Patents by Inventor 2

2 has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250087334
    Abstract: Systems and methods are disclosed for managing therapeutic path routing based on mood evaluation data. In a therapy-providing system, therapy can be provided to a user according to preset therapeutic paths, each of which can lead the user through different therapeutic exercises and experiences. Mood evaluation data can be collected periodically or in response to certain therapy milestone events. Depending on the mood evaluation data, optionally including the time elapsed since the mood evaluation data was collected, a particular therapeutic path can be selected out of a set of possible therapeutic paths.
    Type: Application
    Filed: August 9, 2024
    Publication date: March 13, 2025
    Inventors: Alison DARCY, Jade 2. DANIELS
  • Publication number: 20230348752
    Abstract: The present invention relates to a water-soluble co-polyester polymer. The polymer of the present invention is used for inline coating of BOPET film manufacturing, coating of BOPET film used as primer for vacuum metallization and surface coating of Aluminum sheets. The polymer of the present invention provides wide range of printability performances and high metal to film bond strength with minimum gain in weight. The disclosed polymer also provides Tape Test resistant printing and retort resistant layered/composite film. The present invention also discloses a coating composition for preparing peelable sealable biaxially oriented films with desired peel strength, minimum/negligible hazing and negligible anti-fog properties.
    Type: Application
    Filed: October 23, 2019
    Publication date: November 2, 2023
    Inventors: Akshay Narayan MAIKAP, Tanushree 2. MAIKAP
  • Publication number: 20230267866
    Abstract: Provided is a display panel. The display panel includes multiple scanning lines, a gate driver circuit, and a timing controller. The timing controller is configured to: receive multiple data enable signals, generate a gate control signal, and provide the gate control signal for the gate driver circuit. The gate control signal includes a start signal, a first clock signal and a second clock signal. The multiple data enable signals are only within the active cycle. The timing controller is configured to generate a rising edge and a falling edge of the start signal within a time interval formed by a rising edge and a falling edge of a first data enable signal in the Nth frame cycle.
    Type: Application
    Filed: April 25, 2023
    Publication date: August 24, 2023
    Applicant: Xiamen Tianma Micro-Electronics Co., Ltd.
    Inventors: Sijian LUO, Changzhi (2) WU, Yumin XU
  • Publication number: 20200038393
    Abstract: The invention introduces a method of inhibiting abuse potential and psychosis associated with long term use of apomorphine. Apomorphine used for the treatment of motor symptoms in Parkinson's disease produces addiction, and psychosis. The present method shows that apomorphine plus buspirone combination in the ratio of 1:1 will not produce psychosis. The combination will not be addictive too.
    Type: Application
    Filed: August 2, 2018
    Publication date: February 6, 2020
    Inventors: Huma Ikram, 2. Darakhshan Jabeen Haleem, Rumaisa Zakir
  • Publication number: 20160263831
    Abstract: An additive manufacturing apparatus with assembled and dissembled feature includes a base having a cavity, a control circuit is installed in the cavity. An upper surface of the base defines a through hole for an electrical socket extending through the base and being exposed on the upper surface. A stand connecting member is provided on the upper surface. A material deposition device for depositing material is provided with a beam connecting member. A movable platform capable of moving along a Y axis direction for carrying the deposited material is provided with a column connecting member. A stand having a column, a beam is provided on a top of the column. The beam is provided with a material, deposition device connecting member. The column is provided with a movable platform connecting member.
    Type: Application
    Filed: February 27, 2014
    Publication date: September 15, 2016
    Inventors: Gen LI, Yang 2) SHEN, Zhihong LI, Wenjuan CHEN
  • Publication number: 20140313984
    Abstract: A multi-standard indoor mobile radio access network is provided. Preferred embodiments of the present invention operate in accordance with a plurality of radio heads and at least one gateway/router. In one embodiment of the present invention, each radio head is configured to use a signal received from a wireless device to detect a corresponding service provider. Each radio is also configured to detect a power level of the signal, as received. Data is then communicated to the gateway/router, including at least radio head identification numbers, z-axis information (e.g., as stored in each radio head, etc.), the channels used, service provider identifiers, and power levels (e.g., as received by each radio head). The gateway/router is then configured to use at least the power levels and z-axis information provided by the plurality of radio heads to determine a location (e.g., z-axis location, or floor) of the wireless device.
    Type: Application
    Filed: April 19, 2013
    Publication date: October 23, 2014
    Inventor: KEY 2 MOBILE LLC
  • Publication number: 20140137760
    Abstract: A line charge system includes a sock with a series of explosive sections and a detonation cord attached to each explosive section. A pair of spaced tubes made of explosive material are disposed about the line and secured to the explosive material of each section resulting in a hinged connection between each explosive section and the detonation cord.
    Type: Application
    Filed: November 5, 2012
    Publication date: May 22, 2014
    Applicant: C-2 Innovations Inc.
    Inventor: C-2 Innovations Inc.
  • Publication number: 20140124866
    Abstract: An integrated circuit may include at least one MOS transistor having a sigmoid response. The at least one MOS transistor may include a substrate, a source region, a drain region, a gate region, and insulating spacer regions on either side of the gate region. The substrate may include a first region situated under the gate region between the insulating spacer regions. At least one of the source and drain regions may be separated from the first region of the substrate by a second region of the substrate situated under an insulating spacer region, which may be of a same type of conductivity as the first region of the substrate.
    Type: Application
    Filed: March 29, 2013
    Publication date: May 8, 2014
    Applicants: STMICROELECTRONICS S.A., STMICROELECTRONICS (CROLLES 2 ) SAS
    Inventors: STMICROELECTRONICS (CROLLES 2) SAS, STMICROELECTRONICS S.A.
  • Publication number: 20140004644
    Abstract: A method for manufacturing an image sensor, including the successive steps of: forming columns of a semiconductor material; forming one or several pixels at a first end of each of the columns; and deforming the structure so that the second ends of each of the columns come closer to each other or draw away from each other to form a surface in the shape of a polyhedral cap.
    Type: Application
    Filed: April 8, 2013
    Publication date: January 2, 2014
    Applicants: STMicroelectronics (Crolles 2) SAS, STMicroelectronics S.A.
    Inventors: STMicroelectronics S.A., STMicroelectronics (Crolles 2) SAS
  • Publication number: 20130280549
    Abstract: A method of forming at least one curved plate having first and second layers, the first layer being formed of a first material and the second layer being formed of a second material, the method including forming one or more blocks of a fusible material on a surface of a substrate; baking the one or more blocks to deform their shape; and depositing the first and second materials over the one or more deformed blocks to form the first and second layers.
    Type: Application
    Filed: March 28, 2013
    Publication date: October 24, 2013
    Applicant: STMicroelectronics (Crolles 2) SAS
    Inventor: STMicroelectronics (Crolles 2) SAS
  • Publication number: 20130221927
    Abstract: A method for measuring the voltage of a battery of an electronic device by means of a measurement device integrated to the electronic device, wherein, after the connection of the battery to the electronic device, the measurement device prevents battery charge and discharge operations during the measurement.
    Type: Application
    Filed: February 27, 2013
    Publication date: August 29, 2013
    Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS
    Inventor: STMICROELECTRONICS (GRENOBLE 2) SAS
  • Publication number: 20130214425
    Abstract: An electronic package includes a substrate wafer with an interconnect network. A first chip is fixed to a front of the substrate, connected to the interconnect network and encapsulated by a body. A second chip is placed on a back side of the substrate wafer and connected to the interconnect network by back-side connection elements interposed between the back side of the substrate and a front side of the second chip. Front-side connection elements are placed on the front side of the substrate and connected to the interconnect network. The connection elements extend beyond the frontal face of the body. The package may be mounted on a board with an interposed thermally conductive material.
    Type: Application
    Filed: October 18, 2012
    Publication date: August 22, 2013
    Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS
    Inventor: STMICROELECTRONICS (GRENOBLE 2) SAS
  • Publication number: 20130214976
    Abstract: A method for localizing an object, including the acts of: transmission of a first signal by a first transmitter assigned to the object and of a second signal by at least one second transmitter; reception of the first and of the second signal by at least three receivers; in each receiver and for the first and the second signal: a) generation of a first and of a second reference signal; b) correlation between the first signal and the first reference signal and between the second signal and the second reference signal; c) interpolation of samples resulting from the correlation; d) deduction of the propagation time of the first and of the second signal; e) calculation of the difference between the propagation times of the first and of the second signal; and, by triangulation, deduction of the position of the object.
    Type: Application
    Filed: February 15, 2013
    Publication date: August 22, 2013
    Applicants: STMicroelectronics (Grenoble 2) SAS, STMicroelectronics SA
    Inventors: STMicroelectronics SA, STMicroelectronics (Grenoble 2) SAS
  • Publication number: 20130207268
    Abstract: An assembly of semiconductor wafers/chips wherein the adjacent surfaces of the two wafers/chips comprise an insulating layer having opposite copper pads inserted therein. The insulating layer is made of a material selected from the group including silicon nitride and silicon carbon nitride.
    Type: Application
    Filed: February 13, 2013
    Publication date: August 15, 2013
    Applicant: STMicroelectronics (Crolles 2) SAS
    Inventor: STMicroelectronics (Crolles 2) SAS
  • Publication number: 20130207279
    Abstract: A method for forming an integrated circuit including the steps of: forming electronic capponents on a first surface of a substrate; forming a stack of interconnection levels on the first surface, each interconnection level including conductive tracks separated by an insulating material; forming at least one hole from a second surface of the substrate, opposite to the first surface, the hole stopping on one of the conductive tracks; depositing, on the walls and the bottom of the hole, a conductive layer and filling the remaining space with a filling material; and forming, in an interconnection level or at the surface of the interconnection stack, and opposite to said at least one hole, at least one region of a material having a modulus of elasticity greater than 50 GPa and an elongation at break greater than 20%, insulated from the conductive tracks.
    Type: Application
    Filed: February 14, 2013
    Publication date: August 15, 2013
    Applicant: STMicroelectronics (Crolles 2) SAS
    Inventor: STMicroelectronics (Crolles 2) SAS
  • Publication number: 20130195235
    Abstract: An apparatus includes a first clock source, a second clock source and circuitry configured to supply a clock signal to a circuit. The circuitry operates to change the clock signal from one frequency to another different frequency. This change is made in a manner whereby no clock signal is supplied during a period of time when the change from the one frequency to the another different clock frequency is being made.
    Type: Application
    Filed: January 17, 2013
    Publication date: August 1, 2013
    Applicants: STMicroelectronics (Grenoble 2) SAS, STMicroelectronics (Research & Development) Limted
    Inventors: STMicroelectronics (Research & Development) Limited, STMicroelectronics (Grenoble 2) SAS
  • Publication number: 20130181220
    Abstract: A three-dimensional integrated structure may include two assembled integrated circuits respectively including two metallic lines, and at least two cavities passing through one of the integrated circuits and opening onto two locations respectively in electrical contact with the two metallic lines. The cavities may be sized to place a measuring apparatus at the bottom of the cavities, and in electrical contact with the two locations.
    Type: Application
    Filed: September 21, 2012
    Publication date: July 18, 2013
    Applicant: STMicroelectronics (Crolles 2) SAS
    Inventor: STMicroelectronics (Crolles 2) SAS
  • Publication number: 20130180562
    Abstract: A tunnel-effect power converter including first and second electrodes having opposite surfaces, wherein the first electrode includes protrusions extending towards the second electrode.
    Type: Application
    Filed: January 14, 2013
    Publication date: July 18, 2013
    Applicants: Centre National de la Recherche Scientifique, STMicroelectronics (Crolles 2) SAS
    Inventors: STMicroelectronics (Crolles 2) SAS, Centre National de la Recherche Scientifique
  • Publication number: 20130175435
    Abstract: The disclosure relates to a method for detecting the presence of an object near a detection device, comprising: emitting pulses of an incident photon beam, detecting photodiodes which trigger avalanche after the reception by the photodiode of at least one photon of a reflected photon beam produced by a reflection of the incident beam on an object near the detection device, determining a distance between the photodiodes and an object in a detection area, as a function of the time between a transmit time of the incident beam and avalanche triggering times of the photodiodes, and correcting the distance determined as a function of a calibration measurement obtained in the absence of object in the detection area, to compensate for photon reflections on a transparent plate arranged between the photodiodes and the detection area.
    Type: Application
    Filed: January 8, 2013
    Publication date: July 11, 2013
    Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS
    Inventor: STMicroelectronics (Grenoble 2) SAS
  • Publication number: 20130168840
    Abstract: A semiconductor integrated device is provided with: a die having a body of semiconductor material with a front surface, and an active area arranged at the front surface; and a package having a support element carrying the die at a back surface of the body, and a coating material covering the die. The body includes a mechanical decoupling region, which mechanically decouples the active area from mechanical stresses induced by the package; the mechanical decoupling region is a trench arrangement within the body, which releases the active area from an external frame of the body, designed to absorb the mechanical stresses induced by the package.
    Type: Application
    Filed: December 18, 2012
    Publication date: July 4, 2013
    Applicants: STMICROELECTRONICS S.R.L., STMICROELECTRONICS (GRENOBLE 2) SAS
    Inventors: STMicroelectronics (Grenoble 2) SAS, STMicroelectronics S.r.l.