Patents Examined by Y. Whang
  • Patent number: 5781416
    Abstract: A pair of self-adjusting shelf assemblies, each made from static dissipative material and mounted in spaced relation in a storage chamber. Each assembly has a fixed, first unit and a relatively movable second unit which is self-adjusting upon insertion of a circuit board between a facing second unit of one shelf assembly and the fixed first unit of the other shelf assembly to accommodate different heights of circuit boards stored therebetween in the chamber.
    Type: Grant
    Filed: April 13, 1994
    Date of Patent: July 14, 1998
    Inventor: Ralf P. Maroney
  • Patent number: 5644477
    Abstract: Modular fascia cover assemblies for rack mounted equipment are disclosed. In a system comprised of several pieces of equipment mounted in a standardized rack, vertical spaces typically exist between the components. These spaces can be filled with fascia cover assemblies, and the present invention provides a modular system that permits openings of nearly any width to be filled. The fascia cover assembly is created by choosing a combination from a few standardized modular parts. The fascia cover assemblies disclosed preferably include components such as an operator panel and pull bar that can be included, respectively, at the top and bottom of the assembly. Most preferably, the operator panel is one and one-half units high and the pull bar is one-half unit high. A cover panel that is one unit high is also included. In certain embodiments, a larger cover panel component is also provided that is three units high.
    Type: Grant
    Filed: October 20, 1994
    Date of Patent: July 1, 1997
    Assignee: Unisys Corporation
    Inventor: Peter P. Klein
  • Patent number: 5644478
    Abstract: An electronic element which is free of many of the impurities that tend to adversely affect its operation. The electronic element is hermetically sealed in a space formed by a framework having a first and second plate directly joined to its sides. Directly joining the first and second plates to the framework prevents splashes of adhesive and soldering material from effecting the operation of the electronic element.
    Type: Grant
    Filed: January 31, 1995
    Date of Patent: July 1, 1997
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Daizo Ando, Tadashi Nakamura, Shinji Umeda, Kunihiko Oishi
  • Patent number: 5617301
    Abstract: A personal computer comprises a housing having a bottom wall. A plurality of functional components are arranged side by side on the bottom wall of the housing. A fixture plate is arranged on top of the functional components and secured to the functional components and the bottom wall by means of screws. The functional components are held between the fixture plate and the bottom wall.
    Type: Grant
    Filed: August 29, 1995
    Date of Patent: April 1, 1997
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Youji Sato, Yuji Nakajima, Kinji Taki, Toshikazu Konno
  • Patent number: 5610802
    Abstract: An energy storage system including a housing adapted to rest on a supporting surface. The housing has a plurality of openings formed therein. Each of a predetermined number of the plurality of openings has a door mounted therein. The housing includes a sump, and located inside the housing are one or more racks. Each of the racks is adapted to hold a plurality of energy storing devices. The racks may include sliding shelves or energy storing device access mechanisms which permit each energy storing device to be moved from a first position to a second position. In addition, and optionally, the racks may be mounted on wheels so that they may be moved within the housing in order to provide access to the energy storing devices mounted thereon.
    Type: Grant
    Filed: May 23, 1995
    Date of Patent: March 11, 1997
    Assignee: ZB B Technologies, Inc.
    Inventors: Phillip A. Eidler, Michael R. Hughes
  • Patent number: 5610799
    Abstract: The power module device is equipped with a metallic substrate composed of a flat section and a recessed section, and a circuit board which is rested over the recessed section of the metallic substrate. The metallic substrate and the circuit board constitute a package. In the recessed section, the power element is mounted on the bottom surface section and the control element is mounted on the bottom surface of the circuit board. Then, the power element and the control element are electrically connected via a wiring pattern or the like provided on the metallic substrate.
    Type: Grant
    Filed: April 18, 1995
    Date of Patent: March 11, 1997
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventor: Hazime Kato
  • Patent number: 5606489
    Abstract: A multiple circuit building protector assembly for protecting telephone communication related equipment includes a two-piece interfitting housing, a printed circuit board sub-assembly, a plurality of first modular jacks connected to an exposed side, and a plurality of second modular jacks connected to a protected side. The printed circuit board is fixedly mounted internally of the housing and is adapted to receive a variety of different overvoltage and/or overcurrent protective circuit devices. A plurality of plug-in fuse modules are disposed in top recesses of the housing cover member.
    Type: Grant
    Filed: May 26, 1995
    Date of Patent: February 25, 1997
    Assignee: Illinois Tool Works Inc.
    Inventors: Richard H. Heidorn, Mohammad Masghati
  • Patent number: 5604668
    Abstract: An apparatus (10) for shielding electronic circuit boards (14, 15) including a compartment assembly (16) having a wall (18) defining first (22) and second compartments (24), an electrical connection layer (26) having a first ground layer (44) in electrical contact with the wall (18) of the compartment assembly (16), and a cover (28) connected to the electrical connection layer (26). The wall (18) has a first surface (20) and a second surface (25) substantially perpendicular to the first surface (20). The electrical connection layer (26) has a non-ceramic insulating layer (46) connected to the ground layer (44) and a conductive layer (40) connected to the non-ceramic insulating layer (46).
    Type: Grant
    Filed: December 6, 1995
    Date of Patent: February 18, 1997
    Assignee: Motorola, Inc.
    Inventors: Katharine M. Wohrstein, Vito A. Copertino
  • Patent number: 5602723
    Abstract: This invention relates to a subrack device applicable for an SDH network, and more particularly to a subrack device which can be produced flexibly in response to a customer's need. The subrack device has a subrack body commonly used regardless of a type of the subrack device. The subrack body has a circuit-board-unit housing portion and an outer-connecting-board mounting portion. Circuit boards and outer-connecting-board connecting-boards of different types are prepared. The outer-connecting-board mounting portion has a plurality of outer-connecting-board mounting territories. The outer-connecting-boards are plugged in the outer-connecting-board mounting territories to produce the subrack device meeting the customer's need.
    Type: Grant
    Filed: October 19, 1995
    Date of Patent: February 11, 1997
    Assignee: Fujitsu Limited
    Inventors: Tsutomu Takahashi, Hiroshi Yamaji, Hisao Hayashi, Shigeru Amagasa, Takashi Sato, Tomoyuki Hongoh, Tetsuya Takahashi, Kouichi Namimatsu, Kazuaki Kashiwada, Kenji Joukou, Tetsuya Murayama
  • Patent number: 5600543
    Abstract: In an IC card made by the construction that fastens a connector housing to an open end of a U-shaped frame, fastens, to a face of the connector housing adjacent to the face into which external connector pins are inserted, a conductive metal member having at least one protrusion formed thereon and used for reducing the impedance of ground terminals, and holds the frame between a pair of metal panels, one of the metal panels has through-holes in its end at the connector housing for inserting the protrusions thereto to make them project therethrough, and the metal panel, in which the protrusions project through the holes, is fastened to the frame, while the metal panel holds the metal member between itself and the connector housing.
    Type: Grant
    Filed: December 14, 1995
    Date of Patent: February 4, 1997
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventor: Yoshikado Sanemitsu
  • Patent number: 5594627
    Abstract: A circuit card retainer for securing a circuit card within a circuit card receiving channel to mitigate the possibility of a circuit card connector jarring loose from a motherboard slot during transit or other vibration or shock causing activity. The circuit card retainer securely retains an inner edge of the circuit card upon insertion of the circuit card, and allows the circuit card to be extracted only if the groove abutment is flexed away from the inner edge of the circuit card, thereby removing the obstruction caused by the groove abutment.
    Type: Grant
    Filed: June 28, 1994
    Date of Patent: January 14, 1997
    Assignee: AST Research, Inc.
    Inventor: Bao G. Le
  • Patent number: 5592366
    Abstract: An instrument chassis is disclosed. The chassis includes a housing with a front opening in a first loading plane, and instrument receiving slots located in the housing. These slots are engageable to printed circuit cards inserted through the front opening. The chassis also includes first and second power supplies. The first power supply is electrically coupled to a first set of instrument receiving slots, and the second power supply is electrically coupled to a second set of the instrument receiving slots. Thus a first set of the printed circuit cards may maintain electrical and mechanical separation and isolation from a second set of the printed circuit cards.
    Type: Grant
    Filed: September 29, 1994
    Date of Patent: January 7, 1997
    Inventors: Jacob Goldman, Moshe Zarmi
  • Patent number: 5590028
    Abstract: Disclosed is a printed wiring board and memory card assembly comprising a pair of opposed cover plates, a printed wiring board interposed between the opposed cover plates, an electrical battery positioned adjacent the printed wiring board and between the opposed covers, a positive terminal connecting the printed wiring board with the battery and a negative terminal connecting the printed wiring board with the battery and both of the cover plates. A method of grounding the printed wiring board by this assembly is also disclosed.
    Type: Grant
    Filed: September 30, 1994
    Date of Patent: December 31, 1996
    Assignee: Berg Technology, Inc.
    Inventor: Paul M. Duncan
  • Patent number: 5587890
    Abstract: A vehicle electric power distribution system having a plurality of conductive plates, wherein each conductive plate includes an arrangement of contact pads that are electrically connected to other contact pads via integrally formed conductive traces. These conductive plates can be vertically stacked, with electrical contact between selected contact pads on different conductive plates being provided by conductive pins. Each conductive plate is selectively coated with an insulating layer to obviate unwanted electrical contact.
    Type: Grant
    Filed: August 8, 1994
    Date of Patent: December 24, 1996
    Assignee: Cooper Industries, Inc.
    Inventors: Lawrence R. Happ, Jacek Korczynski, William R. Bailey, Alan Lesesky
  • Patent number: 5587888
    Abstract: An extracting device for plug-in modules having a holding bracket for securing a front plate as well as a printed circuit board to a profile rail of a module rack. A pivoted lever is articulated to a holding bracket; the pivoted lever rests with a pressing shoulder against a front face of the profile rail. To facilitate the extraction and to accomplish a large extraction lift, the pivoted lever is displaceable with respect to the holding bracket with the aid of a sliding mechanism which has a sliding pin on the holding bracket and a sliding track on the pivoted lever whose swing pin is displaceable in a slot of the holding bracket.
    Type: Grant
    Filed: January 11, 1996
    Date of Patent: December 24, 1996
    Assignee: Schroff GmbH
    Inventor: Michael Joist
  • Patent number: 5586011
    Abstract: An electric circuit board including EMI shielding. The board comprises a substrate including top and bottom surfaces and at least one internal ground layer, the internal ground layer being electrically insulated from the external surfaces of the substrate. A plurality of vias are formed in the substrate near the edges of the substrate, each via providing an opening from the surface of the substrate to the internal ground layer A metal plating is applied to the vias, the edges of the substrate and the perimeter of the surface of the substrate, the metal plating along the substrate perimeter being applied over the plated-up vias to electrically connect the ground plane with the metal plating applied to the edges of the substrate.
    Type: Grant
    Filed: August 29, 1994
    Date of Patent: December 17, 1996
    Assignee: AT&T Global Information Solutions Company
    Inventor: Arthur R. Alexander
  • Patent number: 5583747
    Abstract: Conductive thermoplastic interconnects (120) for electronic devices are disclosed. The interconnects may take the form of bumps or spheres, and may be used in applications where metal bumps are conventionally used. Bumps (310) may be attached by retaining them in a vacuum fixture (312) and momentarily contacting them with the substrate (316) requiring the bumps (310). The substrate (316) has been heated sufficiently to cause wetting of the conductive thermoplastic bump (310).
    Type: Grant
    Filed: May 5, 1995
    Date of Patent: December 10, 1996
    Inventors: John H. Baird, Francis J. Carney
  • Patent number: 5583750
    Abstract: In an electronic device comprising a first substrate having at least one first electronic circuit element thereon, a second substrate having at least one second electronic circuit element thereon, a substrate connector through which the first and second electronic circuit elements are connected electrically to each other, and an electrically grounded chassis receiving the first and second substrates, the first substrate has thereon a first electromagnetic shielding plate including an electrically conductive material, the second substrate has thereon a second electromagnetic shielding plate including the electrically conductive material, the first and second electromagnetic shielding plates are electrically connected to the chassis, and a wire length between a wire length limited electronic circuit element on the first substrate and another of the electronic circuit elements on the second substrate is limited for ensuring a high speed responsive operation therebetween.
    Type: Grant
    Filed: October 18, 1995
    Date of Patent: December 10, 1996
    Assignees: Hitachi, Ltd., Hitachi Microcomputer System, Ltd.
    Inventors: Kunihiro Nakata, Seiichi Kawashima, Fumio Kishida
  • Patent number: 5579211
    Abstract: A relay (1), particularly a relay with solder terminal pins (13) connected onto a plug adaptor that is formed by a base (20) of insulating material with male plug elements for plugging the adaptor and relay into a circuit. The adaptor has a male connector member with a plurality of conductor elements embedded or inserted into the base and a plurality of high-current blades bent respectively off from the conductor elements. After soldering of the terminal pins (13) to the conductor segments (25), the base region surrounded by a circumferential wall (22) is filled with casting compound. As a result thereof, the arrangement is sealed on all sides and the adaptor with the blade is stabilized and strengthened, so that it can withstand high plugging forces.
    Type: Grant
    Filed: October 23, 1995
    Date of Patent: November 26, 1996
    Assignee: Siemens Aktiengesellschaft
    Inventor: Horst Hendel
  • Patent number: 5579209
    Abstract: A remote control unit for an air conditioner having a controller configured to process multiple temperature inputs, to provide a cycle of operation to provide comfort during sleeping, to provide an automatic cycle of operation wherein a burst of cooling air is provided on demand and/or which is configured to receive and respond to remote signals having different protocols. The remote control unit has a housing with a contoured rib that extends between two support pads so as to provide strength, rigidity and stability to the housing.
    Type: Grant
    Filed: November 23, 1994
    Date of Patent: November 26, 1996
    Assignee: Whirlpool Corporation
    Inventors: Larry J. Manson, Jerry L. McColgin, Chris A. Scriber, Gary Bolin, Kenneth T. Shelley