Abstract: An apparatus for terminating a transmission line includes a terminating circuit coupled to a first connector portion. A second connector portion mates with the first connector portion. The second connector portion is coupled in electrical contact with the transmission line and includes one or more components, such as pins, that can radiate unwanted electromagnetic interference (EMI) when the transmission line is not terminated. The terminating circuit includes components, such as one or more resistors, that substantially match the impedance of the transmission line. The terminating circuit can also be configured to terminate other conductive lines that can pick up signal noise in a system. The terminating apparatus can be utilized on operational boards that plug into devices such as backplanes or mid-planes. Alternatively, the terminating circuit can be included on a null device or built into the first connector portion.

Abstract: The present invention is electromagnetic interference containment apparatus. In one embodiment, a layer of compressible material is disposed between an electromagnetic interference source and a bulkhead coupled to the electromagnetic interference source. The layer of compressible material has a first thickness and a second thickness. A first layer of conductive material is disposed on the back side of the layer of compressible material and is electrically coupled to the electromagnetic interference source. The first layer of conductive material is for absorbing electromagnetic emissions from the electromagnetic interference source. A second layer of conductive material is disposed on the front side of the layer of compressible material and is electrically coupled to the first layer of conductive material. The second layer of conductive material is for electrically contacting the bulkhead and for conducting the electromagnetic emissions to the bulkhead.

Abstract: A circuit board or microelectronic device in which conductive signal lines are suspended or supported by filaments in air, rather than surrounded by a solid dielectric material. Dry air has a low relative permittivity and extremely low loss tangent compared with common dielectric substrates in which signal lines are currently embedded within circuit boards and microelectronic devices. The signal intensity attenuation for filament-suspended or filament-supported signal lines is much lower than signal lines embedded in solid dielectric materials, allowing for transmission of significantly higher frequency signals within filament-suspended and filament-supported signal lines.

Abstract: The present invention is electromagnetic interference containment apparatus. In one embodiment, a layer of compressible material is disposed between an electromagnetic interference source and a bulkhead coupled to the electromagnetic interference source. The layer of compressible material has a first thickness and a second thickness. A first layer of conductive material is disposed on the back side of the layer of compressible material and is electrically coupled to the electromagnetic interference source. The first layer of conductive material is for absorbing electromagnetic emissions from the electromagnetic interference source. A second layer of conductive material is disposed on the front side of the layer of compressible material and is electrically coupled to the first layer of conductive material. The second layer of conductive material is for electrically contacting the bulkhead and for conducting the electromagnetic emissions to the bulkhead.

Abstract: A method and apparatus to eliminate conductive contamination reliability problems for assembled substrates, such as electrical arcing in power semiconductor leads. One embodiment of the invention involves a method for assembling an electrical component having leads on a substrate having conductive contacts, wherein an elastomer part encapsulates the leads of the electrical component. A second embodiment of the invention involves assembling an electrical component having leads to a substrate having conductive contacts, wherein an elastomer shape cut by a punch die encapsulates the leads of the electrical component. A third embodiment of the invention involves an assembled substrate including an electrical component having leads, and an elastomer surrounding the leads to encapsulate the leads.

Abstract: A computer system housing for providing an attenuating barrier for electromagnetic interference (EMI) noise. The computer system housing includes a backplane wall having a plurality of connectors for receiving PCB's, and a bulkhead wall coupled to the backplane wall. The bulkhead wall defines a plurality of bulkhead slots through which connector receptacles of printed circuit boards (PCB's) can extend. An EMI bulkhead gasket is positioned on the bulkhead wall. A conductive metal impregnated, elastomer EMI gasket is positioned on a mounting flange of the bulkhead wall. The computer system housing also includes a plurality of bulkhead plates. The bulkhead plates contact the EMI bulkhead gasket and the elastomer EMI gasket along their entire peripheral edges so that EMI noise is conducted through these gaskets to the bulkhead wall. The computer system housing further includes a bulkhead plate alignment and mounting system that does not employ separable fasteners.

Abstract: An apparatus and a method of electrically filtering unwanted noise signals between a computer sub-system and a power sub-system is disclosed. The computer sub-system and the power sub-system are housed within an electrically conducting housing which includes a partition between the computer sub-system and the power sub-system. The apparatus includes a bus bar connected between the power sub-system and the computer sub-system for providing direct current energy between the power sub-system and the computer sub-system. A dielectric material encompasses the bus bar. An electrically conducting material encompasses the dielectric material and is connected to the electrically conducting housing. A virtual capacitor is thereby formed between the bus bar and the housing, providing a path of least resistance for the unwanted noise signals.

Abstract: An apparatus and a method of electrically filtering unwanted noise signals between a computer sub-system and a power sub-system is disclosed. The computer sub-system and the power sub-system are housed within an electrically conducting housing which includes a partition between the computer sub-system and the power sub-system. The apparatus includes a bus bar connected between the power sub-system and the computer sub-system for providing direct current energy between the power sub-system and the computer sub-system. A dielectric material encompasses the bus bar. An electrically conducting material encompasses the dielectric material and is connected to the electrically conducting housing. A virtual capacitor is thereby formed between the bus bar and the housing, providing a path of least resistance for the unwanted noise signals.

Abstract: A computer system housing for providing an attenuating barrier for electromagnetic interference (EMI) noise. The computer system housing includes a backplane wall having a plurality of connectors for receiving PCB's, and a bulkhead wall coupled to the backplane wall. The bulkhead wall defines a plurality of bulkhead slots through which connector receptacles of printed circuit boards (PCB's) can extend. An EMI bulkhead gasket is positioned on the bulkhead wall. A conductive metal impregnated, elastomer EMI gasket is positioned on a mounting flange of the bulkhead wall. The computer system housing also includes a plurality of bulkhead plates. The bulkhead plates contact the EMI bulkhead gasket and the elastomer EMI gasket along their entire peripheral edges so that EMI noise is conducted through these gaskets to the bulkhead wall. The computer system housing further includes a bulkhead plate alignment and mounting system that does not employ separable fasteners.

Abstract: A computer system housing for providing an attenuating barrier for electromagnetic interference (EMI) noise. The computer system housing includes a backplane wall having a plurality of connectors for receiving PCB's, and a bulkhead wall coupled to the backplane wall. The bulkhead wall defines a plurality of bulkhead slots through which connector receptacles of printed circuit boards (PCB's) can extend. An EMI bulkhead gasket is positioned on the bulkhead wall. A conductive metal impregnated, elastomer EMI gasket is positioned on a mounting flange of the bulkhead wall. The computer system housing also includes a plurality of bulkhead plates. The bulkhead plates contact the EMI bulkhead gasket and the elastomer EMI gasket along their entire peripheral edges so that EMI noise is conducted through these gaskets to the bulkhead wall. The computer system housing further includes a bulkhead plate alignment and mounting system that does not employ separable fasteners.