes a first step of applying a paste to be sintered to form a catalytic electrode layer onto at least a part of an oxygen-ion conductive solid-state electrolytic body, and sintering the paste to thereby form said catalytic electrode layer at a predetermined position on said surface of said solid-state electrolytic body after sintering, and a second step of forming an electrode protection layer for coating and protecting at least a part of the catalytic electrode layer either after or simultaneous with the first step. In a first embodiment, the paste contains mainly a noble metal powder acting as a catalyst and an organic metal compound, in a second embodiment mainly co-precipitated powder consisting of a noble metal and a metal hydroxide, and in a third embodiment mainly noble metal powder and a powder of a metal other than a noble metal.

Abstract: Certain organic polymeric materials are capable of reversibly accepting or donating electrons from a reducing entity. The redox sites in the polymer accept electrons and, as a result, a change in the properties of the polymer occurs. This change is useful in modifying or etching the polymeric material. The material can be modified by incorporation of metallic seeds into the material at a controlled depth. The seeds are incorporated by interaction of cations of the metals with the redox sites in the polymer, which cause the reduction of the cations to form the neutral metallic seeds. Subsequent exposure of the polymeric material containing the seeds to an electroless bath causes further deposition of metal having the desirable characteristic of good adhesion to the polymeric material. Etching of the polymeric material can be carried out as a result of an increase in solubility of the polymer in aprotic solvents when its redox sites have accepted electrons.

Abstract: Titanium and titanium alloy substrates are provided with a dense coating of a titanium silicide. The titanium silicide coating substantially increases the oxidation resistance of the substrate. The siliciding method includes the steps of: Forming a substantially molten pool of a siliciding alloy; contacting the substrate with the siliciding alloy; maintaining the substrate in contact with the siliciding alloy at a temperature at or above a minimum predetermined temperature to form a titanium silicide coating on the substrate; and separating the coated substrate from the siliciding alloy. The siliciding alloy includes a minimum effective concentration of silicon and a lithium metal flux.

Abstract: A technique of providing numerous distinct conductive patterns on a piezoelectric substrate is accomplished using only two masking apparatus. One masking apparatus defines a common portion or structure for each of the patterns. The second masking apparatus defines numerous distinct patterns, each corresponding to a different alignment position with respect to the common structure already formed on the substrate. One application for this technique is in economic production of coded SAW devices which may serve as coding or decoding devices, filters, or correlators, each of the SAW devices having a different individual code.

Abstract: The present invention provides a process for producing a metal-polyimide composite material such as a wiring board. In production thereof, deterioration of polyamide film due to oxidation during imidization of a polyimide precursor in contact with metal such as copper or silver can be prevented. The present invention is characterized by using a polyimide precursor having an acidic functional group which is masked. Examples of the polyamide precursor are polyamic acid epoxy adducts, amido polyamic acids, silylated polyamic acids, etc.

Abstract: An arrangement for solder-coating respective end portions of elongated components in a molten solder bath includes a fixture to be loaded with the components. This fixture includes at least one supporting wall that is capable of maintaining the fixture afloat in a predetermined position on an upper surface of the molten solder bath even when the fixture is fully loaded. The supporting wall has at least one opening through which one of the end portions of a respective component passes into the molten solder bath to a depth necessary for the molten solder to coat the respective end portion to the desired extent when the fixture floats in its predetermined position on the molten solder bath.

Abstract: Solder reflow on an electrical interconnect substrate between a plurality of electrical contacts. The method includes coating the contacts with tin/lead solder, depositing a wetting metal between the contacts, and heating the substrate to at least the melting point of the solder so that the solder melts, reflows across the wetting metal and connects or links the contacts. The entire surface of a customizable copper/polyimide substrate can be personalized by solder links and TAB leads from surface-mounted integrated circuits can simultaneously be soldered to the substrate.

Abstract: A probe for use in a coax-to-waveguide transition is uniformly coated with a dielectric material by inserting the probe through an elastic membrane covering a container of uncured RTV elastomer to thereby dip the probe. The membrane wipes excess elastomer from the probe during withdrawal, and seals the RTV from ambient air to thereby prevent its premature curing in the container. If moved sideways before withdrawal, the coating thickness can be made to favor one side over another. A magnetic block is fitted into a waveguide. A slot in the magnetic block is also filled with uncured RTV elastomer. The probe is inserted into the slot, embedding it in the uncured RTV. Upon curing, the probe is protected from high voltage arcing to the waveguide. A cured RTV elastomer washer is preassembled to the probe before dipping, to precisely fill the void between the connector base and the magnetic block with a like material.

Abstract: The present invention provides a process for producing a metal/polyimide composite article such as high-density wiring boards. This metal/polyimide composite article is produced by a method which comprises coating a polyamic acid alkyl ester represented by the following formula on a metallic film and curing it: ##STR1## wherein R.sub.1 and R.sub.2 which may be identical or different each represents an organic group of 1 or more carbon atoms.

Abstract: A method of metallizing an oxide ceramic with excellent hermetic sealing and brazing properties, comprising the steps of applying to a sintered oxide ceramic a first paste prepared by mixing with an organic vehicle a powder mixture composed of 70 to 95 wt % of a wolfram powder having an average particle diameter of 10 .mu.m or less and 30 to 5 wt % of a glass powder having an average particle diameter of 10 .mu.m or less and a melting point of from 1100.degree. to 1300.degree. C.; drying the first paste-applied ceramic to form a primary coating on the ceramic; applying to the primary coating a second paste prepared by mixing with an organic vehicle one or more powders selected from the group consisting of nickel, nickel oxide, and nickel salt powders; drying the second paste-applied ceramic to form a final coating on the primary coating; and firing the ceramic having the primary and the final coatings thereon at a temperature of from 1200.degree. to 1400.degree. C. in an atmosphere having a H.sub.2 /H.sub.

Abstract: A method is provided for forming a thick-film circuit having at least one thick-film resistor element upon a substrate and laser scribing the substrate to remove the circuit from the remaining portion of the substrate. A thick-film circuit comprising conductor lines and at least one resistor element is first printed upon a substrate. Thereafter, the resistor element may be laser trimmed to increase the resistance value thereof. After laser trimming, a protective material such as ethyl cellulose is coated onto the outer surface of the resistor element to protect it from hot-slag ceramic material generated during a laser scribing operation. The substrate is then topside laser scribed to separate the thick-film circuit from the remaining portion of the substrate. Following laser scribing, the protective material is removed by washing the resistor element with a solvent.

Abstract: A fabrication method for applying electrically conductive circuit traces to a substrate is described. The method uses an ink composition which is applied to a selected substrate by an ink delivery system. The ink includes an adhesive in combination with other additives, including one or more sovlents. The ink is delivered by the ink jet system in a selected pattern, followed by the application of a powdered metal to the pattern which adheres to the adhesive in the ink. After the removal of excess powder, the substrate, pattern and powder are heated in an amount sufficient to melt the powder on the substrate. This produces a pattern of conductive traces geometrically corresponding to the ink pattern initially applied to the substrate.

Abstract: The thickness and rate of growth of a deposited film is monitored using a piezoelectric crystal sensor such as an AT-cut plano-convex crystal. The frequencies of the fundamental frequency and another resonance mode are measured prior to deposition, and the change of these two frequencies is monitored during deposition. The areal mass density of the deposited material is determined from these two resonance frequencies for the uncoated quartz crystal and for the crystal during deposition. A frequency generator provides accurate sweeps of frequency which are applied to the crystal, and the crystal response is supplied to a phase detector to identify the positions of the resonance frequencies. The acoustic impedance ratio Z of the deposited material relative to the fresh crystal is computed from the resonance frequencies for the coated and uncoated crystal, by applying the modal equations for AT-cut plano-convex quartz crystal and Lu-Lewis relation.