Abstract: A light irradiation device (151) includes a UV lamp (153), first and second optical filters (164, 165) which transmit and block wavelengths within different specific ranges, and a filter switching mechanism (162) which selectively interposes the first and second optical filters (164, 165) between the UV lamp (153) and an optical lens. The blocking wavelength of the first optical filter (164) is relatively longer than that of the second optical filter (165). The first optical filter (164) is interposed between the UV lamp (153) and the optical lens since the start of curing a coating solution until a lapse of a predetermined period of time. When the predetermined period of time has elapsed, the second optical filter (165) is interposed between the UV lamp (153) and the optical lens to replace the first optical filter (164).

Abstract: A cold spray coating system comprising, a cold spray coating gun having a nozzle member operative to emit a stream of gas and granules of a coating material from a nozzle opening defined by the nozzle member such that the granules of the coating material impact and bond with a first region of a substrate, and a heat source member operative heat the first region of the substrate.

Abstract: A method and apparatus are provided for growing a composite metal sulphide photcatalyst thin film, wherein photochemical deposition and chemical bath deposition are both performed for growing the composite metal sulphide thin film, such as (AgInS2)x/(ZnS)2(1-x), wherein x is 0-1.

Abstract: A method and apparatus for simultaneously coating and measuring a part. The apparatus includes a part support, a sprayer and a part measurer positioned adjacent to the part support and a display device positioned adjacent to the part support. The sprayer applies a coating to a section of the part while the part measurer continuously measures a dimension of the section of the part being coated. In one embodiment, an initial amount of coating and a final amount of coating are applied to the section of the part based on the dimension measurements and desired dimension of the part. In another embodiment, the amount of coating applied to the part is based on the desired coating thickness. As a result, the apparatus and method of the present invention significantly reduces the margin of error related to the application of coatings to parts.

Abstract: Methods and systems are provided which are adapted to process a microelectronic topography, particularly in association with an electroless deposition process. In general, the methods may include loading the topography into a chamber, closing the chamber to form an enclosed area, and supplying fluids to the enclosed area. In some embodiments, the fluids may fill the enclosed area. In addition or alternatively, a second enclosed area may be formed about the topography. As such, the provided system may be adapted to form different enclosed areas about a substrate holder. In some cases, the method may include agitating a solution to minimize the accumulation of bubbles upon a wafer during an electroless deposition process. As such, the system provided herein may include a means for agitating a solution in some embodiments. Such a means for agitation may be distinct from the inlet/s used to supply the solution to the chamber.

Abstract: A coating apparatus 10 includes a base 11, a substrate support stage unit 2 mounted on the base 11 and capable of fixedly supporting a substrate 1, a coating unit 3 mounted on the base 11 and capable of discharging a coating material onto a substrate 1 fixedly supported on the substrate support stage unit 2, and a motor unit 4 for driving at least either the substrate support stage unit 2 or the coating unit 3 for sliding on the base 11. The motor unit 3 has a stator assembly 22 on the base 11. The stator assembly 22 includes a plurality of magnets 31 linearly arranged such that opposite magnetic polarities of the magnets alternately change, and a pair of magnet holding members 37 and 38 for linearly pressing the magnets 31 together from both the ends of the magnets.

Abstract: A thermal printer comprising a dispenser configured to dispense a medium from a stack of mediums and a conveyor belt assembly configured to receive the medium from the dispenser and convey the medium from a first position to a second position. A thermal printer is located between the first position and the second position and marks indicia on the medium. At least one sensor positions the print head of the thermal printer on an upper surface of the medium during the marking process.

Abstract: After subjected to a developing process, a rinsing process and a replacing process in this order in a developing unit 10A, 10B, a substrate W wet with an anti-drying solution is wet-transported to a supercritical drying unit 20 by a primary transport robot 30. The supercritical drying unit 20 performs a high-pressure drying process (supercritical drying process) in a dedicated manner. Accordingly, by virtue of the presence of the anti-drying solution, the substrate W is effectively prevented from becoming air-dry during the transportation of the substrate W.

Abstract: A liquid crystal dispensing system includes a liquid crystal material container to contain liquid crystal, the liquid crystal material container provided with a first code corresponding to liquid crystal information; a reading unit to read the recognition code; a discharge pump to draw in and discharge liquid crystal from the liquid crystal material container; and a nozzle to dispense liquid crystal from the discharge pump onto a substrate.

Abstract: An apparatus for processing a rolled article has a rotary supporting mechanism for rotatably supporting opposite ends of a photosensitive roll, an end drawing mechanism for drawing a sheet end of the photosensitive roll to a prescribed length, a pressing mechanism for supporting opposite surfaces of the sheet end, and an applying mechanism for applying a joint tape to the sheet end supported by the pressing mechanism in a transverse direction of the photosensitive roll.

Abstract: A slit nozzle which is easily manufactured and in which no capillary action occurs, and an apparatus for supplying a treatment liquid using the slit nozzle are disclosed. The slit nozzle is constructed of a left portion and a right portion joined to each other, one of which is made of metal and the other of which is made of resin. In the apparatus for supplying a treatment liquid using one or more of the slit nozzles, the slit nozzles are provided in a circulating passage of a treatment liquid whose temperature is controlled.

Abstract: Disclosed are a system and method for supplying chemical during a semiconductor device fabrication process. The system includes a tank to store the chemical, a dispensing unit to hold the chemical, a refill line connected between the tank and the dispensing unit to supply the chemical from the tank to the chemical liquid dispensing unit, and a dispensing line connected between the chemical dispensing unit and a semiconductor substrate to supply the chemical from the chemical dispensing unit to the semiconductor substrate.

Abstract: A material application apparatus 10 comprises a base 11 on which a workpiece W is placed, a syringe 13 that applies a material onto a movement track L, a movement structure 14 that moves the syringe 13 in three orthogonal axes directions, a rotation mechanism 15 that rotates the syringe 13 around the axis line of the syringe 13, and a control unit 17 that controls the movement structure 14 and the rotation mechanism 15 in accordance with a configuration of the track L. The syringe 13 includes a nozzle 19 provided to the front-end side of a main body 18 that contains a sealing agent or a material of resin used as an adhesive agent or the like. The discharge port 21 of the nozzle 19 is formed into a generally acute-angled triangle configuration to discharge the material so that a bead B having a sectional configuration in which the height is larger than 0.9 compared to the width of 1 can be formed. Also, the nozzle is adapted so as to be rotated in the periphery direction thereof by a motor M.

Abstract: A powder coating apparatus 100 and a method of manufacturing a stator 200 are disclosed wherein the stator is set in masking caps 110, 120 such that axial end faces of the stator are masked by the masking caps, respectively, so as to define a first clearance in an area closer to a powder spray nozzle 160 and a second clearance in the other area remote from the powder spray nozzle. The first clearance closer to the powder spray nozzle 160 is set to have airflow resistance less than that of the second clearance remote from the powder spray nozzle for thereby permitting compressed air, delivered from a compressed air supply unit 150, to be discharged through the first clearance at an increased flow rate.

Abstract: A substrate processing unit includes: a vertically-movable substrate holder for holding a substrate; a pan surrounding a periphery of the substrate holder; a cell, located below the substrate holder and within the pan, having in its interior a chemical processing section; and a cell cover, capable of closing a top opening of the cell, having a plurality of spray nozzles for separately spraying at least two types of processing liquids, wherein the pan and the cell each have an individual liquid discharge line.

Abstract: According to one aspect of the invention, a wafer processing apparatus is provided. The wafer processing apparatus may include a wafer support, a dispense head, and a solvent bath. The dispense head may be moveable between a position over the wafer support and a position over the solvent bath. When the dispense head is positioned over the solvent bath, a fluid dispensed from the dispense head may enter a drain and nozzles on the dispense head may be exposed to a controlled atmosphere within a chamber of the solvent bath.

Abstract: A cluster tool for processing a substrate includes a cassette and a processing module including a first processing chamber that is configured to perform a chill process on a substrate, a second processing chamber that is configured to perform a bake process on the substrate, and an input chamber. The first processing chamber, the second processing chamber, and the input chamber are substantially adjacent to each other. The processing module also includes a robot that is configured to receive the substrate in the input chamber and transfer and position the substrate in the first processing chamber and second processing chamber. The robot includes a robot blade, an actuator, and a heat exchanging device. The heat exchanging device includes a chilled transfer arm assembly. The cluster tool also includes a 6-axis articulated robot configured to transfer the substrate between the cassette and the input chamber.

Abstract: A stent mandrel fixture for supporting a stent during the application of a coating substance is provided.

Abstract: An insulation product is provided comprising an insulation sheet containing randomly oriented fibers bonded together. The sheet has first and second major surfaces and a pair of side portions. A nonwoven facing layer is bonded to at least one of the major surfaces. The nonwoven facing layer comprises randomly oriented bicomponent fibers, each of the bicomponent fibers including first component and second component portions. The nonwoven facing layer is bonded to the at least one major surface at least in part by a meltbond between the first component portion of the bicomponent fibers and the randomly oriented fibers in the insulation sheet.

Abstract: According to one aspect of the invention, a fluidic actuator and a control system for the fluidic actuator may be provided. A first component of the actuator may have two openings interconnected by a passageway. A second component may be moveably housed within the passageway and divide the passageway into two portions. A fluid delivery system may be connected to the two openings. The fluid delivery system may supply a first pressure of fluid to the first portion of the passageway causing the second component to move within the passageway at a first speed. When the second component is in a selected position within the passageway, the fluid delivery system may reduce the pressure of the fluid, causing a reduction in speed of the second component. The fluidic actuator may be used in a wafer processing system.