Abstract: A microelectromechanical systems (MEMS) accelerometer comprises a compliant spring structure with a first beam, a second beam, and a rigid structure. One end of the first beam and one end of the second beam are coupled to the rigid structure and a proof mass is coupled to another end of the second beam. Further, a spring anchor is coupled to another end of the first beam. In response to the proof mass moving, an extension coupled to the rigid structure moves in an opposite direction to motion of the proof mass to contact the proof mass and stop the movement of the proof mass.

Abstract: A microelectromechanical systems (MEMS) accelerometer comprises a compliant spring structure with a first beam, a second beam, and a rigid structure. One end of the first beam and one end of the second beam are coupled to the rigid structure and a proof mass is coupled to another end of the second beam. Further, a spring anchor is coupled to another end of the first beam. In response to the proof mass moving, an extension coupled to the rigid structure moves in an opposite direction to motion of the proof mass to contact the proof mass and stop the movement of the proof mass.

Abstract: A microelectromechanical systems (MEMS) accelerometer comprises a compliant spring structure with a first beam, a second beam, and a rigid structure. One end of the first beam and one end of the second beam are coupled to the rigid structure and a proof mass is coupled to another end of the second beam. Further, a spring anchor is coupled to another end of the first beam. In response to the proof mass moving, an extension coupled to the rigid structure moves in an opposite direction to motion of the proof mass to contact the proof mass and stop the movement of the proof mass.

Abstract: An angular rate sensor includes first, second, third, and fourth proof masses spaced apart from a surface of a substrate, each of the first, second, third, and fourth proof masses being configured to move along first and second transverse axes parallel to the surface of the substrate. A first coupling structure is interposed between and interconnects the first and second proof masses. A second coupling structure is interposed between and interconnects the second and third proof masses. A third coupling structure is interposed between and interconnects the third and fourth proof masses. A fourth coupling structure is interposed between and interconnects the fourth and first proof masses. The first, second, third, and fourth coupling structures are configured to constrain an in-phase motion of adjacent ones of the first, second, third, and fourth proof masses along the first and second transverse axes.

Abstract: An angular rate sensor includes first and second proof masses spaced apart from a surface of a substrate. One each of first and second drive systems is interconnected with one each of the first and second proof masses. The first and second drive systems enable drive motion of the first and second proof masses along both of first and second axes in an orbital drive direction at a drive frequency, the first axis being perpendicular to the surface of the substrate and the second axis being parallel to the surface of the substrate. The sensor is sensitive to angular velocity about a third axis oriented parallel to the surface of the substrate and perpendicular to the second axis, and the drive frequency of the drive motion of the first and second proof masses changes in response to the angular velocity of the angular rate sensor about the third axis.

Abstract: An angular rate sensor includes first and second proof masses spaced apart from a surface of a substrate. One each of first and second drive systems is interconnected with one each of the first and second proof masses. The first and second drive systems enable drive motion of the first and second proof masses along both of first and second axes in an orbital drive direction at a drive frequency, the first axis being perpendicular to the surface of the substrate and the second axis being parallel to the surface of the substrate. The sensor is sensitive to angular velocity about a third axis oriented parallel to the surface of the substrate and perpendicular to the second axis, and the drive frequency of the drive motion of the first and second proof masses changes in response to the angular velocity of the angular rate sensor about the third axis.

Abstract: An angular rate sensor includes first, second, third, and fourth proof masses spaced apart from a surface of a substrate, each of the first, second, third, and fourth proof masses being configured to move along first and second transverse axes parallel to the surface of the substrate. A first coupling structure is interposed between and interconnects the first and second proof masses. A second coupling structure is interposed between and interconnects the second and third proof masses. A third coupling structure is interposed between and interconnects the third and fourth proof masses. A fourth coupling structure is interposed between and interconnects the fourth and first proof masses. The first, second, third, and fourth coupling structures are configured to constrain an in-phase motion of adjacent ones of the first, second, third, and fourth proof masses along the first and second transverse axes.

Abstract: A MEMS device includes first, second, third, and fourth sense masses spaced apart from a surface of a substrate. A first drive coupler interconnects the first sense mass with a first actuator, a second drive coupler interconnects the second sense mass with a second actuator, a third drive coupler interconnects the third sense mass with a third actuator, and a fourth drive coupler interconnects the fourth sense mass with a fourth actuator. Each of the drive couplers includes a torsion bar having a length aligned parallel to an outer sidewall of an adjacent sense mass and first and second coupling links coupled to opposing first and second ends of the torsion bar. The first and second coupling links couple an adjacent one of the first, second, third, and fourth sense masses with a corresponding one of the first, second, third, and fourth actuators.

Abstract: A microelectromechanical systems (MEMS) device and a method for calibrating a MEMS device. The device includes a first semiconductor substrate including at least one MEMS component. The device also includes an application specific integrated circuit (ASIC) comprising a second semiconductor substrate. The second semiconductor substrate is attached to the first semiconductor substrate. The second semiconductor substrate includes at least one piezoresistive strain gauge. Each piezoresistive strain gauge includes at least one doped semiconductor region having a resistivity that is determined by a strain on said doped semiconductor region. The second semiconductor substrate also includes a circuit for evaluating a trim algorithm for the at least one MEMs component using one or more output values received from the at least one piezoresistive strain gauge.

Abstract: A MEMS device includes first, second, third, and fourth sense masses spaced apart from a surface of a substrate. A first drive coupler interconnects the first sense mass with a first actuator, a second drive coupler interconnects the second sense mass with a second actuator, a third drive coupler interconnects the third sense mass with a third actuator, and a fourth drive coupler interconnects the fourth sense mass with a fourth actuator. Each of the drive couplers includes a torsion bar having a length aligned parallel to an outer sidewall of an adjacent sense mass and first and second coupling links coupled to opposing first and second ends of the torsion bar. The first and second coupling links couple an adjacent one of the first, second, third, and fourth sense masses with a corresponding one of the first, second, third, and fourth actuators.

Abstract: A MEMS device includes a substrate, a proof mass capable of moving relative to the substrate, and a motion limit structure. The motion limit structure includes an arm structure flexibly coupled to the proof mass or the substrate. The arm structure has a first contact region and a second contact region. In response to a shock force that causes the proof mass to move, the first contact region contacts a first stop region on the other one of the proof mass and the substrate. Following contact of the first contact region with the first stop region and upon continuation of the shock force, the second contact region contacts a second stop region on the other one of the proof mass and the substrate such that the contact between the second contact and stop regions reduces a contact force between the first contact and stop regions.

Abstract: An integrated device includes a MEMS device, such as a gyroscope, having a movable mass spaced apart from a substrate, the movable mass being configured to oscillate in a drive direction relative to the substrate. The integrated device further comprises an integrated circuit (IC) die having a surface coupled with the MEMS device such that the movable mass is interposed between the substrate and the surface of the IC die. An electrode structure is formed on the surface of the IC die, the electrode structure including a plurality of electrode segments vertically spaced apart from the movable mass. Openings extend through the movable mass and the electrode segments overlie the openings. Suitably selected electrode segments can be activated to electrostatically attract the movable mass toward sense electrodes vertically spaced apart from the MEMS to reduce quadrature motion of the movable mass.

Abstract: A MEMS device includes a substrate, a proof mass capable of moving relative to the substrate, and a motion limit structure. The motion limit structure includes an arm structure flexibly coupled to the proof mass or the substrate. The arm structure has a first contact region and a second contact region. In response to a shock force that causes the proof mass to move, the first contact region contacts a first stop region on the other one of the proof mass and the substrate. Following contact of the first contact region with the first stop region and upon continuation of the shock force, the second contact region contacts a second stop region on the other one of the proof mass and the substrate such that the contact between the second contact and stop regions reduces a contact force between the first contact and stop regions.

Abstract: A microelectromechanical systems (MEMS) device, such as a single axis accelerometer, includes a movable mass suspended from a substrate. The movable mass has a first portion and a second portion. A first spring system interconnects the first portion of the movable mass with the second portion of the movable mass. A second spring system interconnects the first portion with an anchor system. The first spring system enables movement of the second portion of the movable mass in response to a shock event force imposed on the movable mass in a first direction that is orthogonal to a sense direction, wherein the first spring system inhibits movement of the first portion of the movable mass in the first direction in response to the shock event force. However, the first and second movable masses move together in response to an acceleration force in the sense direction.

Abstract: A microelectromechanical system (MEMS) gyroscope device includes a substrate having a surface parallel to a plane; first and second proof masses driven to slide back and forth past one another in a first directional axis of the plane, where the first and second proof masses respectively have a first and second recess in a respective side closest to the other proof mass; a pivot structure coupled to the first proof mass within the first recess and to the second proof mass within the second recess; an anchor between the first and second recesses and coupled to a mid-point of the pivot structure; and third and fourth proof masses driven to move toward and away from one another in a second directional axis of the plane that is perpendicular to the first directional axis; where the proof masses move in response to angular velocity in one or more directional axes.

Abstract: A MEMS sensor for measuring rotational motion about a first axis includes a frame, a base structure under the frame, a drive mass mounted in the frame for rotational movement about a second axis perpendicular to the first axis, and a first drive paddle in the drive mass. A first link includes a first end coupled to a first spring that movably couples the first drive paddle to the drive mass and a second end coupled to a second spring that movably couples the first link to the frame. A drive system includes an electrode aligned to exert electromotive force to pivot the first drive paddle and move the drive mass about the second axis. Deflection of the drive mass is greater than deflection of the first drive paddle when the drive system is operating.

Abstract: A MEMS device includes a mass system capable of undergoing oscillatory drive motion along a drive axis and oscillatory sense motion along a sense axis perpendicular to the drive axis. A quadrature compensation unit includes fixed and movable electrodes, each being lengthwise oriented along the drive axis. The movable electrode is coupled to the mass system. The fixed electrode has a first edge exhibiting a first stepped profile and the movable electrode has a second edge facing the first edge, the second edge exhibiting a second stepped profile. The fixed and movable electrodes are positioned in an immediately adjacent configuration such that when the movable electrode is not undergoing oscillatory motion, a gap between the first and second edges has a varying width corresponding to the first and second stepped edge profiles.

Abstract: A microelectromechanical systems (MEMS) device, such as a single axis accelerometer, includes a movable mass suspended from a substrate. The movable mass has a first portion and a second portion. A first spring system interconnects the first portion of the movable mass with the second portion of the movable mass. A second spring system interconnects the first portion with an anchor system. The first spring system enables movement of the second portion of the movable mass in response to a shock event force imposed on the movable mass in a first direction that is orthogonal to a sense direction, wherein the first spring system inhibits movement of the first portion of the movable mass in the first direction in response to the shock event force. However, the first and second movable masses move together in response to an acceleration force in the sense direction.

Abstract: An inertial sensor includes a substrate, a movable mass, and a motion limit structure. The motion limit structure includes a rigid element interposed between first and second spring beams. The first spring beam has a first end fixed with the substrate and a second end coupled with the rigid element. The second spring beam is located between a pair of beams extending from an edge of the movable mass and is separated from each of the beams by a gap. The second spring beam has a third beam end coupled with the movable mass and a fourth beam end coupled with the rigid element. When the movable mass is stimulated to move beyond a predetermined limit, the rigid beam pivots as the spring beams flex. The second spring beam flexes to close the gap and contact one of the pair of beams to limit motion of the movable mass.

Abstract: A microelectromechanical systems (MEMS) device and a method for calibrating a MEMS device. The device includes a first semiconductor substrate including at least one MEMS component. The device also includes an application specific integrated circuit (ASIC) comprising a second semiconductor substrate. The second semiconductor substrate is attached to the first semiconductor substrate. The second semiconductor substrate includes at least one piezoresistive strain gauge. Each piezoresistive strain gauge includes at least one doped semiconductor region having a resistivity that is determined by a strain on said doped semiconductor region. The second semiconductor substrate also includes a circuit for evaluating a trim algorithm for the at least one MEMs component using one or more output values received from the at least one piezoresistive strain gauge.