Abstract: A tool for cutting elongated turf strips has a cutting head secured to lateral stabilizing members. The cutting head is a rectangular box-shaped member having forward peripheral cutting edges. The stabilizing members ride on the turf surface to ensure a uniform cutting depth of the cutting head. An upwardly and rearwardly directed handle is secured to the top wall of the cutting head to facilitate moving the cutting head through turf to cut a strip of sod therefrom.

Abstract: A method for heparinizing a substrate includes applying a coating of ammonium salt to a substrate by steeping the substrate in a solution of the salt at an alkaline pH and contacting the coated substrate with a solution of a salt of heparin.

Abstract: A reconfigurable workstation (10) is illustrated having video, keyboard, and hand operated motion controller capabilities. The workstation includes main side panels (12, 14) between which a primary work panel (A) is pivotally carried in a manner in which primary work panel (A) may be adjusted and set in a negatively declined or positively inclined position for proper forearm support while operating hand controllers (34, 36). A keyboard table (B) supports a keyboard (32) in such a manner that the keyboard (32) is set in a positively inclined position with respect to the negatively declined work panel (A). Declined forearm support surfaces (26, 28) are provided on either side of an alcove (24) accommodating a seated operator with forearms of the operator supported in a declined position for proper support and operation of the hand controllers (34, 36). A visual display unit (C) is inclined with respect to primary work panel (A) so that the operator seated at alcove (24) is properly positioned.

Abstract: A solution is disclosed for the one-step etching of a three layer titanium-nickel-copper metallization. The etch solution comprises about 1.8 to 2.0 moles/liter hydrofluoric acid, about 2.5 to 4.0 moles/liter acetic acid, about 8.7 to 9.0 moles/liter nitric acid, and balance water. Use of the solution permits the patterned etching of sequential layers of titanium, nickel, and copper without excessive attack of underlying silicon dioxide layers.