Abstract: An electronic device with a clip-fixed keyboard includes a cover; a first magnetic member moveably attached to the cover, a base, and a keyboard. A first resilient member is located between the cover and the first magnetic member. A second magnetic member is movable attached to the base. The keyboard includes a clipping portion engaged with the first magnetic member. The second magnetic member is moveable relative to the base in a first direction, to move the first magnetic member in a second direction which is perpendicular to the first direction, so that the first magnetic member disengages from the clipping portion.

Abstract: Disclosed are a displaying apparatus, a mobile electronic device, and a displaying frame. The displaying apparatus includes a mobile electronic device and a displaying frame. The mobile electronic device includes an electrical power contact, a circuit-breaking contact, and a battery circuit. The electrical power contact is electrically connected to the battery circuit, and the circuit-breaking contact is positioned corresponding to a control point of the battery circuit. The displaying frame includes a conductive part and an insulation part. When the mobile electronic device is disposed in the displaying frame, the conductive part is configured to press against the electrical power contact for transmitting electric power to the mobile electronic device, and the insulation part is configured to be inserted into the circuit-breaking contact to push the control point for breaking the battery circuit.

Abstract: A differential carrier electronic package has a package housing that is made of upper and lower portions that are sealed together, where the upper portion has high thermal conductive properties and the lower portion has low thermal conductive properties. The upper and lower portions are in thermal contact with an environment that is external to a differential carrier housing. The lower portion extends through an opening in the differential housing, thereby further being in thermal contact with a fluid within the differential housing. The package housing further has an electronic circuit that is attached to and in thermal conduction with the upper portion, within the package housing. The lower portion may have a connector portion formed in it for electrically connecting between external electrical devices and sources, the electronic circuit, and control devices within the differential housing.

Abstract: An electrode including a non-conductive substrate having a top surface and at least one channel extending therethrough, an electrically conductive trace material positioned adjacent a portion of the top surface of the non-conductive substrate and extending through the channel, and adapted for electrically coupling to a power source, and a second electrically conductive material that is inert or more corrosion resistant than the trace material. The second material is positioned adjacent to and entirely covering a top surface of the trace material. The electrode further includes a conductive hydrogel laterally offset from the trace material, the hydrogel may be positioned adjacent to a portion of a top surface of the second electrically conductive material.

Abstract: A system for dissipating thermal energy from electronic components disposed within a rotatable shaft includes an annular carrier shaft having one end formed to couple to an end of a rotor shaft. The system also includes a transmitter assembly. The transmitter includes an outer casing, a daughter board and a circuit board electronically coupled to the daughter board within an inner pocket of the transmitter housing. The circuit board comprises a strip of thermally conductive material. The transmitter assembly further includes a lid that at least partially seals the inner pocket. A contact surface of the lid is in thermal communication with the thermally conductive material of the circuit board and at least a portion of a top surface of the lid is thermally coupled to an inner surface of the carrier shaft during rotation thereof. A method for dissipating thermal energy away from the circuit board is also provided.

Abstract: A power semiconductor module, and an arrangement using the module. The module has a basic parallelepipedal shape with opposed pairs of main, longitudinal and narrow sides, a cooling device which is capable of carrying a flow of a cooling fluid, having a power electronics switch and a housing. The cooling device has a cooling volume with at least one cooling face and four connection devices which are arranged in pairs on the main sides. In addition, the connection devices carry the cooling fluid and are designed as a flow inflow and a flow outflow and as a return inflow and a return outflow, respectively. The power electronics switch has load input connection devices and load output connection devices which are arranged on one or both longitudinal sides and a control connection device which is arranged on a narrow side of the module.

Abstract: An electronic control unit is disclosed. The electronic control unit includes: a resin board; a power device that is surface-mounted on the resin board; a microcomputer that is configured to control the power device; first heat radiation means for radiating heat, the first heat radiation means being disposed on an opposite side of the resin board from the power device; and first heat conduction means for conducting the heat generated by the power device to the first heat radiation means.

Abstract: Solid structures for thermal management are provided. In one aspect, the solid structures can comprise a metal-ceramic composite member assembled to be in thermal contact with a heat source. The metal-ceramic composite member can be mechanically coupled to an assembly (e.g., an electronic assembly) containing the heat source, and can provide mechanical stability to such assembly. In another aspect, the solid structures can comprise an oxide member that covers a surface of the metal-ceramic composite member, forming a metal-ceramic-oxide interface at the surface. The thickness of the oxide member combined with the magnitude of its thermal conductivity relative to the thermal conductivity of the metal-ceramic composite member can permit heat transport substantially along a direction substantially parallel to the metal-ceramic-oxide interface, and can reduce heat transfer through such interface.

Abstract: A server rack sub-assembly includes at least one motherboard having a perimeter; a plurality of heat-generating electronic devices mounted on the motherboard in an area of the motherboard thermally decoupled from the motherboard perimeter; one or more brackets including heat transfer surfaces and attached to the motherboard along at least a portion of the motherboard perimeter; and a heat transfer device thermally coupled to the area of the motherboard that is thermally decoupled from the motherboard perimeter and the one or more brackets. The one or more brackets are adapted to receive a cooling airflow circulated over the bracket and to convectively transfer heat into the cooling airflow and are further adapted to couple the motherboard to a server rack assembly. The heat transfer device is arranged to conductively transfer heat from the one or more electronic devices to the brackets.

Abstract: An apparatus includes a display. The display may include a frame disposed at a bottom surface of the display. The apparatus may include a semiconductor chip. A heat pipe constructed of a thermally conductive material may be affixed to the frame. A surface of the heat pipe may oppose the semiconductor chip at a predetermined distance from the semiconductor chip.

Abstract: A power converter including a semiconductor module; a cooler having a pair of coolant pipes; a casing provided with a pair of openings, housing the semiconductor module and the cooler; and a pair of grommets being fitted to the pair of openings where the pair of coolant pipes are inserted into the pair of grommets. Each of the grommet includes: a grommet body having a through hole through which a corresponding coolant pipe is inserted and a sealing surface that intimately contacts an inner peripheral surface of a corresponding opening; and a guide provided to one end of the grommet body, with respect to a direction of inserting the coolant pipe, so as to be projected outward further than the sealing surface. Each of the grommet is embedded with a reinforcement member with at least a part of the reinforcement member being located in the guide.

Abstract: An electronic component includes a wiring substrate having a first surface and a second surface, an electronic component body mounted on a first surface side of the wiring substrate, an external electrode formed on a second surface side of the wiring substrate which is opposite to the first surface side, the external electrode being electrically connected to the electronic component body, a heat generating member having a conductive property and having a higher resistivity than the external electrode, and a heat insulating layer disposed between the electronic component body and the heat generating member, the heat insulating layer having an insulating property and being formed of a material different from an other material of the wiring substrate.

Abstract: A lock assembly is provided for releasably coupling a dome of a telecommunications enclosure to a base of the telecommunications enclosure. The lock assembly generally includes a housing having at least one stop, a slider disposed at least partly within the housing and moveable between an extended position for coupling the dome of the telecommunications enclosure to the base of the telecommunications enclosure and a retracted position for uncoupling the dome from the base, and a cam configured to rotate and move the slider between the retracted position and the extended position. The cam is engageable with the at least one stop of the housing to stop rotation of the cam when the slider moves to the retracted position and/or to stop rotation of the cam when the slider moves to the extended position.

Abstract: A power system including an uninterruptible power system (UPS) and a maintenance bypass panel (MBP) The UPS has an input to receive input power and an output to provide output power. The MBP has an input to receive the output power provided by the UPS and an output to provide the input power to the input of the UPS. A busbar is configured to couple one of the input of the UPS to the output of the MBP and the output of the UPS to the input of the MBP. The busbar has a first region to couple to one of the input and the output of the UPS, a second region to couple to one of the input and the output of the MBP, and a measurement region. A cover shields the busbar from inadvertent contact and includes a small diameter aperture to permit access to the measurement region of the busbar.

Abstract: A display device and a method of manufacturing the same are disclosed. The display device includes a first panel, a panel supporter including a bottom part in which the first panel is received, a first pad that is positioned on the bottom part of the panel supporter and attaches the first panel to the panel supporter, a second panel positioned on the first panel, a cover including a surface part covering a partial outer wall of the second panel, and a second pad that is positioned under the surface part of the cover and attaches the second panel to the cover.

Abstract: A display device includes a rear set cover, an upper end guide frame, a lower end guide frame, a panel, a first adhesive member, a second adhesive member, a panel driver, and a lower finishing material. The upper end guide frame is secured to an upper end portion inside the rear set cover, and coupled to the rear set cover. The lower end guide frame is secured to a lower end portion inside the rear set cover, and coupled to the rear set cover. The panel is secured to the upper end guide frame and lower end guide frame. The first adhesive member couples the upper end guide frame and panel. The second adhesive member couples the lower end guide frame and panel. The panel driver is placed inside the rear set cover, and drives the panel.

Abstract: In embodiments of a flexible display extendible assembly, an extendible assembly includes a slideable display guide integrated in a first housing part of an extendible electronic device. The extendible electronic device includes a flexible display that slide-engages into the first housing part of the extendible electronic device. The extendible assembly includes an extendible mechanism that is coupled in a second housing part of the extendible electronic device and to the slideable display guide. The first and second housing parts of the extendible electronic device slide-engage relative to each other. The extendible mechanism is implemented to extend as the first and second housing parts slide apart relative to each other, and also to retract as the first and second housing parts slide together relative to each other.

Abstract: A thermal energy storage apparatus that absorbs thermal energy from a heat-generating device is described. In one aspect, the thermal energy storage apparatus comprises a non-metal container and a phase-change material. The non-metal container is configured to receive the heat-generating device thereon. The phase-change material is contained in the non-metal container and configured to absorb at least a portion of heat from the heat-generating device through the non-metal container.

Abstract: The present application describes various embodiments regarding systems and methods for providing efficient heat rejection for a lightweight and durable compact computing system having a small form factor. The compact computing system can take the form of a desktop computer. The desktop computer can include a monolithic top case having an integrated support system formed therein, the integrated support system providing structural support that distributes applied loads through the top case preventing warping and bowing. A mixed flow fan is utilized to efficiently pull cooling air through the compact computing system.

Abstract: A continuous loop of thermally conductive material is provided with a first portion in frictional contact with a casing of an electronic device and a second portion located within a cooling region. The loop is advanced such that the first portion is located within the cooling region and the second portion is in frictional contact with the casing.