Abstract: A silicon carbide epitaxial substrate includes a silicon carbide single crystal substrate and a silicon carbide layer. In a direction parallel to a central region, a ratio of a standard deviation of a carrier concentration of the silicon carbide layer to an average value of the carrier concentration of the silicon carbide layer is less than 5%. The average value of the carrier concentration is more than or equal to 1×1014 cm?3 and less than or equal to 5×1016 cm?3. In the direction parallel to the central region, a ratio of a standard deviation of a thickness of the silicon carbide layer to an average value of the thickness of the silicon carbide layer is less than 5%. The central region has an arithmetic mean roughness (Sa) of less than or equal to 1 nm. The central region has a haze of less than or equal to 50.

Abstract: A curable composition for an electronic device, includes a curable material; and an oxide-containing complex; wherein the oxide-containing complex includes i) an oxide core and ii) an organic group chemically bound to an atom on a surface of the oxide core, the organic group includes a) a curable group reactable with the curable material and b) a linking group linking the atom on a surface of the oxide core to the curable group, and the oxide core includes an aluminum oxide, a silicon oxide, or a combination thereof.

Abstract: An electronic device includes a substrate, a polarizer, a flexible printed circuit board, a first transparent glue layer, a first colloid, and a second colloid. The substrate includes a first side and a second side. The first side is opposite to the second side. The polarizer is disposed on the first side of the substrate. The flexible printed circuit board is connected to the first side of the substrate with a conductive glue. A gap is formed between flexible circuit board and polarizer. The first transparent glue layer is disposed on the second side of substrate. The first colloid is configured to bond at least two of substrate, polarizer, or flexible printed circuit board. The second colloid is configured to bond at least two of the substrate, the flexible printed circuit board, or the first transparent glue layer. The first colloid is not in contact with the second colloid.

Abstract: Disclosed is a semiconductor package polyimide film, which may prevent the stripping of a thermoplastic polyimide layer by reducing a difference in the average coefficient of linear thermal expansion between a substrate film and the thermoplastic polyimide layer, and may be readily detached after a reflow process is completed since the thermoplastic polyimide layer to be attached to a lead frame has a glass transition temperature less than or equal to a reflow process temperature.

Abstract: The present invention provides polymer blends that can be used in a multilayer structure and to multilayer structures comprising one or more layers formed from such blends. In one aspect, a polymer blend comprises (a) a copolymer comprising ethylene and at least one of acrylic acid and methacrylic acid having an acid content of 2 to 21 weight percent based on the weight of the copolymer, wherein the amount of copolymer (a) comprises 20-80 weight percent of the blend based on the total weight of the blend, and (b) a copolymer comprising ethylene and at least one of methyl acrylate and ethyl acrylate having an acrylate content of 5 to 30 weight percent based on the weight of the copolymer, wherein the amount of copolymer (b) comprises 10 to 50 weight percent of the blend based on the total weight of the blend, wherein the amount of copolymer (a) and copolymer (b) is at least 70 weight percent of the blend based on the total weight of the blend.

Abstract: The instant invention is an aqueous based blend composition and method of producing the same. The aqueous based blend composition comprises (a) an aqueous polyolefin dispersion comprising the melt blending product of one or more base polymers and one or more stabilizing agents in the presence of water and optionally one or more neutralizing agents, wherein the polyolefin dispersion has an average volume particle size diameter in the range of from 400 to 1500 nm; and a pH range from 8 to 11; and (b) an acrylic emulsion acrylic solids having an average weight particle size diameter in the range of from 75 to 450 nm; an acid level in the range of from 0.25 to 5 percent by weight of acid monomers based on the weight of the acrylic monomer, and a weight average molecular weight in the range of from 200,000 to 5,000,000 g/mole, and a glass transition temperature (Tg) in the range of from 7 to 100° C.

Abstract: The present invention relates to an adhesive film for a semiconductor, including: a first layer including an adhesive binder and a heat-dissipating filler; and a second layer including an adhesive binder and a magnetic filler, which is formed on at least one surface of the first layer, wherein the adhesive film has a predetermined composition for the adhesive binder included in each of the first layer and the second layer.

Abstract: A protective composite provides for insulating a building. The protective composite includes integrated layers. One layer is a thermal reflective layer having a reflective surface. Another layer is an air retaining material layer including a material retaining air therein. Another layer is a water repelling material layer. Thereby the protective composite includes two or more of the layers connectable to a building, building material, or other item, e.g. solar panel.

Abstract: A display device includes a display module and a housing. At least one roller is disposed in the housing. The display module is configured to be wound on the at least one roller and to be inserted and drawn from the housing. The display module comprises a display panel, a window on the display panel and an adhesion layer between the display panel and the window. The adhesion layer comprises a first polymer layer having positive charges and a second polymer layer having negative charges. The second polymer layer is directly disposed on the first polymer layer.

Abstract: The present disclosure relates to a color wrapping film for a vehicle, which has an excellent impact resistance and excellent scratch restorability due to a base layer and a coating layer formed of a polyurethane-based material, and suppresses discoloration caused by an external environment by adding a color pigment to a separate layer.

Abstract: Provided are a thermally conductive composition that exhibits high adhesive force to an adherend such as a heat-generating element or a heat-dissipating element after curing, and a thermally conductive member in which a cured product of the thermally conductive composition and the adherend are integrated with each other. The thermally conductive composition includes a mixture containing an addition-reaction-type silicone, a thermally conductive filler that includes a metal hydroxide in an amount of 80% by volume or more in terms of volume ratio, and an acryloyl-group-containing silane coupling agent. A thermally conductive member 21 includes a cured body 12 of the thermally conductive composition and an adherend 13 fixed to the cured body 12.

Abstract: The disclosure provides a thermal bending-free photocuring curved screen protective paster which comprises a first protective film, an OCA glue layer, a main functional layer, a PET film layer, a surface functional layer and a second protective film sequentially arranged from bottom to top. The protective paster of the disclosure can be well attached to a curved screen and the like, and avoids the phenomena of warping, forming failure, springback and the like occurring after the traditional protective film is attached. The protective paster of the disclosure has good wear resistance, good anti-scraping effect, good transparency, good temperature resistance and stable structure, which can be prepared into a film with any angle, can be firmly attached to a curved screen with a large radian, and can effectively protect the curved screen.

Abstract: A laminated uncured sheet of the present disclosure has a structure in which resin sheet layers and resin layers are alternately laminated and a through hole penetrating in the laminating direction is formed, wherein the resin sheet layers are formed with a thermosetting resin composition containing a thermosetting resin as a main component, the resin layers are formed with a thermoplastic resin composition containing a thermoplastic resin, and the thermoplastic resin composition is adhered to the inner wall surface of the resin sheet layer part in the through hole.

Abstract: Some embodiments of the present disclosure relate to a roofing system. In some embodiments, the roofing system includes a roofing membrane, which may include a cap, a scrim, and a core. In some embodiments, the roofing system may also include an adhesive film, which may include a first adhesive layer adhered to the roofing membrane, a second adhesive layer configured to adhere the roofing membrane to a roofing substrate, and a barrier layer positioned between the first and second adhesive layers. Methods of manufacturing roofing systems are also disclosed.

Abstract: A glass panel unit assembly includes a pair of glass substrates arranged to face each other, a peripheral wall, a partition, an air passage, and an evacuation port. The peripheral wall has a frame shape and is provided between the pair of glass substrates. The partition partitions an internal space, surrounded with the pair of glass substrates and the peripheral wall, into a first space and a second space. The air passage connects the first space and the second space together. The evacuation port connects the second space to an external environment. The partition has a broader width than the peripheral wall.

Abstract: A tape structure, a display panel and a display device utilizing the tape structure is provided. The tape structure includes a first adhesive layer, a supporting layer, and a second adhesive layer. The first adhesive layer extends along a first direction and has a first surface. The supporting layer is disposed on the first surface and includes a plurality of supporting units. A part of the second adhesive layer is attached to the first surface. The supporting layer is covered by the first adhesive layer and the second adhesive layer located at the side of the supporting layer opposite to the first surface.

Abstract: A PTC heating device exhibits a good degree of efficiency while providing good electrical insulation of the device's PTC element. The insulation of the PTC heating device comprises a film and a layer that is bonded to the film and made of brown compact which comprises non-sintered ceramic particles. Also disclosed is a method in which ceramic particles are provided with a binding agent, and the mass thus produced is applied in a planar manner onto a film and bonded to the film. The multilayer insulation thus produced is placed around the PTC element and the conductor tracks, and the binding agent is subsequently removed, at least in part.

Abstract: Embodiments disclosed herein include multilayer cast films having a cling layer and a release layer, wherein the cling layer comprises (i) a first polyethylene composition, and (ii) ultra-low density polyethylene, very low density polyethylene, ethylene/alpha-olefin elastomer, propylene-based elastomer, or combinations thereof; and the release layer comprises a second polyethylene composition.

Abstract: Provided is a transport fixing jig that has a high gripping force, hardly contaminates an object to be processed (object to be transported), and is excellent in heat resistance. The transport fixing jig of the present invention includes: a first base material; a carbon nanotube aggregate; and an adhesive layer arranged between the first base material and the carbon nanotube aggregate, wherein the first base material and the carbon nanotube aggregate are bonded to each other via the adhesive layer, and wherein a ratio (adhesive layer/base material) between a linear expansion coefficient of the first base material and a linear expansion coefficient of the adhesive layer is from 0.7 to 1.8.

Abstract: An anisotropic composite material assembly comprising a first layer with a tensile modulus different from its compressive modulus and that exhibits variable modulus behavior. The first layer elastically buckle under compressions. A second layer has a tensile modulus substantially the same as its compressive modulus. The first and second layers are joined together, and the assembly is bendable in a first direction with an outer surface of the first layer being in compression and the assembly has a first bending stiffness during bending in the first direction. The assembly is bendable in a second direction opposite the first direction with the outer surface of the first layer being in tension, and the assembly has a second bending stiffness greater than the first bending stiffness during bending in the second direction.