Abstract: A channel is created within a planar layer. At least a portion of an optical path is formed within the channel. An optical core medium may be deposited into the channel. In various embodiments, reflective layers are deposited within and over the channel to form the optical path. In another embodiment, a photosensitive sheet is exposed to an optical path mask in the presence of an optical source to define an optical path lying within the plane of the sheet.

Abstract: A channel is created within a planar layer. At least a portion of an optical path is formed within the channel. An optical core medium may be deposited into the channel. In various embodiments, reflective layers are deposited within and over the channel to form the optical path. In another embodiment, a photosensitive sheet is exposed to an optical path mask in the presence of an optical source to define an optical path lying within the plane of the sheet.

Abstract: An apparatus in one example comprises a reversible fan of an electronic module that rotates in a clockwise direction if the electronic module is communicatively coupled in a first position and a counterclockwise direction if the electronic module is communicatively coupled in a second position.

Abstract: An optical cross connect includes first and second planar layers having m and n optical path(s), respectively. An optical switch array comprising a plurality of optical switches is disposed to enable optically coupling any optical path of the first planar layer with any optical path of the second planar layer. Techniques for creating a variety of optical path types are provided.

Abstract: A method and apparatus to eliminate conductive contamination reliability problems for assembled substrates, such as electrical arcing in power semiconductor leads. One embodiment of the invention involves a method for assembling an electrical component having leads on a substrate having conductive contacts, wherein an elastomer part encapsulates the leads of the electrical component. A second embodiment of the invention involves assembling an electrical component having leads to a substrate having conductive contacts, wherein an elastomer shape cut by a punch die encapsulates the leads of the electrical component. A third embodiment of the invention involves an assembled substrate including an electrical component having leads, and an elastomer surrounding the leads to encapsulate the leads.

Abstract: A converter assembly comprises a backplane interface to a backplane compliant with a first open architecture modular computing system standard, a component interface capable of coupling to a component compliant with a second open architecture modular computing system standard, and a control element. The control element is coupled between the backplane interface and the component interface and is capable of programmably routing connection lines and signals between the component interface and the backplane interface.

Abstract: A power system provides for redundant input power sources. The power system includes a plurality of inputs that are connectable to a plurality of input sources and an OR circuit coupled to the source inputs. The OR circuit ORs the input sources to provide a source voltage. The power control circuit that is responsive to sufficient source voltage and other commands provides a working voltage to mid- and low-rail converters to provide supply voltages for use by a load.

Abstract: An electrical device having an enclosure in which noise is parasitically induced in a wire located in the interior of the enclosure is disclosed. The electrical device has an entry connector for mating the wire with an external connector at which a transmission line terminates for preventing the induced noise from being emitted from the device enclosure via the transmission line. The electrical device comprises a printed circuit board (PCB) adapted to be mounted adjacent to an opening in a wall of the enclosure, a receptacle, integral with the PCB, configured to mate with the external connector, a first conductive path coupling the transmission line with the wire when mated, and capacitors mounted on the printed circuit board radially disposed around the receptacle and adapted to be electrically coupled to the external connector when mated. The electrical device further comprises a second conductive path coupling the capacitors to a low potential sink.

Abstract: A computer data bus interface control selectively connects a computer data bus to functional components of a circuit board or isolates the bus from the functional components. The bus interface control also selectively provides pull-up voltage to the bus, as needed. The connection selection and the pull-up voltage selection can be made, for example, based on whether the board is installed in a system slot or a peripheral slot of the bus.

Abstract: A hot swap power delivery circuit. Specifically, the hot swap power delivery circuit is used for controlling current to a load. The hot swap power delivery circuit comprises a field effect transistor (FET), a ramp circuit, and a source follower feedback circuit. The FET comprises a gate, a source, and a drain. The ramp circuit is coupled to the gate of the FET, and is used for delivering current to a load that is coupled to the source of the FET. The source follower feedback circuit is coupled to the source and the gate and is used for de-linearizing an output voltage on said source affecting the delivery of the current.

Abstract: A method of forming an optical communication path includes forming an optical path for carrying optical communications. An electrically conductive cladding is formed along the optical path for carrying at least one of electrical power, control, and data along the optical path.

Abstract: An apparatus for terminating a transmission line includes a terminating circuit coupled to a first connector portion. A second connector portion mates with the first connector portion. The second connector portion is coupled in electrical contact with the transmission line and includes one or more components, such as pins, that can radiate unwanted electromagnetic interference (EMI) when the transmission line is not terminated. The terminating circuit includes components, such as one or more resistors, that substantially match the impedance of the transmission line. The terminating circuit can also be configured to terminate other conductive lines that can pick up signal noise in a system. The terminating apparatus can be utilized on operational boards that plug into devices such as backplanes or mid-planes. Alternatively, the terminating circuit can be included on a null device or built into the first connector portion.

Abstract: A method for fabricating a filament-affixed trace within an electronic device, such as a circuit board or microelectronic device. Conductive traces are affixed to the surface of a composite substrate containing filaments in a matrix bonded to an underlying solid material. The matrix is then removed, leaving the conductive traces suspended or supported by filaments. The signal intensity attenuation for filament-suspended or filament-supported signal lines is much lower than signal lines embedded in solid dielectric materials, allowing for transmission of significantly higher frequency signals within filament-suspended and filament-supported signal lines.

Abstract: A converter assembly comprises a backplane interface to a backplane compliant with a first open architecture modular computing system standard, a component interface capable of coupling to a component compliant with a second open architecture modular computing system standard, and a control element. The control element is coupled between the backplane interface and the component interface and is capable of programmably routing connection lines and signals between the component interface and the backplane interface.

Abstract: An electrical device having an enclosure in which noise is parasitically induced in a wire located in the interior of the enclosure is disclosed. The electrical device has an entry connector for mating the wire with an external connector at which a transmission line terminates for preventing the induced noise from being emitted from the device enclosure via the transmission line. The electrical device comprises a printed circuit board (PCB) adapted to be mounted adjacent to an opening in a wall of the enclosure, a receptacle, integral with the PCB, configured to mate with the external connector, a first conductive path coupling the transmission line with the wire when mated, and capacitors mounted on the printed circuit board radially disposed around the receptacle and adapted to be electrically coupled to the external connector when mated. The electrical device further comprises a second conductive path coupling the capacitors to a low potential sink.

Abstract: A method and apparatus to eliminate conductive contamination reliability problems for assembled substrates, such as electrical arcing in power semiconductor leads. One embodiment of the invention involves a method for assembling an electrical component having leads on a substrate having conductive contacts, wherein an elastomer part encapsulates the leads of the electrical component. A second embodiment of the invention involves assembling an electrical component having leads to a substrate having conductive contacts, wherein an elastomer shape cut by a punch die encapsulates the leads of the electrical component. A third embodiment of the invention involves an assembled substrate including an electrical component having leads, and an elastomer surrounding the leads to encapsulate the leads.

Abstract: A hot swap power delivery circuit. Specifically, the hot swap power delivery circuit is used for controlling current to a load. The hot swap power delivery circuit comprises a field effect transistor (FET), a ramp circuit, and a source follower feedback circuit. The FET comprises a gate, a source, and a drain. The ramp circuit is coupled to the gate of the FET, and is used for delivering current to a load that is coupled to the source of the FET. The source follower feedback circuit is coupled to the source and the gate and is used for de-linearizing an output voltage on said source affecting the delivery of the current.

Abstract: A circuit board or microelectronic device in which conductive signal lines are suspended or supported by filaments in air, rather than surrounded by a solid dielectric material. Dry air has a low relative permittivity and extremely low loss tangent compared with common dielectric substrates in which signal lines are currently embedded within circuit boards and microelectronic devices. The signal intensity attenuation for filament-suspended or filament-supported signal lines is much lower than signal lines embedded in solid dielectric materials, allowing for transmission of significantly higher frequency signals within filament-suspended and filament-supported signal lines.

Abstract: A method and apparatus to eliminate conductive contamination reliability problems for assembled substrates, such as electrical arcing in power semiconductor leads. One embodiment of the invention involves a method for assembling an electrical component having leads on a substrate having conductive contacts, wherein an elastomer part encapsulates the leads of the electrical component. A second embodiment of the invention involves assembling an electrical component having leads to a substrate having conductive contacts, wherein an elastomer shape cut by a punch die encapsulates the leads of the electrical component. A third embodiment of the invention involves an assembled substrate including an electrical component having leads, and an elastomer surrounding the leads to encapsulate the leads.

Abstract: An apparatus for reducing electromagnetic interference in an electronic system, comprises a switch coupled to a conductive line, and a system management device that can be coupled to the electronic system. The system management device detects whether a device is connected in a particular location in the system, and opens the switch to disable data transmission a long the conductive line to the particular location when the device is not connected. Noise signals are thus prevented from being propagated on transmission lines that are not terminated, and EMI that can be generated by signal reflections on the unterminated conductive line is substantially reduced, if not eliminated.