Abstract: A method of pre-treating steel-hybrid circuit board substrates or carrier plates before the application of coatings that are to be burnt in or fired. In prior art steel-hybrid circuit boards of this type, the burning-in of the coatings in a kiln produces undesirable warping of the circuit boards due to the different coefficients of thermal expansion of the materials employed for the coatings and for the carrier plates, unless relatively thick steel-hybrid circuit board carrier plates are employed. This warping is avoided, while still permitting the use of steel hybrid circuit boards of a lesser thickness, by pre-treating the steel-hybrid circuit board carrier plates to provide same with a mechanical pre-stress causing a defined curvature which compensates for the warping of the circuit board to be expected during burn-in.

Abstract: Process is described for applying large quantities of solder to small areas, such as the lands in a high density card, to which it is intended to surface mount electronic devices or directly attach circuitized chips. The land area is temporarily extended by depositing a relatively thin layer of metal beyond the perimeter of the land, wave soldering to deposit excess solder on the extended land region, and reflow, whereby the thin layer of metal dissolves into the solder, causing the solder to retract to the dimensions of the original land. Because the volume of solder is increased, the strength and reliability of the solder joint is greatly improved.

Abstract: A method and apparatus for the forming of a solder deposit on an SMD pad on a printed circuit or hybrid board. This formed solder deposit is in a defined three-dimensional well having the proper profile and a defined solder gap. The solder before forming can be solid solder or a solder paste. By the placement of a mesh on the surface of the circuit board with the solder in place on the pads, applying a slight positive pressure on a rigid or elastic surface on the other side of the mesh, and subjecting this system to a temperature just low enough to reflow the solder by means of a heat transfer fluid, then cooling the board to solidify the solder, a product results having the above properties. The duration of the application of heat and pressure is made so brief, that the laminate structure of the board and the coating thereon remain substantially unaffected. A circuit board with the solder so formed thereon.

Abstract: Two different colored fabric paints are placed in separate sections of a single container so that a two color stripe may be dispensed and applied to the fabric. One bottle has no partition between the paints. In three other elliptically-shaped bottles, a partition extends generally across the shorter dimensions of the container cross section. The partition is directly on the minor axis in one bottle, is angled with respect to the minor axis in a second, and has a Z-shape in a third.

Abstract: The method for manufacturing the printed wiring board having a shield layer of the present invention is characterized in that, in a method for manufacturing a printed wiring board wherein a printed wiring circuit is provided on one or both sides of an insulating board and a shield layer is provided on the printed wiring circuit through an insulating layer, a shield layer and an earth circuit are formed on the insulating layer while injecting under pressure a coating for shield from a filling nozzle through a mask.

Abstract: The invention relates to improvement in well drilling tools to prevent drilling fluids and solid particles present in a subterranean location from adhering to drilling equipment. A nickel-phosphorus coating is deposited by an electroless plating process on the entire surface of the tool, so as to substantially reduce porosity of the tool and prevent penetration of the foreign matter into the ferrous core of the tool.

Abstract: A process for protecting aluminum nitride circuit substrates during electroless plating using surface oxidation. The aluminum nitride substrate is coated with a metal stack. The coating on the substrate is etched to form a circuit pattern. The patterned substrate is then fired in an oxidizing atmosphere at a temperature and time sufficient to convert the exposed aluminum nitride to aluminum oxide. After this conversion, the substrate is plated in an electroless solution forming a microwave circuit ready for component attachment and packaging.

Abstract: In a preferred method, a zinc-rich alloy coating is applied to a substrate using an electrolysis deposition solution which contains a metal salt of zinc and a metal salt of nickel each in an amount sufficient to provide a weight ratio of zinc to nickel (Zn:Ni) of at least about 1:1; a phosphorus-containing reducing agent in an amount sufficient to cause reduction of the zinc and the nickel to ions thereof; sufficient complexing agent to maintain the nickel ions and the zinc ions in solution; and a buffer in an amount sufficient to achieve a desired pH. Preferably, the surface of the substrate is pretreated or precatalyzed before deposition by a sensitizing step using tin and an activating step using palladium.

Abstract: The present invention provides an improved method for firing thick film inks in hybrid circuits which comprises firing different copper compatible thick film materials in a single firing atmosphere. The method comprises the steps of providing a paste suitable for application to a ceramic substrate, applying the paste to the substrate by a conventional technique such as screen printing, drying the substrate, and firing the substrate at an elevated temperature in an ambient comprising an inert gas and carbon dioxide to form the electrical component. In another embodiment, the substrate is fired in an ambient comprising only carbon dioxide.

Abstract: A process is disclosed for making metal plated PPD-T fibers wherein the plating is durable and highly conductive. The process involves contacting the fibers with an 80 to 90% sulfuric acid solution, neutralizing and washing the fibers with water, and then plating the fibers by an electroless plating process. The acid treatment of the fibers promotes adhesion between the metal and the fiber and high electrical conductivity for the plated metal.

Abstract: A hot melt agent is printed between terminals of a heat seal film substrate 1 having a circuit printed of conductive material on a base film such as polyester. An anisotropic film mixing nickel particles is printed on the terminals. Afterwards, a hot melt agent is printed on the upper surface, and thermo-compression bonded to the printed wiring board on the opposite side. Hence, deviation of terminals is prevented at the time of connection of heat seal film substrate connected by thermo-compression bonding, while elongation of base film is prevented, so that terminals may be connected accurately, so as to be applicable to fine pitches.

Abstract: A process for making an electrically conductive pattern on a substrate comprising coating the substrate with a solution of salts containing at least one supplementary element, drying and heat treating the salt coating at a temperature lower than the temperature at which oxides form from the salts, then forming a metal conductive pattern on the heat treated supplementary element coating. This process can be used to make printed circuits on ceramic substrates which are useful in hybrid circuits, for example.

Abstract: Electroless deposition of copper from solution onto a substrate, particularly a polymeric laminate for use in electronic circuitry, is accomplished by first treating said substrate with a stilbene-based fluorescent brightener to sensitize said substrate and thereafter contacting said substrate with an electroless copper plating solution.

Abstract: A process for baking electrically conductive wires clad in insulating plastics resin, comprising a first, evaporation stage for evaporation of solvents and a second resin polymerization and cross-linking stage, which are performed respectively in a first and in a second region of a tunnel chamber in a continuous oven between the inlet regions and outlet regions of which the wires advance, a third stage comprising aspiration from the oven of a mixture of air and solvents formed during the first evaporation stage, and a fourth stage comprising heating this mixture to a predetermined temperature such as to cause combustion of the solvents, and including a fifth stage of introducing heat energy to these regions of the oven from at least part of the stream of air and combustion products coming from the fourth stage, through heat exchangers disposed on the outer surface of this tunnel chamber, in such a way as significantly to reduce the introduction of heat energy provided to the chamber by heating means supplied

Abstract: Microreflectance infrared (IR) spectroscopy is used to determine the degree of cure of Meta-Paete (pyromellitic dianhydride-oxydianiline ethyl ester) films on metallized substrates. In this method, the infrared bands at 1028 and 1015 cm.sup.-1 are used to indirectly monitor ethanol evolution during Meta-Paete cure. The 1015 cm.sup.-1 band serves as internal reference, while the 1028 cm.sup.-1 band, which corresponds to the C--O stretch in the ethoxy group, is used to monitor imidization through loss of the ethoxy group during cure. Quantification of ethanol evolution is possible, since no apparent distortion is observed in the external reflection spectra at these two frequencies. The method can also be applied to measure the cure uniformity of Meta-Paete films, to provide an estimate of film thickness over metallized substrates, and to monitor temperature uniformity in an oven cavity.

Abstract: Method of producing a polyimide layer having improved adhesion to a metal layer thereon. A halogenated polyamic acid is sprayed, partially cured, degreased and oxidized to form a partially cured polyimide layer, which is then electrolessly plated with a primary metal layer and then final cured into the polyimide layer. Electrolessly or electrolytically applied secondary metal layers are then deposited on the primary layer, until the metal layer of a desired thickness is attained. The present invention further discloses articles such as an EMI shielded enclosure and an insulated mold surface, having metal layers as an EMI shield and an insulating surface, respectively.

Abstract: Cyanate ester polymer articles, particularly fiber-reinforced, are metallized by electroless deposition preceded by a series of pretreatment steps which improve adhesion of the metal layer or layers. Said steps include aqueous alkali followed by nitric acid treatment. They preferably also include an initial alkaline permanganate treatment, preferably preceded by aqueous alkali.

Abstract: A semiconductor processing method provides for plasma-enhanced chemical-vapor deposition (PECVD) for intermetal dielectrics while minimizing risk of gate oxide impairment due to plasma discharge. A protective oxide sublayer is deposited without using high-power PECVD. The protective sublayer can be deposited by using chemical-vapor deposition (CVD) without plasma enhancement or by a lower-power PECVD. In the latter case, the initial rf power of the plasma is selected to be low enough to ensure that the gate oxide is not breached in the event of a plasma discharge. The protective sublayer can be thick enough to maintain its integrity in the event of a plasma discharge even during a higher-power PECVD deposition.

Abstract: A method for forming a solder bump on an integrated circuit die utilizes a terminal (12) formed of an electrically conductive, solder-wettable composite material composed of copper particles and a polymeric binder. The terminal comprises a bond pad (24) overlying a passivation layer (20) on the die and a runner section (26) connecting the bond pad to a metal contact (16). The terminal is applied to the die, for example, as an ink by screen printing, after which a body of solder alloy is reflowed in contact with the bond pad to form the bump. A preferred material for the terminal is composed of silver-plated copper particles and a resol type phenolic binder.

Abstract: Provided is an improved process for removing hydrogen sulfide from fluid streams by contacting hydrogen sulfide contaminated fluid streams with a novel composition comprising zinc oxide and a diatomite material coated with a colloidal oxide. Additionally, a novel method for producing a composition comprising the steps of coating a diatomite material with a colloidal oxide solution followed by mixing the thus coated diatomite material with zinc oxide to form a paste is further provided.