Patents by Inventor Aaron A. Geisberger
Aaron A. Geisberger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9079763Abstract: A MEMS device (20) includes a proof mass structure (26) and beams (28, 30) residing in a central opening (32) of the proof mass structure (26), where the structure and the beams are suspended over a substrate (22). The beams (28, 30) are oriented such that lengthwise edges (34, 36) of the beams are beside one another. Isolation segments (38) are interposed between the beams (28, 30) such that a middle portion (40) of each of the beams is laterally anchored to adjacent isolation segments (38). The isolation segments (38) provide electrical isolation between the beams. The beams (28, 30) are anchored to the substrate (22) via compliant structures (61, 65) that isolate the beams from deformations in the underlying substrate. The compliant structures (61, 65) provide electrically conductive paths (96, 98) to the substrate (22) for the beams (28, 30) where the paths are electrically isolated from one another.Type: GrantFiled: April 22, 2013Date of Patent: July 14, 2015Assignee: FREESCALE SEMICONDUCTOR, INC.Inventor: Aaron A. Geisberger
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Publication number: 20150041927Abstract: A MEMS device includes a first sense electrode and a first portion of a sense mass formed in a first structural layer, where the first sense electrode is fixedly coupled with the substrate and the first portion of the sense mass is suspended over the substrate. The MEMS device further includes a second sense electrode and a second portion of the sense mass formed in a second structural layer. The second sense electrode is spaced apart from the first portion of the sense mass in a direction perpendicular to a surface of the substrate, and the second portion of the sense mass is spaced apart from the first sense electrode in the same direction. A junction is formed between the first and second portions of the sense mass so that they are coupled together and move concurrently in response to an imposed force.Type: ApplicationFiled: August 6, 2013Publication date: February 12, 2015Applicant: FREESCALE SEMICONDUCTOR, INC.Inventors: Aaron A. Geisberger, Margaret L. Kniffin
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Publication number: 20140311243Abstract: An apparatus (36) includes a motion amplification structure (52), an actuator (54), and a sense electrode (50) in proximity to the structure (52). The actuator (54) induces an axial force (88) upon the structure (52), which causes a relatively large amount of in-plane motion (108) in one or more beams (58, 60) of the structure (52). When sidewalls (98) of the beams (58, 60) exhibit a skew angle (28), the in-plane motion (108) of the beams (58, 60) produces out-of-plane motion (110) of a paddle element (62) connected to the end of the beams (58, 60). The skew angle (28), which results from an etch process, defines a degree to which the sidewalls (98) of beams (58, 60) are offset or tilted from their design orientation. The out-of-plane motion (110) of element (62) is sensed at the electrode (50), and is utilized to determine an estimated skew angle (126).Type: ApplicationFiled: April 22, 2013Publication date: October 23, 2014Applicant: FREESCALE SEMICONDUCTOR, INC.Inventors: Aaron A. Geisberger, Kemiao Jia
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Publication number: 20140312435Abstract: A MEMS device (20) includes a proof mass structure (26) and beams (28, 30) residing in a central opening (32) of the proof mass structure (26), where the structure and the beams are suspended over a substrate (22). The beams (28, 30) are oriented such that lengthwise edges (34, 36) of the beams are beside one another. Isolation segments (38) are interposed between the beams (28, 30) such that a middle portion (40) of each of the beams is laterally anchored to adjacent isolation segments (38). The isolation segments (38) provide electrical isolation between the beams. The beams (28, 30) are anchored to the substrate (22) via compliant structures (61, 65) that isolate the beams from deformations in the underlying substrate. The compliant structures (61, 65) provide electrically conductive paths (96, 98) to the substrate (22) for the beams (28, 30) where the paths are electrically isolated from one another.Type: ApplicationFiled: April 22, 2013Publication date: October 23, 2014Applicant: FREESCALE SEMICONDUCTOR, INC.Inventor: Aaron A. Geisberger
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Publication number: 20140260508Abstract: A sensor system includes a microelectromechanical systems (MEMS) sensor, processing circuitry, measurement circuitry, stimulus circuitry and memory. The system is configured to provide an output responsive to physical displacement within the MEMS sensor to the measurement circuitry. The stimulus circuitry is configured to provide a stimulus signal to the MEMS sensor to cause a physical displacement within the MEMS sensor. The measurement circuitry is configured to process the output from the MEMS sensor and provide it to the processing circuitry, which is configured to generate stimulus signals and provide them to the stimulus circuitry for provision to the MEMS sensor. Output from the measurement circuitry corresponding to the physical displacement occurring in the MEMS sensor is monitored and used to calculate MEMS sensor characteristics. Methods for monitoring and calibrating MEMS sensors are also provided.Type: ApplicationFiled: January 22, 2014Publication date: September 18, 2014Applicant: FREESCALE SEMICONDUCTOR, INC.Inventors: Tehmoor M. Dar, Bruno J. Debeurre, Raimondo P. Sessego, Richard A. Deken, Aaron A. Geisberger, Krithivasan Suryanarayanan
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Patent number: 8810030Abstract: A MEMS device (20) with stress isolation includes elements (28, 30, 32) formed in a first structural layer (24) and elements (68, 70) formed in a second structural layer (26), with the layer (26) being spaced apart from the first structural layer (24). Fabrication methodology (80) entails forming (92, 94, 104) junctions (72, 74) between the layers (24, 26). The junctions (72, 74) connect corresponding elements (30, 32) of the first layer (24) with elements (68, 70) of the second layer (26). The fabrication methodology (80) further entails releasing the structural layers (24, 26) from an underlying substrate (22) so that all of the elements (30, 32, 68, 70) are suspended above the substrate (22) of the MEMS device (20), wherein attachment of the elements (30, 32, 68, 70) with the substrate (22) occurs only at a central area (46) of the substrate (22).Type: GrantFiled: February 3, 2012Date of Patent: August 19, 2014Assignee: Freescale Semiconductor, Inc.Inventor: Aaron A. Geisberger
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Patent number: 8413509Abstract: A device (96) includes a microelectromechanical (MEMS) sensor (40). The sensor (40) includes a movable element (42) adapted for motion in a direction (44) and an anchor (46) coupled to a substrate (48). The MEMS sensor (40) further includes spring members (50) interconnected between the movable element (42) and the anchor (46). Each of the spring members (50) includes beams (56, 58, 60) arranged in substantially parallel alignment, with the beam (60) positioned between the other beams (56, 58). Each of the beams (56, 58) is coupled to the anchor (46) and the beam (60) is coupled to the movable element (42). Each of the spring members (50) further includes a support structure (64) joined with the beams (56, 58) to provide vertical stiffness to the beams (56, 58) of the spring member (50).Type: GrantFiled: April 14, 2008Date of Patent: April 9, 2013Assignee: Freescale Semiconductor, Inc.Inventor: Aaron A. Geisberger
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Patent number: 8186220Abstract: An accelerometer (50, 100, 120, 130) includes a substrate (58) and a proof mass (54) spaced apart from a surface (56) of the substrate (58). Compliant members (62) are coupled to the proof mass (54) and enable the proof mass (54) to move parallel to the surface (56) of the substrate (58) in a sense direction (68). Proof mass anchors (60) interconnect the compliant members (62) with the surface (56). The accelerometer (50, 100, 120, 130) includes an over-travel stop structure (52, 102, 122, 132) having stop anchors (70, 72) coupled to the substrate (58). The stop anchors (70, 72) are coupled to the substrate (58) at positions (76) on the surface (56) residing at least partially within an anchor attach area (71) bounded in the sense direction (68) by locations (78) of the proof mass anchors (60) on the surface (56).Type: GrantFiled: March 9, 2009Date of Patent: May 29, 2012Assignee: Freescale Semiconductor, Inc.Inventors: Aaron A. Geisberger, Yizhen Lin, Andrew C. McNeil
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Publication number: 20120126345Abstract: A MEMS device (20) with stress isolation includes elements (28, 30, 32) formed in a first structural layer (24) and elements (68, 70) formed in a second structural layer (26), with the layer (26) being spaced apart from the first structural layer (24). Fabrication methodology (80) entails forming (92, 94, 104) junctions (72, 74) between the layers (24, 26). The junctions (72, 74) connect corresponding elements (30, 32) of the first layer (24) with elements (68, 70) of the second layer (26). The fabrication methodology (80) further entails releasing the structural layers (24, 26) from an underlying substrate (22) so that all of the elements (30, 32, 68, 70) are suspended above the substrate (22) of the MEMS device (20), wherein attachment of the elements (30, 32, 68, 70) with the substrate (22) occurs only at a central area (46) of the substrate (22).Type: ApplicationFiled: February 3, 2012Publication date: May 24, 2012Applicant: FREESCALE SEMICONDUCTOR, INC.Inventor: Aaron A. Geisberger
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Patent number: 8138007Abstract: A MEMS device (20) with stress isolation includes elements (28, 30, 32) formed in a first structural layer (24) and elements (68, 70) formed in a second structural layer (26), with the layer (26) being spaced apart from the first structural layer (24). Fabrication methodology (80) entails forming (92, 94, 104) junctions (72, 74) between the layers (24, 26). The junctions (72, 74) connect corresponding elements (30, 32) of the first layer (24) with elements (68, 70) of the second layer (26). The fabrication methodology (80) further entails releasing the structural layers (24, 26) from an underlying substrate (22) so that all of the elements (30, 32, 68, 70) are suspended above the substrate (22) of the MEMS device (20), wherein attachment of the elements (30, 32, 68, 70) with the substrate (22) occurs only at a central area (46) of the substrate (22).Type: GrantFiled: August 26, 2009Date of Patent: March 20, 2012Assignee: Freescale Semiconductor, Inc.Inventor: Aaron A. Geisberger
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Patent number: 8056415Abstract: A microelectromechanical systems (MEMS) sensor (52) includes a substrate (62) a movable element (58) spaced apart from the substrate (62), suspension anchors (66, 68, 70, 72) formed on the substrate (62), and compliant members (74) interconnecting the movable element (58) with the suspension anchors. The MEMS sensor (52) further includes fixed fingers (76) and fixed finger anchors (78) attaching the fixed fingers (76) to the substrate (62). The movable element (58) includes openings (64). At least one of the suspension anchors resides in at least one of the multiple openings (64) and pairs (94) of the fixed fingers (76) reside in other multiple openings (64). The MEMS sensor (52) is symmetrically formed, and a location of the fixed finger anchors (78) defines an anchor region (103) within which the suspension anchors (66, 68, 70, 72) are positioned.Type: GrantFiled: May 30, 2008Date of Patent: November 15, 2011Assignee: Freescale Semiconductor, Inc.Inventors: Andrew C. McNeil, Aaron A. Geisberger, Daniel N. Koury, Jr., Gary G. Li
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Publication number: 20110049648Abstract: A MEMS device (20) with stress isolation includes elements (28, 30, 32) formed in a first structural layer (24) and elements (68, 70) formed in a second structural layer (26), with the layer (26) being spaced apart from the first structural layer (24). Fabrication methodology (80) entails forming (92, 94, 104) junctions (72, 74) between the layers (24, 26). The junctions (72, 74) connect corresponding elements (30, 32) of the first layer (24) with elements (68, 70) of the second layer (26). The fabrication methodology (80) further entails releasing the structural layers (24, 26) from an underlying substrate (22) so that all of the elements (30, 32, 68, 70) are suspended above the substrate (22) of the MEMS device (20), wherein attachment of the elements (30, 32, 68, 70) with the substrate (22) occurs only at a central area (46) of the substrate (22).Type: ApplicationFiled: August 26, 2009Publication date: March 3, 2011Applicant: Freescale Semiconductor, Inc.Inventor: Aaron A. Geisberger
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Publication number: 20100223997Abstract: An accelerometer (50, 100, 120, 130) includes a substrate (58) and a proof mass (54) spaced apart from a surface (56) of the substrate (58). Compliant members (62) are coupled to the proof mass (54) and enable the proof mass (54) to move parallel to the surface (56) of the substrate (58) in a sense direction (68). Proof mass anchors (60) interconnect the compliant members (62) with the surface (56). The accelerometer (50, 100, 120, 130) includes an over-travel stop structure (52, 102, 122, 132) having stop anchors (70, 72) coupled to the substrate (58). The stop anchors (70, 72) are coupled to the substrate (58) at positions (76) on the surface (56) residing at least partially within an anchor attach area (71) bounded in the sense direction (68) by locations (78) of the proof mass anchors (60) on the surface (56).Type: ApplicationFiled: March 9, 2009Publication date: September 9, 2010Applicant: Freescale Semiconductor, Inc.Inventors: Aaron A. Geisberger, Yizhen Lin, Andrew C. McNeil
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Patent number: 7637142Abstract: An apparatus including a micro-mechanical calibration member having at least a portion that is elastically biasable away from a neutral position in response to mechanical contact. The apparatus may also include a fixed member proximate the micro-mechanical calibration member which may be referenced to automatically detect deflection of the micro-mechanical calibration member away from the neutral position. The micro-mechanical calibration member may also be configured to receive a micro-mechanical contacting member to provide the mechanical contact employed to bias the micro-mechanical calibration member away from the neutral position.Type: GrantFiled: August 14, 2006Date of Patent: December 29, 2009Assignee: Zyvex LabsInventors: Kenneth Tsui, Aaron Geisberger
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Publication number: 20090293617Abstract: A microelectromechanical systems (MEMS) sensor (52) includes a substrate (62) a movable element (58) spaced apart from the substrate (62), suspension anchors (66, 68, 70, 72) formed on the substrate (62), and compliant members (74) interconnecting the movable element (58) with the suspension anchors. The MEMS sensor (52) further includes fixed fingers (76) and fixed finger anchors (78) attaching the fixed fingers (76) to the substrate (62). The movable element (58) includes openings (64). At least one of the suspension anchors resides in at least one of the multiple openings (64) and pairs (94) of the fixed fingers (76) reside in other multiple openings (64). The MEMS sensor (52) is symmetrically formed, and a location of the fixed finger anchors (78) defines an anchor region (103) within which the suspension anchors (66, 68, 70, 72) are positioned.Type: ApplicationFiled: May 30, 2008Publication date: December 3, 2009Applicant: FREESCALE SEMICONDUCTOR, INC.Inventors: Andrew C. McNeil, Aaron A. Geisberger, Daniel N. Koury, JR., Gary G. Li
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Publication number: 20090256297Abstract: A device (96) includes a microelectromechanical (MEMS) sensor (40). The sensor (40) includes a movable element (42) adapted for motion in a direction (44) and an anchor (46) coupled to a substrate (48). The MEMS sensor (40) further includes spring members (50) interconnected between the movable element (42) and the anchor (46). Each of the spring members (50) includes beams (56, 58, 60) arranged in substantially parallel alignment, with the beam (60) positioned between the other beams (56, 58). Each of the beams (56, 58) is coupled to the anchor (46) and the beam (60) is coupled to the movable element (42). Each of the spring members (50) further includes a support structure (64) joined with the beams (56, 58) to provide vertical stiffness to the beams (56, 58) of the spring member (50).Type: ApplicationFiled: April 14, 2008Publication date: October 15, 2009Applicant: FREESCALE SEMICONDUCTOR, INC.Inventor: Aaron A. Geisberger
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Method, System and Device for Microscopic Examination Employing Fib-Prepared Sample Grasping Element
Publication number: 20070187623Abstract: A method including, in one embodiment, severing a sample at least partially from a substrate by cutting the substrate with a focused ion beam (FIB), capturing the substrate sample by activating a grasping element, and separating the captured sample from the substrate. The captured sample may be separated from the substrate and transported to an electron microscope for examination.Type: ApplicationFiled: April 17, 2007Publication date: August 16, 2007Applicant: ZYVEX INSTRUMENTS, LLCInventors: George SKIDMORE, Matthew ELLIS, Aaron GEISBERGER, Kenneth BRAY, Kimberly TUCK, Robert Folaron -
Method, system and device for microscopic examination employing fib-prepared sample grasping element
Patent number: 7227140Abstract: A method including, in one embodiment, severing a sample at least partially from a substrate by cutting the substrate with a focused ion beam (FIB), capturing the substrate sample by activating a grasping element, and separating the captured sample from the substrate. The captured sample may be separated from the substrate and transported to an electron microscope for examination.Type: GrantFiled: September 23, 2004Date of Patent: June 5, 2007Assignee: Zyvex Instruments, LLCInventors: George Skidmore, Matthew D. Ellis, Aaron Geisberger, Kenneth Bray, Kimberly Tuck, Robert Folaron -
Publication number: 20070012084Abstract: An apparatus including a micro-mechanical calibration member having at least a portion that is elastically biasable away from a neutral position in response to mechanical contact. The apparatus may also include a fixed member proximate the micro-mechanical calibration member which may be referenced to automatically detect deflection of the micro-mechanical calibration member away from the neutral position. The micro-mechanical calibration member may also be configured to receive a micro-mechanical contacting member to provide the mechanical contact employed to bias the micro-mechanical calibration member away from the neutral position.Type: ApplicationFiled: August 14, 2006Publication date: January 18, 2007Applicant: ZYVEX CORPORATIONInventors: Kenneth Tsui, Aaron Geisberger
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Publication number: 20070001248Abstract: A MEMS device including a plurality of actuator layers formed over a substrate and a bimorph actuator having a substantially serpentine pattern. The serpentine pattern is a staggered pattern having a plurality of static segments interlaced with a plurality of deformable segments. Each of the plurality of static segments has a static segment length and each of the plurality of deformable segments has a deformable segment length, wherein the deformable segment length is substantially different than the static segment length. At least a portion of each of the plurality of deformable segments and each of the plurality of static segments is defined from a common one of the plurality of actuator layers.Type: ApplicationFiled: August 17, 2006Publication date: January 4, 2007Applicant: ZYVEX CORPORATIONInventors: Aaron Geisberger, Niladri Sarkar