Abstract: Substrates are activated for subsequent metallization by contacting the substrate with a electrolyte in which reducing agents which are electrochemically generated in the electrolyte. The reducing agents are sorbed by the substrate which is contacted with a seeding medium to dispose on the substrate seed, preferably palladium seed for subsequent electroless and electrolytic metallization.

Abstract: A single screen printer (200) holds at least two solder stencils (225). The screen printer (200) receives a printed circuit board (105) and determines a printed circuit board configuration. When the printed circuit board (105) is of a first configuration, the printed circuit board (105) is aligned with a first stencil (225) and solder paste is selectively applied to the printed circuit board (105) through the first stencil (225). When the printed circuit board (105) is of a second configuration, the printed circuit board is aligned with a second stencil (225) through which solder paste is selectively applied to the printed circuit board (105).

Abstract: The present invention reduces weak points in the insulation films of electro-luminescence (EL) panels by constructing, at least the lower part of the insulating film, as a coated film comprising an insulator in film form created by coating a fluidic material in an EL indicating panel which includes a light emitting film disposed between a lower electrode film and an upper electrode film, and insulation films disposed in a way that will make contact with the light emitting film; and further by forming the contours of the light emitting film parts larger than the area in which the lower and upper electrode films intersect with each other in an EL indicating panel in which the light emitting film is divided into many light emitting film parts.

Abstract: The present invention relates to a solution for catalytic treatment, which is effective for applying a catalyst-metal onto the surface of a substrate, which can provide a film having excellent properties such as adhesion, precision and selectivity through electroless plating or the like, and which does not cause a premature and undesirable decomposition in a bath. The solution for catalytic treatment comprises a catalyst-metal in the form of ions, which permits the deposition of the metal serving as a catalyst on a substrate by applying the solution onto the surface of the substrate and then irradiating the substrate with light rays. The present invention also relates to a method of applying a catalyst onto a substrate and a method of forming an electrical conductor in which such a solution for catalytic treatment is employed.

Abstract: A process for CVD including plasma enhanced and laser induced CVD using one or more precursor film forming metal compounds as the major film forming metal precursor, for example organotungsten, which is admixed with minor amounts of a precursor catalytic metal compound, for example, an organoplatinum compound, as a precursor to a catalytic metal in the presence of hydrogen gas to provide improved purity of deposited metal films having residual amounts of the catalytic metal incorporated therein.

Abstract: The method serves for the electroless deposition of a metal layer (7) from a metallization liquid on a top side of a flat article to be metallized, more in particular a flat disc, for example, a master disc (1) which is used for the reproduction of optical discs. According to the method the top side of the article is first made hydrophilic, if so necessary, after which, with the article supported in a horizontal position, a quantity of metallization liquid is provided on the top side which was previously made hydrophilic as a stable liquid layer (16) bounded by the edges of the article, after which the deposition of the metal from the liquid on the article takes place and the liquid layer is the removed entirely from the surface.

Abstract: A process for simultaneously selectively depositing a high purity nickel containing alloy (i.e. a nickel-boron alloy having a nickel content in excess of 99.5 percent) over a preformed metallurgy pattern (including the individual, electrically isolated contact pads and the seal band area thereon) on the top-side dielectric surface of a multi-layer ceramic module. The metallurgy pattern on such top-side surface of such module is appropriately catalyzed and then immersed in a bath which is essentially lead-free and which includes a source of nickel ions, a borane reducing agent, and an effective amount of an organic divalent sulfur compound, preferably thiodiglycollic acid.

Abstract: A method of manufacturing a simulated lead light in which simulated opaque lead canes are built up on a surface of a carrier, comprising the following steps:(1) applying lines of an opaque paint to the carrier surface, the lines corresponding to desired positions of the desired lead canes;(2) while the paint is still wet, applying transparent or translucent particulate material so that the particulate material adheres to the wet paint;(3) removing surplus unadhered particulate material.

Abstract: Conductive fibers of a combination of aramid and polyvinyl pyrrolidone (PVP) are disclosed having a strongly bonded metal coating applied by electroless plating. PVP increases adhesion of the fiber surface to the electroless plating. The preferred aramid is poly(p-phenylene terephthalamide).

Abstract: A color filter in accordance with the present invention comprises an activated film layer (2) arranged on a transparent substrate (1), said activated film layer (2) having a color pattern formed thereon by permeating a dye thereinto, and a thin metal film pattern (3) formed on a portion, of said activated film layer (2), which requires the formation of a black mask. Accordingly, the color filter integrated into various display devices such as a liquid crystal display is capable of displaying an image having a high contrast. Further, a method for forming a color filter in accordance with the present invention comprises the steps of forming an activated film layer (2) on a transparent substrate (1); permeating a dye into said activated film layer (2) to form a color pattern; and performing an electroless plating to form said thin metal film pattern (3) which functions as a black mask.

Abstract: Increases in surface resistivity of electroless nickel coatings on polycarbonate-containing substrates are inhibited by employing two electroless nickel plating solutions. The first solution is one which deposits a metal layer containing phosphorus, if any, in an amount up to 5% by weight and is used to deposit a layer at least 0.5 micron thick. The second solution is one which deposits a layer containing phosphorus in the amount of at least 5% and preferably at least 6% by weight. Another metal layer may be interposed between the two nickel layers.

Abstract: Metallic silver is deposited upon the surface of a nonconducting substrate using a multi-step wet deposition process. The surface is cleaned, and then activated in an aqueous solution containing stannous tin. The silver is deposited as a colloidal material from an aqueous solution of a silver-containing salt, a reduction agent that reduces the salt to form the metallic silver, and a deposition control agent that prevents the silver from nucleating throughout the solution. After the substrate is coated, the coating is stabilized in an aqueous solution of a salt of a metal from the platinum group or gold, dissolved in dilute hydrochloric acid. The process is particularly effective for depositing uniform films of 2 to 2000 Angstroms thickness, which strongly adhere to the substrate.

Abstract: A process for detecting any defect in a ceramic body, including the steps of forming an electrically conductive layer in any such defects including fine voids present in the ceramic body, and then detecting presence or absence of the defect by measuring electrical conductivity between two given points shorted by the electrically conductive layer. The electrically conductive layer may be formed by penetrating an electrically conductive liquid into the defect. Alternatively, the electrically conductive layer may be formed by penetrating a penetrable liquid capable of forming the electrically conductive layer by thermal treatment or chemical treatment and thermally or chemically treating same.

Abstract: Solder is deposited on a printed circuit board by melting the solder in a container. The container has a slot for passage of solder, therethrough and control means actuable to alternately allow and prevent passage of solder through the slot. The slot is placed in contact with a stencil and the control means is actuated to allow passage of solder through the slot. The stencil is moved relative to the container in a direction transverse of the slot to deposit solder on the printed circuit board via the stencil.

Abstract: Disclosed is a method of forming a silicon oxide film on a silicon wafer, comprises the steps of keeping a supersaturated hydrofluoric acid solution of silicon oxide on the surface of a silicon wafer in a thickness of not more than 20 mm, the solution having a predetermined temperature, heating the supersaturated solution until the solution reaches a thermal equilibrium, and maintaining for a predetermined period of time the temperature at which a thermal equilibrium is established in the supersaturated solution so as to form a silicon oxide film on the surface of the silicon wafer.

Abstract: An improved process is disclosed for treating aluminum for memory disk applications and for producing metal plated aluminum memory disks. It has been found that a solution prepared from methane sulfonic acid and sodium peroxydisulfate can be used as a direct replacement for a nitric acid bath in the processing of aluminum substrates for memory disk application. In accordance with the present invention, the methane sulfonic acid/sodium peroxydisulphate solution can be used to deoxidize the aluminum substrate prior to zinc deposition and also to remove the first zinc film in either alkaline or acid double zinc plating processes.

Abstract: In one embodiment, a method of forming a barrier layer for contacting a metal interconnect layer to one or more exposed N and P type silicon regions on a wafer. The wafer is heated with a direct radiation source, such as a lamp. To equalize the differing emissivities of the N type and P type silicon regions, an opaque layer of refractory metal is first formed on the regions at a temperature below approximately 100.degree. C. A refractory metal deposition process is then conducted at temperatures between 230.degree. C.-425.degree. C. During this higher temperature deposition process, the reducing gas is ramped up with time to increase the deposition rate of the refractory metal as the exothermic reducing reactions increasingly heat the contact areas.

Abstract: Diode lasers of the formula GaInP/InGaAsP on GaAs substrates which operate at powers up to 5.3 W with emitting apertures of 100 microns are disclosed. By varying compositions of the active layer and by employing strained layer quantum wells, InGaAsP diode lasers are fabricated over the wavelength range of 700 to 1100 nm.

Abstract: A water-soluble coating or other deposit is produced from a formulation that is comprised of a curable liquid substance and a dispersed, particulate effervescing agent. The formulation is particularly useful as a solder resist in the manufacture of PCBs, and the preferred composition contains n-vinyl-2-pyrrolidone, N,N-dimethylacrylamide, and polyvinylpyrrolidone.

Abstract: The present invention relates to a product containing a glass substrate and a transparent conductive layer made of sub-stoichiometric metallic oxide coated with a metallic oxide overlayer protecting the conductive layer from oxidation. The indices of refraction of the two layers and the geometric thickness of the overlayer may be selected so as to offer a product which has a neutral color under reflection. The invention also concerns processes for obtaining said product.