Abstract: A supporting glass substrate has a ratio of a Young's modulus (GPa) to a density (g/cm3) that is 37.0 (GPa·cm3/g) or more and the ratio has a value larger than a ratio calculation value, the ratio calculation value being a ratio of a Young's modulus (GPa) calculated from a composition to a density (g/cm3). The ratio calculation value is represented by the following expression: ?=2·?{(Vi·Gi)/Mi·Xi}, where, in the expression, Vi is a filling parameter of a metal oxide contained in the supporting glass substrate, Gi is a dissociation energy of a metal oxide contained in the supporting glass substrate, Mi is a molecular weight of a metal oxide contained in the supporting glass substrate, and Xi is a molar ratio of a metal oxide contained in the supporting glass substrate.

Abstract: The present disclosure relates to a decorative panel, comprising a layered structure with a plate-shaped carrier on which there are provided a decorative substrate and a decorative layer applied to the decorative substrate, wherein the decorative panel further comprises in its layered structure at least one protective layer applied to the decorative layer, wherein the decorative panel comprises in its layered structure at least one stability layer, wherein the stability layer contains polyurethane, and wherein the stability layer has a density of >0.8 g/cm3. Such a decorative panel can particularly have improved stability.

Abstract: A film-shaped packaging material for a cell in which a coating layer is provided as the outermost layer instead of a substrate layer and an adhesive layer in a conventional film-shaped packaging material for a cell, thereby making it possible to produce a thinner film; wherein the packaging material is provided with exceptional moldability and insulation performance and enables lead time to be reduced. The packaging material is a laminate having at least a coating layer, a barrier layer, and a sealant layer in the stated order, the coating layer including a single- or multiple-layer configuration formed by a cured product of a resin composition containing a heat-curable resin and curing accelerator, the laminate having a piercing strength of at least 5 N, as measured in compliance with JIS 1707:1997, and the coating layer having a breakdown voltage of at least 1.0 kV, as measured in compliance with JIS C2110-1.

Abstract: The present invention provides an adhesive resin layer, which can prevent generation of air bubbles even when adhered to a substrate having a high level difference, and can maintain transparency, an adhesive resin film, a laminate, and a method of producing a laminate. More specifically, the present invention is a monolayered adhesive resin layer comprising an acrylic-based adhesive resin composition having transparency, wherein the adhesive resin composition contains an acrylic-based polymer, an acrylic-based monomer, and a thermopolymerization initiator, and an adhesive resin layer has pressure sensitive adhesiveness on both surfaces at an ambient temperature, and can be thermally cured by heating at a temperature of 100 to 250° C. and a time of 30 seconds to 10 minutes.

Abstract: Disclosed herein are various embodiments of a protective packaging system suitable for use with a prefinished building article. The protective packaging system generally is designed to reduce shrink back of the flexible substrate after tension is applied. The protective packaging system generally comprises at least one outer layer, at least one core layer and at least one adhesive layer. One or more layers of the protective packaging system may include a roughening agent such that the flexible substrate will not “gloss” or burnish a coating on a prefinished building article.

Abstract: A sealing membrane including: a) a thermoplastic polyolefin membrane and b) a barrier film including b1) a barrier layer including at least one polymer selected from ethylene-vinyl alcohol copolymer, polyamide or polyester and b2) an outer layer, wherein the barrier film is laminated over the full surface area or over part of the surface area onto the polyolefin membrane, and so the outer layer is connected directly to the polyolefin membrane, and the outer layer and the polyolefin membrane are both ethylene-based or the outer layer and the polyolefin membrane are both propylene-based. The sealing membrane can be produced at low cost and has a stable interconnecting bond. It is suitable in particular for sealing in building construction or civil engineering work.

Abstract: An anisotropic conductive film has a first insulating resin layer and a second insulating resin layer. The first insulating resin layer is formed of a photopolymerized resin, the second insulating resin layer is formed of a thermo-cationically or thermo-anionically polymerizable resin, a photo-cationically or photo-anionically polymerizable resin, a thermo-radically polymerizable resin, or a photo-radically polymerizable resin, and conductive particles for anisotropic conductive connection are disposed in a single layer on a surface of the first insulating resin layer on a side of the second insulating resin layer. The elastic modulus of the anisotropic conductive film as a whole is 0.13 MPa or more.

Abstract: The present invention relates to an adhesive film for a semiconductor that can more easily bury unevenness such as through wires of a semiconductor substrate or a wire attached to a semiconductor chip and the like, and yet can be applied to various cutting methods without specific limitations to realize excellent cuttability, thus improving reliability and efficiency of a semiconductor packaging process.

Abstract: A first multilayer shrink film has an outer polyester layer, an inner 02-barrier layer, and a tie layer between the polyester layer and the barrier layer. A second multilayer film an outer polyester layer, an inner polyamide layer, and a tie layer between the polyester and polyamide layers. The tie layer comprises a styrene-based polymer, and the tie layer in the second film comprises an anhydride functional styrene based copolymer. Included are a packaging article comprising the film, a packaging process utilizing the film, a process for making the film, and a packaged product comprising a packaging article made the film, with a product inside the package.

Abstract: The present disclosure relates to highly reflective coating formulations that produce coatings having an average infrared reflectivity ranging from about 75% to about 90% at wavelengths ranging from about 0.5 ?m to about 1000 ?m, methods for making the coatings and coating mixtures, and substrates comprising such coatings.

Abstract: The purpose of the present invention is to provide a heat-retaining article exhibiting excellent heat retention. This heat-retaining article (1) is configured so as to be provided with a first sheet (12), a second sheet (13), and a filler material (15) positioned between the first sheet (12) and the second sheet (13), and is characterized by being equipped with a plurality of joining sections (11) for joining the first sheet (12) and the second sheet (13) to one another, and in that the plurality of joining sections (11) are separated from one another and form a dot pattern.

Abstract: Fiber-reinforced nonwoven composites having a wide variety of uses (e.g., leisure goods, aerospace, electronics, equipment, energy generation, mass transport, automotive parts, marine, construction, defense, sports and/or the like) are provided. The fiber-reinforced nonwoven composite includes a plurality of carbon fibers and a polymer matrix. The plurality of carbon fibers have an average fiber length from about 50 mm to about 125 mm. The fiber-reinforced nonwoven composite comprises a theoretical void volume from about 0% to about 10%.

Abstract: A veneer assembly comprises a face veneer comprising at least one of a wood or a wood composite, and a polyimide backing-layer bonded to the face veneer. The veneer assembly may include an adhesive material boding the face veneer and the polyimide backing-layer. The veneer assembly may be mounted to a substrate to form an aviation veneer panel.

Abstract: In accordance with the purpose(s) of the present disclosure, as embodied and broadly described herein, embodiments of the present disclosure, in one aspect, relate to macroporous photonic crystal membranes, structures including macroporous photonic crystal membranes, devices including macroporous photonic crystal membranes, methods of using macroporous photonic crystal membranes, methods of making macroporous photonic crystal membranes, and the like.

Abstract: A component comprising a first part and a second part, wherein a third part is positioned between the first and second parts, wherein: (iv) said first part comprises a polymeric material (A) which comprises a repeat unit of formula (XI) wherein t1, and w1 independently represent 0 or 1 and v1 represents 0, 1 or 2; (v) said second part comprises a polymeric material (B) which comprises a repeat unit of formula (XI) wherein t1, and w1 independently represent 0 or 1 and v1 represents 0, 1 or 2; and (vi) said third part comprises a polymeric material (C) which comprises a polymer having a repeat unit of formula —O-Ph-O-Ph-CO-Ph-??I and a repeat unit of formula —O-Ph-Ph-O-Ph-CO-Ph-??II wherein Ph represents a phenylene moiety.

Abstract: A pressure-sensitive adhesive sheet has a substrate and a pressure-sensitive adhesive layer laminated on at least one side of the substrate. The sheet is configured such that: pressure-sensitive adhesive force N1, occurring after the pressure-sensitive adhesive layer is attached to a stainless steel plate (430 BA plate) and is left at 23° C. for 10 seconds, is 1.0 [N/20 mm] or less; pressure-sensitive adhesive force N2, occurring after the pressure-sensitive adhesive layer is attached and is aged at 80° C. for 5 minutes, is 3.0 [N/20 mm] or more; and N2/N1 is 5.0 or more.

Abstract: An anisotropic composite material assembly comprising a first layer with a tensile modulus different from its compressive modulus and that exhibits variable modulus behavior. The first layer elastically buckle under compressions. A second layer has a tensile modulus substantially the same as its compressive modulus. The first and second layers are joined together, and the assembly is bendable in a first direction with an outer surface of the first layer being in compression and the assembly has a first bending stiffness during bending in the first direction. The assembly is bendable in a second direction opposite the first direction with the outer surface of the first layer being in tension, and the assembly has a second bending stiffness greater than the first bending stiffness during bending in the second direction.

Abstract: The invention provides a high strength stone plastic floor and manufacturing method thereof. The stone plastic floor comprises a PVC substrate and a surface layer on a surface of the PVC substrate. Compositions of PVC substrate comprise: PVC powder from 20 to 35 weight percent, calcium carbonate from 60 to 70 weight percent, stabilizer from 1 to 3 weight percent, flexibilizer from 1 to 3 weight percent, lubricants from 0.4 to 1 weight percent, and colorant from 0.4 to 1 weight percent. The high strength stone plastic floor does not contain plasticizer so environmental risks are completely avoided. The contractility is good. The high strength stone plastic floor is resistant to high temperature and direct sunlight. Compared with conventional stone plastic floor, lifespan of the present invention is prolonged. The PVC substrate of the floor can be combined with different layers and can integrate different advantages of other floors.

Abstract: The present invention relates to an adhesive composition for a semiconductor including: a thermoplastic resin having a glass transition temperature of ?10° C. to 20° C.; a curing agent containing a phenol resin having a softening point of 70° C. or more; a solid epoxy resin; and a liquid epoxy resin, wherein a weight ratio of the total contents of the solid epoxy resin and the liquid epoxy resin to the thermoplastic resin is 1.6 to 2.6, an adhesive film for a semiconductor including the adhesive composition for a semiconductor, a dicing die bonding film including an adhesive layer including the adhesive composition for a semiconductor, and a method for dicing a semiconductor wafer using the dicing die bonding film.

Abstract: A profile strip arrangement includes a profile strip made of a profile material. The profile strip has a first connecting area configured to form a connection to an edge area of a windshield of a motor vehicle, and has a second connecting area configured to form a connection to a part that is adjacent to the windshield. The first connecting area has a lower connecting section which interacts with an inside of the edge area of the windshield and which has at least one free surface section that is free of the profile material. The at least one free surface section is formed by a surface of an additional element that is made of a material that differs from that of the profile strip.