Abstract: A measuring circuit used for the capacitive examination of a moving elongated textile test material such as card sliver, roving, yarn or woven fabric, having a measuring capacitor for accommodating the test material, and a component with a capacitance which can be changed by an electric control signal. The measuring circuit can thus be balanced in a simple, rapid, cost-effective and especially automatic way.

Abstract: A sensor for detecting both magnetic fields and electric fields can include at least one Sawyer-Tower (ST) circuit that can incorporate a multiferroic capacitor. An odd number of ST circuits coupled together in a ring configuration, so that for each ST circuit, the output of one ST circuit is an input to another of the ST circuits. The multiferroic capacitors can include a multiferroic layer that can be deposed on a substrate. For each multiferroic capacitor, the deposition process can cause an inherent amount of impurities in the multiferroic layer. The number of said odd number of ST circuits to be coupled together is chosen according to the amount of impurities, to “forgive” the impurities. The higher the level of impurities in the multiferroic layers, that more ST circuits that are required in the ring to achieve the same sensor sensitivity. BDFO can be chosen for the multiferroic material.

Abstract: Flow valve including a casing containing an electromagnetic assembly for detecting a magnetic field. The electromagnetic assembly is fixed to a pendulum suspended by an articulation from a plate of the casing. The casing contains a liquid for damping the movements of the pendulum. The pendulum includes a surface opposite the articulation which has a spherical cap shape and which extends facing a wall of the casing of complementary shape, defining a space having dimensions suitable for producing a laminar rolling of the damping liquid between them when the pendulum is in motion.

Abstract: A current measuring circuit for providing a current flow signal indicative of current flow between a first terminal and a second terminal includes a main transistor, a sense transistor, a bypass switch, an output amplifier for providing a current flow signal, and a controller for enabling current flow through each of respective drain-source paths of the main and sense transistors or a controllable conduction path of the bypass switch.

Abstract: A method of providing wetting current diagnostics for a load control switch includes changing test switch settings of a detection circuit from an operational configuration to a testing configuration. The test switch settings specify respective states of first and second test switches of the detection circuit. The first and second test switches are connected to a node of the detection circuit through which, in the operational configuration, a wetting current for the load control switch flows. The method includes determining whether a voltage at the node becomes no longer indicative of the operational configuration as a result of the changed test switch settings, returning the test switch settings to the operational configuration, and providing a wetting current fault indication if the voltage at the node fails to return to a level indicative of the operational configuration after returning the test switch settings to the operational configuration.

Abstract: A capacitive fingerprint sensing system includes excitation signal providing circuitry and a plurality of sensing elements. Each sensing element includes a protective dielectric top layer, an electrically conductive sensing structure coupled to the excitation signal for providing a sensing signal indicative of a change of a charge carried by the sensing structure resulting from a change in potential difference between the finger and the sensing structure, and demodulation circuitry connected to the sensing circuitry for combining the sensing signal and a demodulation signal being timing-related to the excitation signal to provide a combined signal including a DC signal component indicating the change of the charge carried by the sensing structure. The fingerprint sensing system further includes readout circuitry connected to each of the sensing elements for providing a representation of the fingerprint pattern based on the DC signal component from each of the sensing elements.

Abstract: Provided is an actuator including: first to third rotation axes provided at a fixed section and having axes in a same direction, first to third rotation sections provided at positions offset from centers of the corresponding rotation axes, and rotating in response to the corresponding rotation axes; a movable section including first and third side walls facing the first and the third rotation sections in a first direction on a movable plane, and a second side wall facing the second rotation section in a second direction, the movable section moving on a predetermined movable plane in response to rotation of the first to third rotation sections; and a biasing section biasing the movable section with respect to the fixed section in at least one of the first direction and the second direction, and making at least one of the first to third rotation sections abut against the corresponding side wall.

Abstract: An apparatus for and a method of sensing capacitance of one or more sensor elements in multiple capacitance sensing modes, including a self-capacitance sensing mode and a mutual capacitance sensing mode.

Abstract: A system and method of testing High Brightness LED (HBLED) is provided, and more particularly, a system and method of Controlled Energy Testing of HBLED with improved accuracy and repeatability is provided. In one embodiment, the system includes a programmable constant power source for providing a constant power to a Device Under Test (DUT), in this case, an HBLED, wherein the programmable constant power source adjusts an output voltage or an output current to ensure that a given amount of power is supplied to the HBLED for a predetermined amount of time and to provide precise control of a junction temperature of the HBLED for the duration of the test sequences; a Parametric Measurement Unit (PMU) including a processor for executing a plurality of HBLED test sequences, and a spectrometer for measuring a set of HBLED parameters including power and color (wavelength) of an optical output of the HBLED; and a controller for coordinating timing of acquiring the set of measured HBLED parameters.

Abstract: An apparatus for picking and placing or for picking and transferring or for picking, placing and pressing semiconductor components (10) is disclosed. The apparatus (10) comprises a motor for generating power to rotate a turret (6) which holds a plurality of pick up heads (7), a plurality of pressers (8), wherein each of said pressers (8) is a voice coil assembly (3) which consist of voice coil actuator assemblies (31), at least one stationary frame (1, 2) to secure said voice coil assemblies (3) and a controller means to control the direction and magnitude of displacement of said voice coil actuator assemblies (31). When current flows into voice coil in said voice coil actuator assembly (31), electromagnetic force is generated in vertical direction, forcing said actuators to press said pick up heads (7) located directly below said actuators at a particular moment, which in turn reaches to and press on wafers or semiconductor components located below said pick up heads.

Abstract: In an embodiment, a chuck to support a solar cell in hot spot testing is provided. This embodiment of the chuck comprises a base portion and a support portion disposed above the base portion. The support portion is configured to support the solar cell above the base portion and to define a cavity between a bottom surface of the solar cell and the base portion that thermally separates a portion of the bottom surface of the solar cell from the base portion.

Abstract: A semiconductor arrangement may include a multiplicity of semiconductor elements with controlling paths and controlled paths, the controlled paths having controllable conductivities and being connected parallel to each other. The semiconductor arrangement may also include a current evaluation circuit configured to measure current strengths of currents present in the controlled paths and to provide a signal representing the sum of the measured current strengths, and a control circuit connected to the controlling paths and configured to control the conductivities of the controlled paths in accordance with an input signal and the signal representing the sum of the current strengths. The at least one controlled path is controlled to have minimum conductivity if the signal representing the sum of the current strengths is below a threshold value.

Abstract: Increasing the resolution of a resistance sensor by adjusting a current source.

Abstract: A protector with a sensor is installed on a sliding door for detecting an alien substance by touch between two core wires in a hollow part. In a terminal part of the protector with the sensor, the core wires drawn out are connected with a resistor or leads joined with a control unit. A primary seal is formed by injection molding for coating wire connection parts and another end side of an insert and a secondary seal is formed by the injection molding for coating a part formed with the primary seal for forming an external shape of a product.

Abstract: A probe card for circuit-testing comprising a testing PCB, a probe head, and a silicon interposer substrate is provided. The probe head has a plurality of probes provided with a fine pitch arrangement and held inside. The silicon interposer substrate is used for conveying signals between said probes and said test PCB. The interconnection of said silicon interposer substrate is formed by utilizing the through-silicon via process. A plurality of upper terminals and a plurality of lower terminals are respectively array-arranged on the top surface and the bottom surface of said silicon interposer substrate. The pitch between the upper terminals is larger than the pitch between the lower terminals and the pitch between adjacent lower terminals is equal to the fine pitch of the arrangement of probes.

Abstract: A testing probe card for wafer level testing semiconductor IC packaged devices. The card includes a circuit board including testing circuitry and a testing probe head. The probe head includes a probe array having a plurality of metallic testing probes attached to a substrate including a plurality of conductive vias. In one embodiment, the probes have a relatively rigid construction and have one end that may be electrically coupled to the vias using a flip chip assembly solder reflow process. In one embodiment, the probes may be formed from a monolithic block of conductive material using reverse wire electric discharge machining.

Abstract: A thermal gradient is induced in a device-under-test (DUT) and used to determine the location of a defect. In one embodiment, a static thermal gradient is induced across at least a portion of the DUT along a first axis. The thermal gradient is incrementally walked along the first axis until the condition associated with the defect is triggered, thereby defining a first region. The thermal gradient is then induced along a second axis of the DUT and the process is repeated to define a second region. The location of the defect is determined to be the intersection of the first region with the second region.

Abstract: A contact probe includes a conductive first plunger including, on a same axis, a distal end portion, a flange portion, a boss portion, and a base end portion, a conductive second plunger including, on the same axis, a second distal end portion and a boss portion, and a coil spring including a coarsely wound portion formed by winding at a predetermined pitch with an inner diameter equal to or larger than a diameter of the boss portion of the first plunger and a tightly wound portion formed by tightly winding with an inner diameter substantially equal to a diameter of the boss portion of the second plunger, so that the first plunger and the second plunger are connected to each other on the same axis.

Abstract: A safe powerline communications instrumentation front end device including a voltage input for receiving a line voltage from a powerline, a voltage reducer for reducing the voltage of the line voltage, a filtering system for extracting a Power Line Communications (PLC) signal from the line voltage, and an analog output for outputting the PLC signal as an analog signal for communications test equipment.

Abstract: Coaxial probe structures include a plurality of discrete insulated elongated electrical conductors projecting from a support surface which are useful as probes for testing of electrical interconnections to electronic devices, such as integrated circuit devices and other electronic components and particularly for testing of integrated circuit devices with rigid interconnection pads and multi-chip module packages with high density interconnection pads. Coaxial probe structures are fabricated by the methods described providing a high density coaxial probe.