Abstract: There is disclosed herein a method for soldering an electronic component 10 having a heatspreader 14 on a bottom surface thereof and at least one lead 18 (e.g.

Abstract: Disclosed is a method of preventing a gold plate connector of a printed circuit board (PCB) from being contaminated during a soldering process. The disclosed method prevents the gold plate connector coupled with the printed circuit board from being contaminated during wave soldering of the printed circuit board after spreading flux over the printed circuit board on which electronic components are mounted, and the method includes the steps of: forming a strip mask in a form of a membrane by solidifying a masking solution after spreading the masking solution capable of being solidified over the gold plate connector of the printed circuit board, performing the spreading of the masking solution before the spreading of the flux; and removing the strip mask from the gold plate connector after performing the wave soldering. As a result, it is not necessary to perform a washing operation of the gold plate connector. The washing operation can be troublesome, time-consuming, and inconvenient.

Abstract: A HIP-bonded body of a beryllium member and a copper alloy member. The beryllium member comprises on its one side a thin layer of titanium, chromium, molybdenum or silicon as a diffusion inhibition layer. The beryllium member is HIP-bonded to the copper alloy member, with the diffusion inhibition layer situated between the two members. A layer of pure copper or pure nickel may be formed on the diffusion inhibition layer, as a bonding promotion layer. An aluminum layer may be formed on the surface of the beryllium member, as a stress relaxation layer on which the diffusion inhibition layer is formed. The bonded body has excellent bonding strength and thermal cycle resistance property, and can be obtained in economical manner.

Abstract: A micro-manipulator apparatus for precisely positioning the tip of an ultrasonic bonding tool or similar implement relative to a work piece includes a pantograph-like input manipulator mechanism coupled by a downward depending ball joint coupling to the rear end portion of a tool support plate comprising part of a follower mechanism.

Abstract: In a bonding apparatus such as a bump bonding apparatus, tape bonding apparatus or the like, a positioning claw which is used for positioning a semiconductor pellet on a bonding stage of the bonding apparatus is provided on a bonding head or on an XY table on which the bonding head is installed.

Abstract: A method of joining the ends of metal strip material together by positioning a consumable insert of weld filler material between the full thickness of the strip ends and below the lower surface of the strip ends a predetermined depth to establish a predetermined gap between the strip ends thus allowing for full arc penetration of the strip ends and providing a supply of the filler material to the root of the weld to be formed between the strip ends.

Abstract: An object of the present invention is to provide plate width center alignment method and apparatus for a welding machine, which can dispense with a detection driving device, which is simple in construction but can perform the detection from a position closest to a cutting-welding position, and which is high in plate width center alignment accuracy. Plate side edge detectors which are included in a plate width center alignment means for detecting plate widths of two cut plates and aligning plate width centers with each other, and which detect widthwise plate side edges of the two cut plates, are disposed on a movable frame provided with a cutting means and a welding means, elongated in the width direction of a web and movable in that direction.

Abstract: A process for manufacturing a wheel for a motor vehicle, in which a wheel spider and a rim ring are connected with one another by means of friction welding. At least one of these wheel parts consists of a magnesium alloy. The controlling of the speed of the start of the friction, of the friction and of the compression of the friction welding process, particularly of the deformation capacity, takes place as a function of physical characteristics of the magnesium alloy.

Abstract: The printed circuit board (PCB) header attachment station mounts a header (PCB) onto a PCB having pre-existing solder joints, such as underneath a direct mount IC chip. The apparatus applies a soldering paste to PCB lands configured to receive the pins of the header; nests the header component in stacked alignment with the PCB in order to bring the header pins into contact with the respective PCB lands; heats the PCB to a temperature approaching the reflow temperature of the solder in the pre-existing PCB solder joints; and actuates a compliant heating block or bar to heat the header pins to an extent sufficient for the pins to conduct enough heat to locally reflow the solder on the corresponding PCB lands without reflowing the solder in the pre-existing solder joints. The local reflow of the solder precludes solder reflow in the surrounding pre-existing joints which may coalesce under the direct mount IC chip and render the PCB defective.

Abstract: A method and apparatus for soldering wires of components on PC boards to a lead frame. Wires from the electronic components on a PC board supported by a fixture are led through respective pathways and particularly plated grooves on each side of the PC board. The wires within the pathways are held there by being adhered to a temporary fixture beneath the board until the wires are later affixed in their grooves by dipping the sides of the PC board in a solder pool. The excess wire tails are cut away. The PC board is then mounted on a lead frame, and the leads of the lead frame are aligned with respective pathways of the PC board. The PC board and lead frame are then dipped in solder which electrically connects the wires in their respective pathways to the leads of the lead frame.

Abstract: A method of forming a structural member by connecting end-to-end first and second tubular structures, with each tubular structure having an inner tubular member (1a, 1b) located within a co-extending outer tubular member (3a, 3b) . The inner tubular member (1a, 1b) is longer than the outer tubular member (3a, 3b). The inner and outer tubular members (1b, 3b) of the second tubular structure are movable relative to each other in an axial direction.

Abstract: An object of the invention is to surely bond a semiconductor chip onto a chip substrate by heat-melting a brazing filler metal as required. A die bonding apparatus which is provided with a substrate holder for holding a chip substrate, a collet for conveying and pressing a semiconductor chip onto the chip substrate held by the substrate holder, a heater for heat-melting a brazing filler metal interposed between the chip substrate and the semiconductor chip, a temperature sensor for detecting the heating temperature of the brazing filler metal, and controlling means for controlling the heater based on the temperature detected by the temperature sensor. The temperature sensor is disposed in the collet.

Abstract: There is described a device for welding motor-vehicle bodies, comprising a welding station provided with welding programmable robots, to which the floor panels of the bodies to be welded are fed along a vertical direction by a lifting device. The component elements of the sides of the body to be welded are brought to the assembling position by means of two locating gates, provided with self-propelled lower carriages, which are movable on rails between a working position, at the two sides of the floor panel of the body to be welded, and a waiting position, in which they may receive the component elements of the body sides. The elements of the rear part of the body are carried by a third locating frame arranged transversally between the two guiding rails of the side locating gates.

Abstract: Method of aligning a metallic solderable object to a glass plate comprising loading a solderable object onto an end effector of a robotically supported spindle of a spindle assembly, handing a support from the spindle assembly that extends beneath the axis of the spindle and has camming surfaces precisely aligned with the spindle axis, resiliently cradling a backing member on the support by use of a cam member adapted to fit against the support camming surface when the resiliency is overcome, positioning a glass plate on the backing member to overcome the resiliency of the backing member and cause the cam to engage the camming surfaces of the support and automatically obtain normality of the spindle axis with respect to the glass plate.

Abstract: First and second superalloy workpieces are inertia welded together by rotating the first workpiece to an initial contact speed greater than about 750 surface feet per minute, and frictionally engaging under a weld load the first and second workpieces to effect an inertia weld therebetween.

Abstract: A method of forming a bond structure wherein there are provided a conductive aluminum bond site (15), a gold wire (13) and a wedge bond tool (11). The gold wire is made to contact the aluminum bond site to provide an interface of the gold wire and the aluminum bond site. A mashing force (9) is applied at the interface with the wedge bond tool and ultrasonic energy (5,7) at an ultrasonic frequency above 165 KHz and preferably 193 KHz is applied at the interface for a period sufficient to cause bonding of the gold wire and the aluminum bond site with the application of ultrasonic energy commencing with the interface at room temperature, generally from about 15.degree. C. to about 25.degree. C. The ultrasonic frequency is generally applied for a period from about 0.5 to about 10 milliseconds.

Abstract: In a metal material bonding method, an insertion material, which has a lower melting point than that of metal materials to be bonded, is interposed between bonding end surfaces of the metal materials to be bonded. The metal materials to be bonded is heated and held to a temperature not lower than the melting point of the insertion material and not higher than the melting point of the metal materials to be bonded while applying pressure to bonding surfaces of the metal materials to be bonded. The insertion material is formed to have a size which is smaller than each of the bonding surfaces of the metal materials to be bonded.

Abstract: A bonding insert material mounting method includes the following steps. A bonding insert material having projections of a suitable shape formed on an outer periphery thereof at predetermined intervals is held by half-splittable holder into which joining members can be inserted in such a manner that the projections are held by the holder and that the bonding insert material is disposed at that area of the holder into which the joining members P can be inserted. One end of the holder on an end of one of the joining members is fitted so that one side of the bonding insert material is abutted against an end surface of the one joining member. An end of the other joining member is inserted into the other end of the holder, so that the end of the other joining member is abutted against the other side of the bonding insert material with a predetermined pressing force. Then, the holder is divided into two division members, and the holder is removed from the joining members.

Abstract: The invention relates to an oven for reflow soldering objects such as printed circuit boards. A temperature differential is established between the top and bottom surfaces of the board to allow gases liberated from solder paste within through-holes to escape, thereby preventing the formation of voids. The oven provides a flow of gas at a first temperature from an upper gas supplying means to the top side of the board. A flow of gas at a second temperature is directed at the bottom side of the board by a lower gas supplying means. According to one aspect of the invention, a portion of the gas supplied by the upper gas supplying means is captured by the lower gas supply means and is heated or cooled to the second temperature. According to another aspect of the invention, a number of pairs of independantly controllable upper and lower gas supplying means are arranged along a conveyor to provide a temperature profile to perform reflow soldering.

Abstract: Planishing or stress relief in a welded joint (34) is accomplished with a hammer (12) and a backing bar (26). The hammer is applied on a first side (1) to a first surface (31) of the structure (30). To indicate the proper position of the backing bar, a first magnet (20; 320) is associated with the hammer, and a magnetic sensor arrangement (24; 224; 300) is located on the other side (2) of the structure. In one embodiment, the sensor arrangement is a second magnet (24) which is held in place by the magnetic field (40) of the first magnet. In a second embodiment, the sensor includes a line array (262) of individual sensors, each associated with an indicator of a line array (264) of indicators. In a third embodiment, the sensor includes a line array (300) of two magnetic sensors, which are coupled to a differential indicator (324).