Patent number: 9947601
Abstract: An integrated circuit, in the form of a wafer, die, or chip, includes multiple standard cell-compatible fill cells, configured to enable non-contact electrical measurements. Such fill cells include mesh pads that contain at least three conductive stripes disposed between adjacent gate stripes. Such fill cells further include geometry to enable non-contact evaluation of side-to-side shorts and/or leakages.
Type:
Grant
Filed:
September 28, 2017
Date of Patent:
April 17, 2018
Assignee:
PDF Solutions, Inc.
Inventors:
Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Simone Comensoli, Indranil De, Kelvin Doong, Hans Eisenmann, Timothy Fiscus, Jonathan Haigh, Christopher Hess, John Kibarian, Sherry Lee, Marci Liao, Sheng-Che Lin, Hideki Matsuhashi, Kimon Michaels, Conor O'Sullivan, Markus Rauscher, Vyacheslav Rovner, Andrzej Strojwas, Marcin Strojwas, Carl Taylor, Rakesh Vallishayee, Larg Weiland, Nobuharu Yokoyama