Abstract: A method and apparatus for depositing solder on the terminal pads of printed circuit boards in which a solder resist layer or layers having a thickness corresponding to the desired solder height border the pads. Molten solder from a reservoir is directed by nozzles against the sides of the board to fill the cavities extending above the terminal pads while the board is moving via a conveyor mechanism relative to the reservoir. The cavities when filled with molten solder are covered by a suitable element such as a flexible belt or roller. The molten solder within the covered cavities is then cooled below its solidification point and the covering element removed. If desired, part or all of the solder resist layer or layers may then be stripped from the board to leave solder pads extending above the surface of the board.

Abstract: A method of applying a conformal coating to a printed circuit board and components attached thereto while leaving selected components attached thereto uncoated, comprises the steps of providing a printed circuit board having a multiplicity of components attached thereto, including selected components that are not to be coated; enclosing the selected components within conductive protective enclosures sized to enclose the selected components therein and thereby protect those components from the intrusion of conformal coating material, the enclosures having sufficient electrical conductivity to discharge electrostatic charges therefrom when one of the enclosures is contacted by an electrically conductive medium, thereby protecting the components attached to the printed circuit board from damage due to the discharge of electrostatic charges from the enclosures; applying a conformal coating to the printed circuit board, thereby conformal coating the enclosures and the components which are not protected by the encl

Abstract: An apparatus for a chemical vapor deposition in which at least one substrate which has partially an insulating film on the surface thereof is disposed in a pressure reduced reaction chamber, the reaction chamber is provided with a nozzle for feeding a reactive gas into the reaction chamber, and a light source is provided for emitting a light beam to heat the substrate. The combination of substrate heating source using infrared rays and a laminarized jet of reactive gas is utilized for maintaining the selectivity, facilitating the thin film forming reaction, and improving the high reproducibility and controllability.

Abstract: Certain organic polymeric materials are capable of reversibly accepting or donating electrons from a reducing entity. The redox sites in the polymer accept electrons and, as a result, a change in the properties of the polymer occurs. This change is useful in modifying or etching the polymeric material The material can be modified by incorporation of metallic seeds into the material at a controlled depth. The seeds are incorporated by interaction of cations of the metals with the redox sites in the polymer, which cause the reduction of the cations to form the neutral metallic seeds. Subsequent exposure of the polymeric material containing the seeds to an electroless bath causes further deposition of metal having the desirable characteristic of good adhesion to the polymeric material. Etching of the polymeric material can be carried out as a result of an increase in solubility of the polymer in aprotic solvents when its redox sites have accepted electrons.

Abstract: In a method of manufacturing printed circuit boards by coating a flux preventive film for preventing a flux from rising on a component surface of an insulation board, the method of manufacturing printed circuit boards according to the present invention is characterized in that said method comprises the steps of printing white blank marks, white blank symbols and white blank letters corresponding to symbol marks, other symbols and letters on the component side surface of said insulation board before coating said flux preventive film, and then coating said flux preventive film of a transparent or translucent material on the printed surface.

Abstract: A flexible circuit 10 panel is coated with solder by lowering into a bath of molten solder 4. On removal from the bath excess solder is blown from the panel by air jets from one or more nozzles 22. The panel is pulled towards the nozzle by a region 60 of negative pressure associated with the nozzles, and is held close to the nozzles to obtain an even coating of solder.

Abstract: Diamond films are formed by chemical vapor reation. Nitrogen or halogen compound gas is inputted to the reaction chamber together with a reactive gas of hydrocarbon. The resistivity, transparency and hardness of the deposited films can be controlled by adjusting the introduction rate of the halogen or nitrogen.

Abstract: A method of producing a thin film magnetic head comprises forming a thin film magnetic circuit including a magnetic film and a conductive coil film on a substrate, and heating the thin film magnetic circuit at a temperature in a range of from 270.degree. C. to 400.degree. C. before forming a protective layer covering the thin film magnetic circuit.

Abstract: A method of forming an insulating layer on a printed circuit board for use in a manufacture of the printed circuit board is disclosed. The method comprises steps of providing a base material plate for the printed circuit board, forming a circuit pattern on the base material plate, providing an insulating layer on the circuit pattern, providing a conducting circuit on the insulating layer, and forming the insulating layer by a dry film.

Abstract: A method for forming a carbide coating of Group IVA, VA and VIA transition metals and their alloys. The metal to be coated is heated in a bath of molten alkali or alkaline earth metal containing carbon. There is also provided a method for preparing a metal surface for carburization by heating the metal in a nitrogen-containing atmosphere.

Abstract: A method of simultaneously producing a plurality of thermal heads having a ridge-shaped glaze structure uses first and second glass pastes, the second glass paste having a higher softening temperature than the first glass paste. The first glass paste is printed on a substrate in a pattern having a plurality of adjacent slit-shaped openings in parallel. Next, the second glass paste is printed in a pattern having independent bands which cover the openings. The first and second glass pastes are melted and hardened simultaneously by heat treatment so as to form the ridge-shaped glaze structure. A plurality of isolated individual resistors are formed linearly along the crest of the ridge-shaped glaze structure, and a plurality of isolated individual traces are formed which connect at one end to each of the resistors. Lastly, the substrate is divided along separation lines into a plurality of thermal heads having a ridge-shaped glaze structure.

Abstract: A coating of resin and photoactive functionality is autodeposited from an emulsion onto a metallic substrate in order to selectively protect the substrate from corrosive environments such as etchant processes. An acid and oxidizing agent are included in the emulsion so that when the substrate is immersed in the emulsion the resin and photoactive functionality autodeposits. The resulting coating can be exposed to actinic radiation in an image-wise fashion and developed in an alkaline solution to develop the image created. In instances where the emulsion and process are used to make circuit boards, the metallic surface uncovered during developing is then etched away, leaving only the coated sections of the surface. The resulting coated surfaces will be the circuit traces of the circuit board.

Abstract: A method for controlling the mass of solder applied to a printed circuit substrate (202) by a solder printer (200), whereby the mass of solder paste (114) applied to a printed circuit substrate (202) is controlled by measuring the mass of the solder paste (114) that was applied to a first printed circuit substrate. The mass data measured is then compared to a predetermined mass to produce a control signal. The mass of the solder applied to a second printed circuit substrate is controlled as a function of the control signal so that the mass of the solder applied to the second substrate more closely approaches the predetermined mass.

Abstract: A composite film consisting of particles of fibers dispersed in a metal matrix and formed by electroless deposition can be improved in appearance and particle or fiber content by adding a water-soluble amine or ammonium salt to the electroless plating bath. Preferably the bath contains a water-soluble nickel or cobalt salt, a hypophosphite reducing agent, a chelating agent for chelating the nickel or cobalt ion, a surface active agent, water-insoluble particles or fibers typically of polytetrafluoroethylene, and the water-soluble amine or ammonium salt.

Abstract: This invention relates to a novel electroless plating method which requires no pre-treatment step for the surface-corrosion on the surface to be plated, wherein a metal layer is formed by applying, onto the surface to be plated, a solution of a composition consisting of a styrene type elastomer used generally as a component for the hot melt type adhesive agent, or the styrene type elastomer and a stickiness imparting resin of a molecular structure similar to that of the elastomer; drying the solution as applied; and effecting the electroless plating on the coated film thus obtained, the method being able to substitute the conventional electroless plating as an advance step of the electrolytic plating for synthetic resin. The particular object of the present invention is to utilize the method in the field of the electroless plating for the purpose of preventing the plating operation from the electromagnetic wave disturbances.

Abstract: Disclosed is a method of forming a high performance, electrochemical components. The plate is manufactured by forming a first electrode material on a substrate. Next, a thin electrolyte or interconnector coating is deposited on the electrode material. In the final step, a second electrode material is deposited on the electrolyte or interconnector, and the complete structure is removed from the substrate. The electrolyte/electrodes plates and interconnector plates formed by the method of this invention may be used in the manufacture of electrochemical converters.

Abstract: A process for metal plating a resin molded article molded from a resin composition containing as main components, a polyphenylene sulfide resin and a glass-reinforcing agent, which comprises, before the metal plating,(1) treating the resin molded article by immersion in a mixed liquid of nitric acid and a fluoride salt or in a mixed liquid of nitric acid and hydrofluoric acid (A treatment), thentreating the resulting resin molded article by immersion in an organic polar solvent-containing liquid (B treatment), and further, if necessary,treating the resulting resin molded article by immersion in an aqueous floride salt or hydrofluoric acid solution (C treatment).

Abstract: The adhesion of metal coatings deposited by electroless deposition on polycarbonate-addition polymer substrates, especially polycarbonate-ABS substrates, containing up to about 85% (by weight) polycarbonate is improved by first contacting the substrate with an alkali metal hydroxide solution for about 1-2 minutes, followed by an alkaline permanganate solution and a reducing agent to remove any manganese residue.

Abstract: The disclosure relates to a method of forming a multilayer interconnection structure. The structure is a laminated body having a first conductive layer, a first insulating layer, a second conductive layer and a second insulating layer in an ascending order. In the method, firstly, a through-hole is formed on the laminated body so as to expose a surface of the first conductive layer and two opposed surfaces of the second conductive layer. Then, the two opposed surfaces of the second conductive layer is masked with a masking film, so as not to deposit thereon a metal which has a strong and selective adhesion on the first and second conductive layers. Then, the metal is deposited on the surface of the first conductive layer by a chemical vapor deposition method so as to fill a lower portion of the through-hole with the metal. Then, the masking film is removed so as to expose the two opposed surfaces of the second conductive layer.

Abstract: A method of treating a reinforcement at least the surface of which is metallic in such a manner as to favor its adherence to a rubber-base composition, characterized by the fact that the surface of this reinforcement is placed in contact with a solution of at least one cobalt and/or nickel compound in at least one organic compound containing one or more hydroxyl groups at a temperature of more than 100.degree. C. before placing the reinforcement in contact with the composition.