Patents Examined by Zachary M Davis
  • Patent number: 11512159
    Abstract: A curable composition for an electronic device, includes a curable material; and an oxide-containing complex; wherein the oxide-containing complex includes i) an oxide core and ii) an organic group chemically bound to an atom on a surface of the oxide core, the organic group includes a) a curable group reactable with the curable material and b) a linking group linking the atom on a surface of the oxide core to the curable group, and the oxide core includes an aluminum oxide, a silicon oxide, or a combination thereof.
    Type: Grant
    Filed: October 1, 2020
    Date of Patent: November 29, 2022
    Assignees: Samsung Display Co., Ltd., Myongji University Industry And Academia Cooperation Foundation
    Inventors: Sanggu Lee, Junhyup Lee, Yoongook Park, Intae Son, Onnuri Kim, Hoyun Byun, Younghye Son
  • Patent number: 11492519
    Abstract: Disclosed is a semiconductor package polyimide film, which may prevent the stripping of a thermoplastic polyimide layer by reducing a difference in the average coefficient of linear thermal expansion between a substrate film and the thermoplastic polyimide layer, and may be readily detached after a reflow process is completed since the thermoplastic polyimide layer to be attached to a lead frame has a glass transition temperature less than or equal to a reflow process temperature.
    Type: Grant
    Filed: June 18, 2019
    Date of Patent: November 8, 2022
    Assignee: IPI TECH INC
    Inventors: Kye Ung Lee, Ju Hwan Chun, Ho Young Park, Tae Seok Lee
  • Patent number: 11494011
    Abstract: An electronic device includes a substrate, a polarizer, a flexible printed circuit board, a first transparent glue layer, a first colloid, and a second colloid. The substrate includes a first side and a second side. The first side is opposite to the second side. The polarizer is disposed on the first side of the substrate. The flexible printed circuit board is connected to the first side of the substrate with a conductive glue. A gap is formed between flexible circuit board and polarizer. The first transparent glue layer is disposed on the second side of substrate. The first colloid is configured to bond at least two of substrate, polarizer, or flexible printed circuit board. The second colloid is configured to bond at least two of the substrate, the flexible printed circuit board, or the first transparent glue layer. The first colloid is not in contact with the second colloid.
    Type: Grant
    Filed: January 14, 2021
    Date of Patent: November 8, 2022
    Assignee: TPK Advanced Solutions Inc.
    Inventors: Xian Bin Xu, Ming Qiang Fu, Shi Yuan Lian, Yong Hui Huang, Xiong Min Zhang, Chen Hsin Chang
  • Patent number: 11485872
    Abstract: The instant invention is an aqueous based blend composition and method of producing the same. The aqueous based blend composition comprises (a) an aqueous polyolefin dispersion comprising the melt blending product of one or more base polymers and one or more stabilizing agents in the presence of water and optionally one or more neutralizing agents, wherein the polyolefin dispersion has an average volume particle size diameter in the range of from 400 to 1500 nm; and a pH range from 8 to 11; and (b) an acrylic emulsion acrylic solids having an average weight particle size diameter in the range of from 75 to 450 nm; an acid level in the range of from 0.25 to 5 percent by weight of acid monomers based on the weight of the acrylic monomer, and a weight average molecular weight in the range of from 200,000 to 5,000,000 g/mole, and a glass transition temperature (Tg) in the range of from 7 to 100┬░ C.
    Type: Grant
    Filed: May 16, 2013
    Date of Patent: November 1, 2022
    Assignees: Dow Global Technologies LLC, Rohm and Haas Company
    Inventors: Denise Lindenmuth, Joceyln Gruver, Ann R. Hermes, Ray E. Drumright
  • Patent number: 11485840
    Abstract: The present invention provides polymer blends that can be used in a multilayer structure and to multilayer structures comprising one or more layers formed from such blends. In one aspect, a polymer blend comprises (a) a copolymer comprising ethylene and at least one of acrylic acid and methacrylic acid having an acid content of 2 to 21 weight percent based on the weight of the copolymer, wherein the amount of copolymer (a) comprises 20-80 weight percent of the blend based on the total weight of the blend, and (b) a copolymer comprising ethylene and at least one of methyl acrylate and ethyl acrylate having an acrylate content of 5 to 30 weight percent based on the weight of the copolymer, wherein the amount of copolymer (b) comprises 10 to 50 weight percent of the blend based on the total weight of the blend, wherein the amount of copolymer (a) and copolymer (b) is at least 70 weight percent of the blend based on the total weight of the blend.
    Type: Grant
    Filed: January 11, 2017
    Date of Patent: November 1, 2022
    Assignee: Dow Global Technologies LLC
    Inventors: Andong Liu, Guihong Liao, Jianping Pan, Peng Gao, Hongyu Chen, Yi Zhang
  • Patent number: 11479699
    Abstract: The present invention relates to an adhesive film for a semiconductor, including: a first layer including an adhesive binder and a heat-dissipating filler; and a second layer including an adhesive binder and a magnetic filler, which is formed on at least one surface of the first layer, wherein the adhesive film has a predetermined composition for the adhesive binder included in each of the first layer and the second layer.
    Type: Grant
    Filed: December 20, 2018
    Date of Patent: October 25, 2022
    Assignee: LG CHEM, LTD.
    Inventors: Jong Min Jang, Heejung Kim, Kwang Joo Lee
  • Patent number: 11459758
    Abstract: A protective composite provides for insulating a building. The protective composite includes integrated layers. One layer is a thermal reflective layer having a reflective surface. Another layer is an air retaining material layer including a material retaining air therein. Another layer is a water repelling material layer. Thereby the protective composite includes two or more of the layers connectable to a building, building material, or other item, e.g. solar panel.
    Type: Grant
    Filed: April 22, 2022
    Date of Patent: October 4, 2022
    Assignee: Blum Family, LLC
    Inventor: Ronald Blum
  • Patent number: 11447664
    Abstract: The present disclosure relates to a color wrapping film for a vehicle, which has an excellent impact resistance and excellent scratch restorability due to a base layer and a coating layer formed of a polyurethane-based material, and suppresses discoloration caused by an external environment by adding a color pigment to a separate layer.
    Type: Grant
    Filed: June 14, 2021
    Date of Patent: September 20, 2022
    Assignee: STEK CO., LTD.
    Inventors: Inhwan Oh, Subin Park, Seunghwan Baek
  • Patent number: 11452218
    Abstract: A display device includes a display module and a housing. At least one roller is disposed in the housing. The display module is configured to be wound on the at least one roller and to be inserted and drawn from the housing. The display module comprises a display panel, a window on the display panel and an adhesion layer between the display panel and the window. The adhesion layer comprises a first polymer layer having positive charges and a second polymer layer having negative charges. The second polymer layer is directly disposed on the first polymer layer.
    Type: Grant
    Filed: April 21, 2020
    Date of Patent: September 20, 2022
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Jinhwan Choi, Hyunwoo Koo, Taewoong Kim, Dongwon Choi, Kachatryan Hayk
  • Patent number: 11434403
    Abstract: Provided are a thermally conductive composition that exhibits high adhesive force to an adherend such as a heat-generating element or a heat-dissipating element after curing, and a thermally conductive member in which a cured product of the thermally conductive composition and the adherend are integrated with each other. The thermally conductive composition includes a mixture containing an addition-reaction-type silicone, a thermally conductive filler that includes a metal hydroxide in an amount of 80% by volume or more in terms of volume ratio, and an acryloyl-group-containing silane coupling agent. A thermally conductive member 21 includes a cured body 12 of the thermally conductive composition and an adherend 13 fixed to the cured body 12.
    Type: Grant
    Filed: May 31, 2016
    Date of Patent: September 6, 2022
    Assignee: SEKISUI POLYMATECH CO., LTD.
    Inventor: Hiroya Endo
  • Patent number: 11427735
    Abstract: The disclosure provides a thermal bending-free photocuring curved screen protective paster which comprises a first protective film, an OCA glue layer, a main functional layer, a PET film layer, a surface functional layer and a second protective film sequentially arranged from bottom to top. The protective paster of the disclosure can be well attached to a curved screen and the like, and avoids the phenomena of warping, forming failure, springback and the like occurring after the traditional protective film is attached. The protective paster of the disclosure has good wear resistance, good anti-scraping effect, good transparency, good temperature resistance and stable structure, which can be prepared into a film with any angle, can be firmly attached to a curved screen with a large radian, and can effectively protect the curved screen.
    Type: Grant
    Filed: May 19, 2020
    Date of Patent: August 30, 2022
    Assignee: Dongguan Boyide Science and Technology Industry Co., Ltd.
    Inventors: Cundong Dong, Yongxin Qin, Peng Zhao, Kun Chen
  • Patent number: 11426970
    Abstract: A laminated uncured sheet of the present disclosure has a structure in which resin sheet layers and resin layers are alternately laminated and a through hole penetrating in the laminating direction is formed, wherein the resin sheet layers are formed with a thermosetting resin composition containing a thermosetting resin as a main component, the resin layers are formed with a thermoplastic resin composition containing a thermoplastic resin, and the thermoplastic resin composition is adhered to the inner wall surface of the resin sheet layer part in the through hole.
    Type: Grant
    Filed: June 20, 2019
    Date of Patent: August 30, 2022
    Assignee: KYOCERA CORPORATION
    Inventors: Tadashi Nagasawa, Satoshi Yoshiura, Chie Chikara, Satoshi Kajita, Yasuhide Tami
  • Patent number: 11429159
    Abstract: A tape structure, a display panel and a display device utilizing the tape structure is provided. The tape structure includes a first adhesive layer, a supporting layer, and a second adhesive layer. The first adhesive layer extends along a first direction and has a first surface. The supporting layer is disposed on the first surface and includes a plurality of supporting units. A part of the second adhesive layer is attached to the first surface. The supporting layer is covered by the first adhesive layer and the second adhesive layer located at the side of the supporting layer opposite to the first surface.
    Type: Grant
    Filed: January 13, 2020
    Date of Patent: August 30, 2022
    Assignee: AU OPTRONICS CORPORATION
    Inventor: Ching-Feng Hsu
  • Patent number: 11432374
    Abstract: A PTC heating device exhibits a good degree of efficiency while providing good electrical insulation of the device's PTC element. The insulation of the PTC heating device comprises a film and a layer that is bonded to the film and made of brown compact which comprises non-sintered ceramic particles. Also disclosed is a method in which ceramic particles are provided with a binding agent, and the mass thus produced is applied in a planar manner onto a film and bonded to the film. The multilayer insulation thus produced is placed around the PTC element and the conductor tracks, and the binding agent is subsequently removed, at least in part.
    Type: Grant
    Filed: April 26, 2021
    Date of Patent: August 30, 2022
    Assignee: Ebersp├Ącher catem GmbH & Co. KG
    Inventors: Kurt Walz, Michael Niederer, Ahmad Asafi, Tobias Semmler
  • Patent number: 11428041
    Abstract: A glass panel unit assembly includes a pair of glass substrates arranged to face each other, a peripheral wall, a partition, an air passage, and an evacuation port. The peripheral wall has a frame shape and is provided between the pair of glass substrates. The partition partitions an internal space, surrounded with the pair of glass substrates and the peripheral wall, into a first space and a second space. The air passage connects the first space and the second space together. The evacuation port connects the second space to an external environment. The partition has a broader width than the peripheral wall.
    Type: Grant
    Filed: March 7, 2019
    Date of Patent: August 30, 2022
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Tasuku Ishibashi, Eiichi Uriu, Kazuya Hasegawa, Hiroyuki Abe, Masataka Nonaka, Takeshi Shimizu, Haruhiko Ishikawa
  • Patent number: 11428008
    Abstract: Some embodiments of the present disclosure relate to a roofing system. In some embodiments, the roofing system includes a roofing membrane, which may include a cap, a scrim, and a core. In some embodiments, the roofing system may also include an adhesive film, which may include a first adhesive layer adhered to the roofing membrane, a second adhesive layer configured to adhere the roofing membrane to a roofing substrate, and a barrier layer positioned between the first and second adhesive layers. Methods of manufacturing roofing systems are also disclosed.
    Type: Grant
    Filed: September 27, 2021
    Date of Patent: August 30, 2022
    Assignee: BMIC LLC
    Inventor: Li-Ying Yang
  • Patent number: 11420429
    Abstract: Embodiments disclosed herein include multilayer cast films having a cling layer and a release layer, wherein the cling layer comprises (i) a first polyethylene composition, and (ii) ultra-low density polyethylene, very low density polyethylene, ethylene/alpha-olefin elastomer, propylene-based elastomer, or combinations thereof; and the release layer comprises a second polyethylene composition.
    Type: Grant
    Filed: December 17, 2018
    Date of Patent: August 23, 2022
    Assignee: Dow Global Technologies LLC
    Inventors: Mustafa Bilgen, Teresa P. Karjala, Jon W. Hobson, Hrishikesh R. Munj, Mehmet Demirors
  • Patent number: 11420832
    Abstract: Provided is a transport fixing jig that has a high gripping force, hardly contaminates an object to be processed (object to be transported), and is excellent in heat resistance. The transport fixing jig of the present invention includes: a first base material; a carbon nanotube aggregate; and an adhesive layer arranged between the first base material and the carbon nanotube aggregate, wherein the first base material and the carbon nanotube aggregate are bonded to each other via the adhesive layer, and wherein a ratio (adhesive layer/base material) between a linear expansion coefficient of the first base material and a linear expansion coefficient of the adhesive layer is from 0.7 to 1.8.
    Type: Grant
    Filed: March 14, 2017
    Date of Patent: August 23, 2022
    Assignee: NITTO DENKO CORPORATION
    Inventors: Shotaro Masuda, Tomoaki Ichikawa, Yohei Maeno, Yoshiharu Hatakeyama
  • Patent number: 11407200
    Abstract: An anisotropic composite material assembly comprising a first layer with a tensile modulus different from its compressive modulus and that exhibits variable modulus behavior. The first layer elastically buckle under compressions. A second layer has a tensile modulus substantially the same as its compressive modulus. The first and second layers are joined together, and the assembly is bendable in a first direction with an outer surface of the first layer being in compression and the assembly has a first bending stiffness during bending in the first direction. The assembly is bendable in a second direction opposite the first direction with the outer surface of the first layer being in tension, and the assembly has a second bending stiffness greater than the first bending stiffness during bending in the second direction.
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: August 9, 2022
    Assignee: Carbitex, Inc.
    Inventors: Junus Ali Khan, Tyler Andre Kafentzis, Kevin Lynn Simmons, Keshava Bhamidipaty
  • Patent number: 11396477
    Abstract: A pillar mounting method includes an accommodation step, a mounting step, and a displacement step. The accommodation step is a step of accommodating a plurality of pillars in storage with the plurality of pillars being stacked on each other. The mounting step is a step of pushing one pillar of the plurality of pillars accommodated in the storage out of the storage and mounting the one pillar on a substrate including a glass pane. The displacement step is a step of changing a relative location between the substrate and the storage. The mounting step and the displacement step are alternately repeated to mount the plurality of pillars in a predetermined arrangement on the substrate such that the plurality of pillars are apart from each other.
    Type: Grant
    Filed: May 16, 2018
    Date of Patent: July 26, 2022
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Masataka Nonaka, Takeshi Shimizu, Haruhiko Ishikawa, Eiichi Uriu, Kazuya Hasegawa, Tasuku Ishibashi, Hiroyuki Abe