Patents Examined by Zidia T. Pittman
  • Patent number: 6612479
    Abstract: A method and apparatus for joining multiple layers of materials using an ultrasonic welding apparatus. The ultrasonic welding apparatus utilizes a sonotrode to perform a weld between at least the top and intermediate layer of the multi-layer member. Then, either the multi-layer member or the ultrasonic welding apparatus is rotated such that the bottom layer is positioned adjacent the sonotrode wherein the sonotrode forms a weld between at least the bottom layer and intermediate layer of the multi-layer member. The apparatus includes an ultrasonic welding gun having a C-shape frame including a base portion and a head portion. An ultrasonic welding device, including a sonotrode, is secured to the head portion and an anvil secured to the base portion. The ultrasonic welding gun is connected to a robot operative to position the ultrasonic welding gun to perform the welding operation.
    Type: Grant
    Filed: October 10, 2001
    Date of Patent: September 2, 2003
    Assignee: Ford Global Technologies, LLC
    Inventors: Oludele Olusegun Popoola, Daniel Edward Wilkosz, Larry Van Reatherford, Jan Birger Skogsmo, Robert Koehl, Ronald P. Cooper, Arnon Wexler
  • Patent number: 6479790
    Abstract: A method and system for dual laser shock peening an article are provided. The method allows for defining a spot pattern comprising a plurality of spots on a first surface of the article to be peened. The method further allows for defining a spot pattern comprising a plurality of spots on a second surface of the article to be peened. The first and second surfaces comprise mutually opposite surfaces relative to one another. Each one of the respective spots on the second surface is arranged to correspond to a respective spot on the first surface and comprising a plurality of matched pair of spots. A generating step allows for generating dual laser beams being respectively aligned to simultaneously impinge on each respective matched pair of spots.
    Type: Grant
    Filed: January 31, 2000
    Date of Patent: November 12, 2002
    Assignee: General Electric Company
    Inventors: Michael Evans Graham, John Dennis Jackson
  • Patent number: 6302313
    Abstract: So as to confirm bonding precision for assuring accurate bonding, a precision confirmation substrate composed of a transparent sheet member and a precision confirmation chip composed of a transparent sheet member are used; and a precision confirmation substrate positioning component for positioning and fixing the precision confirmation substrate is provided on a bonding station, the precision confirmation chip is held by suction to a tool and disposed above the precision confirmation substrate, images of the precision confirmation substrate and precision confirmation chip are detected by an optical probe, the precision confirmation substrate and precision confirmation chip are moved and positioned relative to each other, the precision confirmation chip is then placed on the precision confirmation substrate, and the superimposed precision confirmation substrate and precision confirmation chip are again detected by the optical probe.
    Type: Grant
    Filed: February 19, 1999
    Date of Patent: October 16, 2001
    Assignee: Kabushiki Kaisha Shinkawa
    Inventor: Yuji Tanaka
  • Patent number: 6277524
    Abstract: A lithium-ion-conductive solid electrolyte includes a lithium-ion-conductive substance expressed by a general formula Li2S-GeS2-X wherein “X” is at least one member selected from the group consisting of Ga2S3 and ZnS, or Li2S-SiS2-P2S5. It is superb in terms of stability and safety at elevated temperatures, since it is a crystalline solid of high ion conductivity. It can be applied to a solid electrolyte for lithium batteries.
    Type: Grant
    Filed: December 8, 1998
    Date of Patent: August 21, 2001
    Assignees: Toyota Jidosha Kabushiki Kaisha, Genesis Research Institute, Inc.
    Inventor: Ryoji Kanno
  • Patent number: 6270002
    Abstract: The present invention relates to a method and an apparatus for arranging fine balls serving as a ball bump particularly on electrodes on a semiconductor chip, electrodes on a semiconductor-mounting substrate, or electrodes on a semiconductor device. It is made possible to remove small-diameter balls by, firstly, using a pre-arrangement plate for arranging the balls and using two diameters for the ball trap holes of the pre-arrangement plate. Secondly, occurrence of a ball suction abnormality and the time required for sucking the balls is reduced by using the pre-arrangement plate and a ball feeder. Thirdly, a ball suction abnormality to the ball arrangement device is determined by detecting the air flow velocity in an evacuation route of the ball arrangement device.
    Type: Grant
    Filed: September 8, 1998
    Date of Patent: August 7, 2001
    Assignee: Nippon Micrometal Co., Ltd.
    Inventors: Nobuaki Hayashi, Kouhei Katoh
  • Patent number: 6268082
    Abstract: The present invention is to provide a production method of an active material for an alkaline secondary battery comprising: a step of mixing particles comprising particles mainly containing nickel hydroxide and particles of a metal cobalt or a cobalt compound in a mixer with a sealed structure comprising a heating means in the presence of oxygen and an alkaline aqueous solution while heating. An active material produced by the method allows a high utilization. And a battery assembled with a positive electrode using the active material has an excellent high ratio discharge characteristic, and hardly causes the capacity decline even at the time of recharging after leaving in the over discharge state for a long time.
    Type: Grant
    Filed: March 12, 1999
    Date of Patent: July 31, 2001
    Assignee: Toshiba Battery Co., Ltd.
    Inventors: Masayoshi Hiruma, Naomi Bando, Kunihiko Miyamoto, Makoto Wakabayashi
  • Patent number: 6264094
    Abstract: A method and apparatus for desoldering electronic components from a substrate. A vacuum is used to enhance the flow of a hot gas under an electronic component to reflow the solder connections attaching the electronic component to a substrate. Water vapor is added to the hot gas to increase the heat capacity of the hot gas. A system for periodically changing the direction of flow of the hot gas and vacuum under the electronic component is used to uniformly heat the solder connections. A method and apparatus for depositing underfill material between an electronic component and the substrate on which the electronic component is mounted. A vacuum is applied to enhance the flow of underfill material into the space between the electronic component and the substrate.
    Type: Grant
    Filed: February 23, 2000
    Date of Patent: July 24, 2001
    Assignee: International Business Machines Corporation
    Inventors: Wilton L. Cox, Joseph D. Poole, Kris A. Slesinger
  • Patent number: 6264095
    Abstract: A process of bonding metal parts to one another to form seamless, hollow metal articles, particularly made from beryllium. Tooling is assembled to the parts, prior to hot pressing, to cause pressure to be applied to selective portions of the parts. The parts, assembled together with the tooling, are then subjected to hot isostatic pressing at a temperature of about 1700° F. to 1750° F., and at a pressure of about 2000 psi to 2500 psi, for around 3 hours. The tooling surrounding the metal parts functions to limit the amount of compression of the parts. Articles formed by this process are particularly useful in space flight applications because they are formed of a homogeneous material. Strength of the bond is enhanced because no filler metal is used. The absence of a filler metal also eliminates any thermal stress problems as a result of differences in coefficients of thermal expansion.
    Type: Grant
    Filed: July 14, 1999
    Date of Patent: July 24, 2001
    Assignee: Swales Aerospace
    Inventors: Charles J. Stouffer, Patrick Bourke, James M. Marder, Lawrence H. Ryczek
  • Patent number: 6257480
    Abstract: In a jet soldering method, a substrate is held by an actuator and pre-heated by a pre-heater. The pre-heater has a shield member or the substrate is swung to equalize temperature distribution in the substrate. The substrate is then transferred over a primary jet soldering bath while dipping a treatment surface of the substrate in a primary solder jet, so that solder stick to the treatment surface of the substrate. Then, the substrate is transferred over a secondary jet soldering bath while dipping the treatment surface in a secondary solder jet, so that the solder sticking to the substrate is shaped. The transfer conditions of the substrate are differentiated between transfers over the primary jet soldering bath and the secondary jet soldering bath.
    Type: Grant
    Filed: June 29, 1999
    Date of Patent: July 10, 2001
    Assignee: Denso Corporation
    Inventors: Atushi Furumoto, Ataru Ichikawa, Tatsuya Kubo, Misao Tanaka, Mitsuhiro Sugiura, Kenji Arai
  • Patent number: 6250539
    Abstract: A method, which is for forming accurate low wire loop shapes or short wire loop shapes which are stable and which have a high shape retention force in devices in which height differences between first and second bonding points are small and the wiring distance is short, including the steps of bonding a ball formed at the end of the wire extending out of the capillary to the first bonding point, raising the capillary while delivering the wire, moving the capillary toward the second bonding point, and then raising the capillary diagonally upward.
    Type: Grant
    Filed: September 29, 1999
    Date of Patent: June 26, 2001
    Assignee: Kabushiki Kaisha Shinkawa
    Inventors: Shinichi Nishiura, Tooru Mochida
  • Patent number: 6250536
    Abstract: The invention relates to a method for manufacturing an electrode wire for an electrical discharge machining apparatus, which is composed of a core wire formed of Cu or Cu-alloy and a covering layer formed of brass. A brass tape is longitudinally applied around a core wire to provide a pipe, a seam formed by butting longitudinal edges of the brass tape is continuously welded to provide a composite wire, area-reduction process of reduction rate less than 65% is applied to the brass pipe by means of a squeezing die, a heat treatment at a temperature higher a recrystallization one of brass is applied to the composite pipe, and thereafter the composite wire is processed to be reduced in area through plural reducing dies step by step.
    Type: Grant
    Filed: May 13, 1999
    Date of Patent: June 26, 2001
    Assignee: Hitachi Cable Ltd.
    Inventors: Kiyoshi Shimojima, Seigi Aoyama, Hideo Kawano, Koichi Tamura, Takahiro Sato, Takamitsu Kimura, Masato Watabe
  • Patent number: 6241144
    Abstract: An apparatus and method for positioning a first piece relative to a second piece in a predefined position is disclosed. This apparatus has a tab and a slot. The tab projects from one of the first piece and the second piece and defines a preestablished configuration having a plurality of surfaces. The slot is positioned in the other one of the first piece and the second piece and defines a preestablished configuration having a plurality of surfaces. At least one of the plurality of surfaces of the tab and of the slot is defined by a generally arcuate configuration. At least one of the plurality of surfaces of the tab is in a frictional contacting relationship with at least one of the plurality of surfaces of the slot.
    Type: Grant
    Filed: September 30, 1999
    Date of Patent: June 5, 2001
    Assignee: Caterpillar Inc.
    Inventor: Stephane L. Mandon
  • Patent number: 6237832
    Abstract: An apparatus used in a process for supporting a printed circuit board during a wave soldering operation including a frame with a frame opening in which a surface of the frame supports the board and also serves as a reference surface for vertically positioning the board above the solder pool. The board is secured against the reference surface with spring loaded clamps. Stiffeners preferably being an aluminum extrusion having a Tee or angle cross section is mounted along the outside edge of the reference surface of the frame and has a second reference surface facing in a direction opposite the reference surface of the frame. The second reference surface on the extrusion is accessible for support by a slide rail so that the height of the reference surface of the frame above the surface of the pool is independent of the thickness of the board or frame.
    Type: Grant
    Filed: October 18, 1999
    Date of Patent: May 29, 2001
    Inventor: Henry Chung
  • Patent number: 6238819
    Abstract: A metal foam support, plus an electrode comprising same, as well as methods of making both, are disclosed, in which there is provided for both the support and the electrode a metal foam member with at least one stacked edge. The stacked edge has a plurality of layers to which a metal connection tab member can be secured. Such an electrode can serve as a negative electrode for a secondary battery.
    Type: Grant
    Filed: December 17, 1998
    Date of Patent: May 29, 2001
    Assignee: Stork, N.V.
    Inventors: Michael F. Cahill, Greg S. Shaw
  • Patent number: 6234380
    Abstract: Apparatus for inerting a wave soldering installation having a solder bath and a conveying system for producing one or more solder waves, in particular for soldering electric printed circuit boards, having an immersion box which is closed on all sides, shaped like a frame, can be immersed in the solder bath and which has porous pipes to distribute nitrogen, the pipes being arranged inside the immersion box in cage-like housings with outlet openings, the cage-like housings being designed such that the porous pipes are arranged therein in such a way that the porous pipes essentially cannot be struck by solder splashes produced during the operation of the wave soldering installation.
    Type: Grant
    Filed: February 12, 1999
    Date of Patent: May 22, 2001
    Assignee: L'Air Liquide, Societe Anonyme pour l'Etude et l'Exploitation des Procedes Georges Claude
    Inventor: Fernand Heine
  • Patent number: 6230962
    Abstract: A process for cooling soldered objects, according to which a liquid is applied onto the soldered object and is evaporated in an accelerated manner. According to a preferred embodiment the soldered object is cooled in a vapor phase soldering apparatus directly after removal from the vapor phase using the vapor phase soldering liquid. The advantages of the process consist in a greatly increased cooling rate of the soldered object and in an improved quality of the soldered joints.
    Type: Grant
    Filed: March 11, 1999
    Date of Patent: May 15, 2001
    Inventor: Helmut W. Leicht
  • Patent number: 6223976
    Abstract: A process for assembling titanium aluminide articles by diffusion brazing comprises the following steps: (a) Preparation of a homogenous mixture of a titanium aluminide powder A of 40 to 90 weight % and a powder B chemically wetting A and having an appreciably lower melting point; (b) formation of a paste by addition of an organic binder to the powder mixture; (c) depositing the paste plumb on the assembly gap; and, (d) heating the assembly in a vacuum furnace between 1000° C. and 1300° C. for a period of from a few minutes to 6 hours. This process is also of use for repairing and refacing titanium aluminide articles.
    Type: Grant
    Filed: September 16, 1998
    Date of Patent: May 1, 2001
    Assignee: Societe Nationale d'etude et de Construction de Moteurs d'Aviation “Snecma”
    Inventors: Jean-François Didier Clement, Jean-Pierre Ferte
  • Patent number: 6220499
    Abstract: A semiconductor device having C-4 solder connections is joined to a chip carrier having pads suitable for receiving the C-4 solder connections. Sacrificial solder is formed on the chip carrier pads and then planarized to result in a good, planar surface profile for joining to the semiconductor device.
    Type: Grant
    Filed: September 29, 1998
    Date of Patent: April 24, 2001
    Assignee: International Business Machines Corporation
    Inventors: Peter J. Brofman, Shaji Faroog, John U. Knickerbocker, Scott I. Langenthal, Sudipta K. Ray, Kathleen A. Stalter
  • Patent number: 6220503
    Abstract: A method and apparatus for desoldering electronic components from a substrate. A vacuum is used to enhance the flow of a hot gas under an electronic component to reflow the solder connections attaching the electronic component to a substrate. Water vapor is added to the hot gas to increase the heat capacity of the hot gas. A system for periodically changing the direction of flow of the hot gas and vacuum under the electronic component is used to uniformly heat the solder connections. A method and apparatus for depositing underfill material between an electronic component and the substrate on which the electronic component is mounted. A vacuum is applied to enhance the flow of underfill material into the space between the electronic component and the substrate.
    Type: Grant
    Filed: February 2, 1999
    Date of Patent: April 24, 2001
    Assignee: International Business Machines Corporation
    Inventors: Wilton L. Cox, Joseph D. Poole, Kris A. Slesinger
  • Patent number: 6213379
    Abstract: Friction plug welding (FPW) usage is advantageous for friction stir welding (FSW) hole close-outs and weld repairs in 2195 Al—Cu—Li fusion or friction stir welds. Current fusion welding methods of Al—Cu—Li have produced welds containing varied defects. These areas are found by non-destructive examination both after welding and after proof testing. Current techniques for repairing typically small (<0.25″) defects weaken the weldment, rely heavily on welders' skill, and are costly. Friction plug welding repairs increase strength, ductility and resistance to cracking over initial weld quality, without requiring much time or operator skill. Friction plug welding while pulling the plug is advantageous because all hardware for performing the weld can be placed on one side of the workpiece.
    Type: Grant
    Filed: August 26, 1998
    Date of Patent: April 10, 2001
    Assignee: Lockheed Martin Corporation
    Inventors: Riki Takeshita, Terry L. Hibbard