Publication number: 20130071560
Abstract: Compositions for use in microelectronic applications: Ra comprises one or more multiple bonds, provided that, if Ra comprises more than one multiple bond, these multiple bonds are not in a conjugated configuration; and R1, R2, R3 are independently selected from alkoxyl, hydroxyl, halide, OC(O)R, OC(O)OR, wherein R is alkyl or a substituted alkyl; and Rb is selected from H or a saturated group comprising alkyl, alkylene, or alkylidene; and R4, R5, R6 are independently alkoxyl, hydroxyl, halide, OC(O)R, OC(O)OR, wherein R is alkyl or a substituted alkyl; and Rc comprises more than one multiple bond, and these multiple bonds are in a conjugated configuration; and R7, R8, R9 are independently alkoxyl, hydroxyl, halide, OC(O)R, OC(O)OR, wherein R is alkyl or a substituted alkyl; and R10, R11, R12, R13 are independently alkoxyl, hydroxyl, halide, OC(O)R, OC(O)OR, wherein R is alkyl or a substituted alkyl.
Type:
Application
Filed:
August 28, 2012
Publication date:
March 21, 2013
Applicants:
Rohm and Haas Electronic Materials LLC, Dow Global Technologies LLC
Inventors:
Yuanqiao Rao, Robert L. Auger, John D. Weaver, Paul J. Popa, Roxanne M. Jenkins, Christopher P. Sullivan, Jessica P. Evans, Cecilia W. Kiarie, Yasmin N. Srivastava, Jeffrey L. Fenton, JR.
Publication number: 20130071561
Abstract: A composition comprising: A) polymer that comprises: L is CX—CYZ, where X, Y, and Z are independently hydrogen, an alkyl, or a substituted alkyl; and, M is an alkylene, an arylene, a substituted alkylene, a substituted arylene, or C(O)O—W—, where W is an alkylene or a substituted alkylene; and R?, R?, and R?? are independently selected from an aromatic hydrocarbon, an aliphatic hydrocarbon, or a substituted hydrocarbon that comprises one or more of O, N, S, or Si atoms, provided that at least one of R?, R?, and R?? is selected from alkoxyl, aryloxyl, hydroxyl, halide, carboxyl, or carbonate; and, p is from 1 to 10,000; and the polymer does not comprise a polyhedral oligomeric silsesquioxane structure; and B) a polymer formed from a composition comprising at least one Si-containing compound as described herein. Compositions are suitable for microelectronic applications, and have improved adhesion to photoresists polymers.
Type:
Application
Filed:
August 28, 2012
Publication date:
March 21, 2013
Applicants:
Rohm and Haas Electronic Materials LLC, Dow Global Technologies LLC
Inventors:
Yuanqiao Rao, Robert L. Auger, Cecilia W. Kiarie, Yasmin N. Srivastava, Christopher P. Sullivan