Abstract: An improved cooling mechanism for a power electronics device is provided. More specifically, a cooling mechanism is provided that includes an air passageway configured to allow cooling air to bypass a portion of a heatsink adjacent to the rectifier circuitry and direct cooling air into an area of the heatsink that is nearer to the inverter circuitry. Another embodiment employs an air passageway with an air directing structure configured to provide an air flow that impinges on a lateral surface of the heatsink. In another embodiment, the air directing structure is chosen to provide a turbulent air flow in the heat dissipating structure within the vicinity of the inverter circuitry.

Abstract: A system and method for cooling a plurality of connectors interfacing electrical and optical signals to circuit boards in an electronics cabinet, such as backplane connectors routing signals to circuit boards housed in card cage assemblies. Heat pipes coupled to the connectors efficiently remove heat from the connectors and sink the connector heat to a cold junction of a liquid cooling system, which cooling system may also extract heat from air flow cooling the circuit boards such that the system is room neutral, meaning that the ambient temperature remains constant during operation of the system. The heat connector cooling system is effective where connectors are outside of an air flow cooling envelope that may cool the circuit boards.

Abstract: The present invention provides a display panel including: a first input terminal group in which input terminals are disposed at intervals along first long side of a rectangular driver IC facing a panel end portion; a second input terminal group in which input terminals are disposed at intervals along the second long side of the driver IC facing a display section; a first wiring group connected to the first input terminal group, that extends under the first short side of the driver IC and extends out from between the driver IC and the panel body; and a second wiring group connected to the second input terminal group, that passes under the second long side of the driver IC and extends out from between the driver IC and the panel body.

Abstract: An electronic enclosure includes a first electronic module, a second electronic module, a third electronic module and a handle. The first electronic module is physically connected to the second electronic module and the third electronic module is physically connected to the second electronic module. The second electronic module vertically disengages from the first electronic module and the third electronic module horizontally disengages from the second electronic module. The handle forces sequenced orthogonal disconnection of the electronic modules such that the third electronic module horizontally disengages from the second electronic module prior to the second electronic module vertically disengages from the first electronic module.

Abstract: A desktop computing system having at least a central core surrounded by housing having a shape that defines a volume in which the central core resides is described. The housing includes a first opening and a second opening axially displaced from the first opening. The first opening having a size and shape in accordance with an amount of airflow used as a heat transfer medium for cooling internal components, the second opening defined by a lip that engages a portion of the airflow in such a way that at least some of the heat transferred to the air flow from the internal components is passed to the housing.

Abstract: A handheld, electromechanical device useful in mammalian body-care includes a one-piece housing, a unitary insert, and a removable cover. The one-piece housing has a single opening defined by a rim. The rim circumscribes a rim area, and the one-piece housing has a projected area that is substantially larger than the rim area. The unitary insert is dimensioned to be insertable through the opening defined by the rim, and it has a frame having disposed thereon electromechanical elements interconnected in an electrical circuit. The cover is arranged and configured to close the opening of the one-piece housing.

Abstract: An enclosure for electronics includes a chassis and an interface connector positioned within the chassis and configured to provide power. A fan shelf module is received within the chassis and has at least one fan to provide air flow through the chassis. The fan shelf module includes a pinout connector along a horizontal or vertical line of symmetry and configured to engage the interface connector and receive power therefrom, such that the fan shelf module is selectively installed in one of two opposing directions allowing a fan air flow direction to the chassis to be selected as either pulling air or pushing air through the chassis depending on the installed direction of the fan shelf module.

Abstract: A switchgear mounting assembly for a load center includes a base assembly, an electrical bus assembly, and a bracket. The base assembly includes a base and a central protrusion extending outwardly from the base. Bus bars are electrically connected and mechanically coupled to the central protrusion and include stabs, which extend radially outwardly from the central protrusion. The bracket is coupled to the central protrusion and includes supporting elements. Each supporting element maintains a corresponding electrical switching apparatus in electrical communication with a corresponding one of the stabs. The switchgear mounting assembly is therefore structured to mount the electrical switching apparatus in a radial array extending around the central protrusion.

Abstract: A heat dissipation lid that includes a plate having a first surface, an opposing second surface, and at least one sidewall extending from the plate second surface. The heat dissipation lid also includes at least one fluid delivery conduit and at least one fluid removal conduit, each extending between the plate first and second surface, and at least one spacing projection extending from the plate second surface to establish and maintain a desired distance between the plate second surface and a microelectronic device, when the heat dissipation lid is positioned to remove heat from the microelectronic device.

Abstract: The electronic device according to the Present Disclosure is an electronic device provided with a heat-dissipating portion and an electronic component socket that can accommodate, therein, an installable electronic component, wherein the electronic component socket has a thermal connecting portion for connecting thermally to the electronic component, and, when the electronic component is operating, the electronic component and the heat-dissipating portion are connected thermally through the thermal connecting portion.

Abstract: A system and method for cooling a plurality of electronics cabinets having horizontally positioned electronics assemblies. The system includes at least one blower configured to direct air horizontally across the electronics assemblies, and at least one intercooler configured to extract heat from the air flow such that the system is room neutral, meaning that the ambient temperature remains constant during operation of the system. A plurality of chassis backplanes and power supplies may also include an intercooler, wherein the intercoolers are electronically controlled such that the system is room neutral.

Abstract: An inverter, a sealing air duct, and a heat dissipation system are disclosed. The inverter includes: an enclosure having a first cavity and a second cavity that are isolated from each other and sealed; a magnetic conversion circuit including magnetic elements that is arranged in the first cavity; a power conversion circuit including power tubes that is arranged in the second cavity; a heatsink arranged at the bottom of the enclosure and located outside the first cavity and the second cavity; a sealing air duct arranged outside the second cavity, where the columnar pipeline is sealed at two ends, the bottom surface is formed by a side wall of the second cavity or a substrate of the heatsink, and the bottom surface includes an air inlet and an air outlet to communicate with the second cavity and the at least one columnar pipeline.

Abstract: Embodiments of the present disclosure are directed towards techniques and configurations for thermal management of an integrated circuit assembly using a jumping-drops vapor chamber. In one embodiment, an apparatus includes a die having a first side including a plurality of integrated circuit devices that are configured to generate heat when in operation, and a second side disposed opposite to the first side, and a vapor chamber including a liquid, an evaporator including a surface that is thermally coupled with the second side of the die, the evaporator being configured to evaporate the liquid to vapor, and a condenser including a superhydrophobic surface and configured to condense the vapor, wherein energy released from coalescence of condensed vapor on the superhydrophobic surface causes the condensed vapor to jump from the superhydrophobic surface of the condenser to the surface of the evaporator. Other embodiments may be described and/or claimed.

Abstract: Heat dissipation resources are allocated in an optical communications module based on the sensitivity of electrical and optoelectronic components of the module to temperature. Components that have a higher sensitivity to temperature are allocated a greater proportion of available heat dissipation resources than components that have a lower sensitivity to temperature. In addition, heat dissipation resources that are allocated to components that have different sensitivities to temperature are thermally decoupled from one another.

Abstract: Disclosed is both a method and apparatus for delivering cooling air to an electronics rack in a data room in an energy efficient manner. The present apparatus provides directionally delivered cooling air to an electronics rack with usage rates up to 90%. The tiles utilize angled directional vanes for delivering the cooling air. The tiles both conserve energy and increase the overall possible power usage for each cabinet. The tiles greatly increase the cooling efficiencies in the data room and conserve energy.

Abstract: An arm assembly is provided. The arm assembly includes a heat exchanger assembly, a plurality of electrical components thermally coupled to the heat exchanger assembly, and a number of electrical buses. Each electrical component is coupled to, and in electrical communication with, one electrical bus. A sealing compound is then applied to each electrical bus and to a limited number of the electrical components.

Abstract: A switchgear assembly includes a tank housing encapsulating switching contacts which are viewable through a transparent viewing port after illumination of the contacts. A reflective optical device for observing the position of the switching contacts is used to view the contacts at a safe distance outside of the tank housing through the transparent viewing port. An illuminating device is used to illuminate the switching contacts by directing the light from the illuminating device on the switch contacts.

Abstract: There is provided a switchboard including a boards each including an opening portion which is provided in a ceiling surface and configured to exhaust heat, and an intake portion which is provided in a lower portion and configured to taken in cooling air, a fan provided to cover the opening portion of a board of the boards and configured to exhaust air in a horizontal direction to cool the inside of the board, and a duct configured to supply the cooling air from the opening portion of a board not provided with the fan to the inside of the board provided with the fan.

Abstract: An electronic device includes: a semiconductor device; a heat-conductive resin, disposed above the semiconductor device, including a heat conductor and a resin; a linear carbon piece, disposed above the heat-conductive resin, to be thermally in contact with the heat conductor; and a heat spreader, disposed above the linear carbon piece, including a depressed portion having the heat-conductive resin.

Abstract: An electronic device comprises a casing, a heat generation source, an airflow guiding structure, and a jet flow generator. The casing includes an interior space. The airflow guiding structure is in contact with the heat generation source and has one air inlet. The jet flow generator, the heat generation source, and the airflow guiding structure together are situated within the interior space. The jet flow generator includes a nozzle which directs toward the air inlet of the airflow guiding structure at a distance apart. Airflows emitted by the jet flow generator through the nozzle travel at a velocity greater than 0.1 meters/second (m/s), causing a fluid pressure differential with the neighboring air and pulling air in the vicinity along the air inlet into the airflow guiding structure.