Patents Examined by Y. Whang
  • Patent number: 5528464
    Abstract: A shelf assembly which has realized an easy mounting of a back wiring board to a shelf. The shelf assembly comprises a shelf including a cross beam connecting a pair of side walls on a rear side thereof; and a back-board mounting frame including a pair of side plates each having a vertical guide groove, a first upper connection member and a second upper connection member for connecting the side plates, a first intermediate connection member and a second intermediate connection member for connecting the side plates, and a lower connection member for connecting the side plates. The shelf assembly further comprises a back wiring board inserted into the back-board mounting frame from above along the guide grooves formed in the side plates; and fixing means for fixing the back-board mounting frame to the shelf.
    Type: Grant
    Filed: July 26, 1994
    Date of Patent: June 18, 1996
    Assignee: Fujitsu Limited
    Inventors: Akihiro Hamaguchi, Hiroshi Uchiumi, Masakazu Ikegawa, Hisao Ohsone
  • Patent number: 5528459
    Abstract: An extension module for tandem connection to a base circuit card having an external sheet material jacket girding the card. The module includes a module housing and a pair of spaced apart parallel support fingers extending from the housing. The outer sides of the support fingers are configured for slidable insertion into corresponding spaced apertures in the rearward end of the base circuit card to engage inner surfaces of the jacket adjacent opposite side edges of the jacket of the card. An electrical connector is located between the support fingers and is adapted for mating connection with a corresponding electrical connector located at the rearward end of the base circuit card, when the extension module is connected to the base circuit card.
    Type: Grant
    Filed: August 28, 1995
    Date of Patent: June 18, 1996
    Assignee: International Business Machines Corporation
    Inventors: Alan W. Ainsbury, Albert J. Kerklaan
  • Patent number: 5528460
    Abstract: A battery holder (25) holds a battery (27) in spaced relation to a printed circuit board (30), sufficient space (43) being provided between the printed circuit board (30) and the battery (27) for mounting of circuit components (47,49) on the printed circuit board (30) between the battery holder and the printed circuit board. A connection is provided between a connector (85) mounted on the printed circuit board (30) and a connector (82) mounted on leads (78) which are attached to the battery (27), the connection providing for the electrical connection and disconnection of the battery (27) and the printed circuit board (30). A housing (10) is provided for mounting the printed circuit board (30), battery holder (25) and battery (27) therein. The battery holder (25) is provided with a deformable retention clip (56) for retention of the battery (27) within a chamber (50,51) the holder (25), and in response to actuation by an operator, removal of the battery from the holder.
    Type: Grant
    Filed: September 21, 1994
    Date of Patent: June 18, 1996
    Assignee: AEG Schneider Automation, Inc.
    Inventor: Timothy J. Byrd
  • Patent number: 5526235
    Abstract: An electronic storage device having IC chips mounted upon a board, with the board surrounded by a card housing. A portion of the card housing is formed of conductive material and is electrically connected to the board to allow the board to be easily grounded to reduce damage due to static electricity. The card is operatively received in a receptacle having a bay sized to receive the card. Upon insertion of the card into the bay, a grounding contact grounded to the receptacle may engage the conductive portion of the card housing to ground the card prior to the card contacts being operatively connected. The card preferably has a shape such that it may only be inserted into the bay in the proper orientation. The receptacle may have a power switch located to provide full access to the bay in the power-off position, but blocking bay access in the power-on position. This ensures that the card is not inserted while the receptacle is activated, and that the receptacle is deactivated prior to removing the card.
    Type: Grant
    Filed: June 23, 1994
    Date of Patent: June 11, 1996
    Assignee: Garmin Communication and Navigation
    Inventors: Lawrence W. Beason, Sheldon T. Wheaton, Christopher J. Hanshew
  • Patent number: 5523921
    Abstract: A printed circuit assembly (PCA) having improved reference plane isolation for reducing electromagnetic and communication Input/Output (I/O) emissions includes a reference plane layer having a plurality of apertures patterned therein. A component layer of the PCA I/O communication circuitry and non I/O circuitry thereon. In the preferred embodiment, the apertures are aligned in a double row of substantially single file patterns on the reference plane. The single file patterns are positioned substantially parallel to and adjacent each other. Also, each aperture in each single file pattern is offset staggered with respect to a corresponding aperture in the adjacent single file pattern. When the reference plane layer and component layer are disposed in the PCA, the patterned apertures are placed relative to the component layer in a manner such that they substantially separate the non I/O circuitry from the I/O communication circuitry for reducing I/O communication emissions.
    Type: Grant
    Filed: December 22, 1994
    Date of Patent: June 4, 1996
    Assignee: Hewlett-Packard Company
    Inventor: Curt Van Lydegraf
  • Patent number: 5521793
    Abstract: An outdoor wireless base station with a circuit pack within a housing. A printed circuit board of the pack has opposite edges formed with spaced projections and the housing has spaced guide elements to receive the projections for mounting purposes. To mount the circuit pack, the circuit board is moved to pass the projections laterally between the guide elements to enable the projections to become aligned with and then to move along the guide elements.
    Type: Grant
    Filed: July 22, 1994
    Date of Patent: May 28, 1996
    Assignee: Northern Telecom Limited
    Inventors: Kevin L. Dalgleish, Sei S. Hoe
  • Patent number: 5521795
    Abstract: For use with a key in a keyboard instrument, a solenoid mounting apparatus for releasably securing solenoid assemblies has a mounting rail with essentially flat first and second faces, first and second end edges, and first and second mounting edges. Solenoid assembly securing channels are formed into each mounting edge. Included in the solenoid assemblies are brackets for retaining each of the solenoids to the rail and a threaded member for releasably anchoring each bracket to either of the channels.
    Type: Grant
    Filed: December 5, 1994
    Date of Patent: May 28, 1996
    Inventors: Kirk Burgett, Alpha Cheung
  • Patent number: 5521794
    Abstract: A radio (100) which includes a plurality of printed circuit boards (101) which are positioned in a planar arrangement so to provide a substantially fiat structure. The printed circuit boards (101) are connected using flexible conductors (105) which mechanically and electrically couple the printed boards (101) and provide a flexible link to allow the printed circuit boards (101) to be manipulated into various configurations. A flexible radio housing (151) is used to encapsulate the printed circuit boards (101) and flexible conductors (105) allowing radio (100) to be impacted and/or easily manipulated without crushing the contents. The radio (100) may be worn and easily concealed on the body without risk of breakage.
    Type: Grant
    Filed: February 21, 1995
    Date of Patent: May 28, 1996
    Assignee: Motorola, Inc.
    Inventors: Phillip C. Hargrave, Thomas A. Knecht
  • Patent number: 5519580
    Abstract: A ball grid array (BGA) package which has a plurality of solder balls attached to solder landings that each have a number of tabs which extend from a center area of the landing. The tabs assist in a symmetric formation of solder balls that are formed on the landings. When constructing the package, a solder mask is applied to a bottom package surface before the application of the solder balls. The solder mask has a plurality of openings which expose the solder landings and are larger than the center area of the landings. Solder balls are then placed onto the solder landings and reflowed so that the balls become attached to the landings. The fully exposed center areas of the solder landings allow the solder to flow vertically along the outer walls of the landings, thereby providing a more robust solder joint. The exposed solder landings also allow a solder flux to be thoroughly cleaned after the solder balls are attached to the landings.
    Type: Grant
    Filed: September 9, 1994
    Date of Patent: May 21, 1996
    Assignee: Intel Corporation
    Inventors: Siva Natarajan, Debendra Mallik
  • Patent number: 5519579
    Abstract: The invention is a method for replacing integrated circuit chips directly attached on printed circuit boards, and a board and a replacement card module that may be used to practice the method. As the first step, the electronic component and the surrounding fan-out wiring area on the board is mechanically removed, e.g., by micro-milling, typically leaving a recess in the board. A card module having a replacement electronic component and associated fan-out wiring is attached in the recess of the board by common bonding agents. The card module is designed so that its fan-out wiring matches the removed fan-out wiring, and hence is adapted for attachment to the board wiring. After attaching the card module, the wiring of the board is electrically connected with the wiring of the card module by wire bonding, tape automated bonding or other appropriate solder techniques.
    Type: Grant
    Filed: December 8, 1992
    Date of Patent: May 21, 1996
    Assignee: International Business Machines Corporation
    Inventors: Peter Fink, Heinz G. Horbach
  • Patent number: 5519586
    Abstract: A fuse holder assembly (100) has a pair of fuse clips (23) which provide electrical connection between a fuse (22) and a circuit in a printed circuit board (15). The fuse holder assembly (100) securely holds a fuse (22) adjacent to an edge of the printed circuit board and in spaced relation to the printed circuit board (15) for easy access to the fuse and for maximizing the area on the printed circuit board available for circuit components or edge connector contacts. Each fuse clip (23) has a mounting base (25) for mounting to the printed circuit board and for providing electrical connection with the circuit on the printed circuit board, and a retention clip (33) attached to the mounting base. A support (55,58) supports the retention clip and provides access (53,70) to the retention clip for installation and removal of a fuse within the retention clip.
    Type: Grant
    Filed: October 11, 1994
    Date of Patent: May 21, 1996
    Assignee: Modicon, Inc.
    Inventor: Timothy J. Byrd
  • Patent number: 5513078
    Abstract: An EMI shielded keypad (10) or switch for a radiotelephone (50) has a non-conductive cover (12) attached to a printed circuit board (PCB) (14). The PCB (14) has a ground pad (20) and a plurality of metal traces (26) on a first surface (16) that attaches to the cover (12). The cover (12) is made of a flexible, preferably clear material, such as mylar and has a dimple (28) centered over the ground pad (20). A bubble (30) is centered over the plurality of conductive traces (26). A conductive coating (32) is selectively applied to the mating surface (34) of the cover (12), so that the conductive coating (32) in the bubble (30) is electrically isolated. By pressing on the bubble (30) electrically contact is established between the plurality of traces (26), thus the bubble and the traces (26) define a switch.
    Type: Grant
    Filed: November 10, 1994
    Date of Patent: April 30, 1996
    Assignee: Motorola, Inc.
    Inventors: Dean M. Komrska, Dale G. Johnson
  • Patent number: 5513079
    Abstract: An improved terminal block for permitting the connection of inputs and outputs of an electronics mainframe module, such as a VXI mainframe module, to external devices, such as devices under test. The improved terminal block includes insertion and ejection levers to ease the connection and disconnection of the terminal block to the module. A ledge of the insertion and ejection lever engages an insertion beating surface on a front panel of the module during the insertion process and is then rotated in the appropriate direction until the terminal block is securely connected to the module. The ledge of the insertion and ejection lever engages an ejection beating surface on the front panel of the module during the ejection process and is then rotated in the appropriate direction until the terminal block is disengaged from the module. The levers can also be shaped in such a manner to permit top and bottom cable routing apertures, as well as a back side cable routing aperture.
    Type: Grant
    Filed: January 6, 1995
    Date of Patent: April 30, 1996
    Assignee: Hewlett-Packard Co.
    Inventor: Robert A. Millard
  • Patent number: 5510957
    Abstract: In an electronic device in which a control unit is detachable from an equipment body, the control unit is engaged and detachably secured to the equipment body by a locking member and a temporary retaining member. A lock release unit causes the locking member to disengage the control unit. When the locking member disengages the control unit, the temporary retaining member retains the control unit and causes the control unit to protrude from the front of the equipment body. Thus, the control unit is temporarily retained by the temporary retaining member in the protruding position and is not allowed to fall off the equipment body onto the ground or floor. In addition, since the operating member is moved to a position where it protrudes from the front of the equipment body, the control unit is easy to remove by hand.
    Type: Grant
    Filed: March 9, 1995
    Date of Patent: April 23, 1996
    Assignee: Alpine Electronics, Inc.
    Inventor: Katsuhiko Takagi
  • Patent number: 5510959
    Abstract: This invention is directed to an improved PCMCIA frame kit for receiving a planar electronic device, such as a printed circuit board or memory card, for electrical engagement with a complementary device in electronic equipment, such as a computer. The kit comprises a pair of matable, cover members to provide shielding to the planar electronic device, and that each cover member is integrally molded to a dielectric frame upon which the planar electronic device is seated. The improvement hereof lies in the provision of each frame including a dielectric extension intermatable with one another to define a cavity for receiving a portion of the planar electronic device. By this arrangement the planar electronic device may be provided with an antenna for the transmission of signals through the dielectric extension. Optionally, the cover members and extensions may be essentially identical in construction having appropriate means about the periphery thereof, for intermatability.
    Type: Grant
    Filed: May 17, 1995
    Date of Patent: April 23, 1996
    Assignee: The Whitaker Corporation
    Inventors: Michael P. Derstine, Randy G. Simmons
  • Patent number: 5508889
    Abstract: Disclosed is an improved shield enclosure comprising a open box-like body having flexible locking arms and flexible grounding arms both integrally connected to the lower edge of the open box-like body. The shield enclosure can be fixed to a printed circuit board, and be grounded simply by inserting its flexible locking arms in the fastening apertures of the printed circuit board, and be grounded by the flexible grounding arms being forced into contact with a ground strip on the printed circuit board, thus requiring no soldering and accordingly improving the efficiency with which shield enclosures can be attached to printed circuit boards.
    Type: Grant
    Filed: May 24, 1995
    Date of Patent: April 16, 1996
    Assignee: Molex Incorporated
    Inventor: Hidehiro Ii
  • Patent number: 5508888
    Abstract: A mechanical component peripheral lead protector covers fine pitch component leads in such a manner that nothing can come into contact with them. The lead protector is disposed above the component having the leads. It can be made of aluminum, conductive plastic or any other non ESD (electric static discharge) generating material. It can be glued, snapped, bolted or riveted to the associated PC board or glued to the top of the component, depending upon the application in which it is being used. The attachment method should be one which enables it to be removed and replaced when necessary. The center of the lead protector can be provided with an aperture so that the legends on the top of the component will be exposed.
    Type: Grant
    Filed: May 9, 1994
    Date of Patent: April 16, 1996
    Assignee: AT&T Global Information Solutions Company
    Inventor: Terry Craps
  • Patent number: 5506757
    Abstract: A compact electronic data module is provided which includes non-volatile memory, device. The memory device is mounted on a printed circuit board, which in turn is housed in a unitary tubular casing. The memory device is in the form of an integrated circuit (in a low-height package, such as a flat-pack or SOIC) which is mounted on the printed circuit board. One side of the printed circuit board is exposed to provide exterior contacts and the other side is placed inside the casing and covered with potting material. Simple wiring on the small board, using a through-hole vias, suffices to route power, ground, and data lines to the integrated circuit, while providing a sealed durable package with three external contacts.
    Type: Grant
    Filed: June 14, 1993
    Date of Patent: April 9, 1996
    Assignee: MacSema, Inc.
    Inventor: Michael J. Brorby
  • Patent number: 5506758
    Abstract: A circuit board insertion and extraction apparatus. The present invention is a circuit board inserter and extractor apparatus particularly suited for use with circuit boards utilizing high insertion force connectors requiring in excess of 50 lbs of force. The handle of the inserter/extractor has novel insertion and extraction surfaces which cooperate with corresponding surfaces fabricated as part of a card guide. As the circuit board is inserted into the card guide, the handle is automatically positioned so that the user can press the bottom of the handle to insert the circuit board. The handle and card guide interface is designed to provide a large positive force to extract the circuit board from the card guide until the circuit board is unseated from the associated high insertion force connectors. Additionally, the present invention is advantageously designed to eliminate the need for fixtures or separate hardware to install the handle onto the circuit board thereby saving assembly line time and money.
    Type: Grant
    Filed: September 30, 1994
    Date of Patent: April 9, 1996
    Assignee: Hewlett-Packard Company
    Inventor: S. Daniel Cromwell
  • Patent number: 5504656
    Abstract: A device for removing a plug-in module adapted for insertion into a module rack is provided where the module rack has a front profile rail including a front strip and a front face, the front strip having a front edge. The plug-in module comprises a retaining block for securing the plug-in module to the front profile rail; a printed wiring board equipped with electronic components and screwed to the retaining block; and a front panel secured to the retaining block. The device includes a two-armed bell crank having a long lever arm and a short lever arm and being pivotally secured to the retaining block by a pivot pin. The long lever arm of the bell crank constitutes an actuation handle for the device.
    Type: Grant
    Filed: February 10, 1995
    Date of Patent: April 2, 1996
    Assignee: Schroff GmbH
    Inventor: Michael Joist