Abstract: A method of forming, on an ultra-thin SOI substrate, an ESD protected device, includes: preparing a single crystal silicon substrate, including forming insulated areas thereon and forming selectively conductive areas thereon; doping the selectively conductive layers with dopants; growing, epitaxially, silicon layers over selected insulated areas and the doped, selectively conductive areas; heating the substrate and the structures formed thereon at between about 850.degree. C. to 1150.degree. C. for between about 30 minutes to three hours to redistribute the dopant into the epitaxially grown silicon layer; completing the fabrication of additional layers in the structure; and metallizing the structure.

Abstract: A method of manufacturing a bipolar transistor having a self-registered base-emitter structure is provided.

Abstract: This invention relates to a method for manufacturing silicon nitride films on a silicon substrate through chemical reaction of a surface, and then manufacturing a silicon nanometer structure using the silicon nitride films under ultra high vacuum condition. A method for manufacturing silicon nano structures using silicon nitride film, includes the following steps: performing a cleaning process of the silicon surface and implanting nitrogen ions having low energy into the silicon substrate; performing first heat treatment of the silicon substrate having ions implanted therin, and cooling the silicon substrate to room temperature to form monolayer thick silicon nitride islands; implanting oxygen gas on the silicon surface on which silicon nitride islands are used as masks while maintaining the surface of the silicon substrate at a temperature of 750 to 800.degree. C.