Patents by Inventor Aaron Ashley Hathaway

Aaron Ashley Hathaway has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10727162
    Abstract: An integrated circuit is provided that comprises a thermal sink layer, a first ground plane associated with a first set of circuits that have a first operational temperature requirement, and a first thermally conductive via that couples the first ground plane to the thermal sink layer. The circuit further comprises a second ground plane associated with a second set of circuits that have a second operational temperature requirement that is higher than the first operational temperature requirement, and a second thermally conductive via that couples the second ground plane to the thermal sink layer, wherein the first thermally conductive via has a greater volume of thermal conductive material than the second thermally conductive via to remove heat from the first set of circuits with less gradient than the second set of circuits.
    Type: Grant
    Filed: January 7, 2019
    Date of Patent: July 28, 2020
    Assignee: NORTHROP GRUMMAN SYSTEMS CORPORATION
    Inventors: Patrick Loney, Robert Miles Young, Daniel Robert Queen, Aaron Ashley Hathaway, John X. Przybysz
  • Publication number: 20200203245
    Abstract: An integrated circuit is provided that comprises a first thermal sink layer, a first ground plane associated with a first set of circuits that have a first operational temperature requirement, a first thermally conductive via that couples the first ground plane to the first thermal sink layer, a second thermal sink layer, a second ground plane associated with a second set of circuits that have a second operational temperature requirement that is higher than the first operational temperature requirement, and a second thermally conductive via that couples the second ground plane to the second thermal sink layer. The first thermal sink layer is cooled at a first temperature to maintain the first set of circuits at the first operational temperature requirement and the second thermal sink layer is cooled at a second temperature to maintain the second set of circuits at the second operational temperature requirement.
    Type: Application
    Filed: December 20, 2018
    Publication date: June 25, 2020
    Applicant: NORTHROP GRUMMAN SYSTEMS CORPORATION
    Inventors: AARON ASHLEY HATHAWAY, GREGORY R. BOYD, JOHN X. PRZYBYSZ
  • Patent number: 10644218
    Abstract: A superconducting structure is provided that comprises a first superconducting device coupled to a second superconducting device employing a plurality of superconducting bump bond structures. Each of the plurality of superconducting bump bond structures comprise a first normal metal layer disposed on the top surface of a given one of a plurality of first contact pads, a second normal metal layer disposed on the top surface of a given one of a plurality of second contact pads, and a superconducting metal layer disposed between the first normal metal layer and the second normal metal layer. The metal thicknesses of each of the first normal metal layer, the second normal metal layer, and the specific material of the superconducting metal and normal metal are selected to inhibit the transfer of heat between the first superconducting device and the second superconducting device.
    Type: Grant
    Filed: March 13, 2019
    Date of Patent: May 5, 2020
    Assignee: NORTHROP GRUMMAN SYSTEMS CORPORATION
    Inventors: Aaron Ashley Hathaway, Robert Miles Young, Patrick Alan Loney, Justin Hackley
  • Patent number: 10629535
    Abstract: An integrated circuit is provided that comprises a first ground plane associated with a first set of circuits that have a first operational temperature requirement, and a second ground plane associated with a second set of circuits that have a second operational temperature requirement that is higher than the first operational temperature requirement. The second ground plane is substantially thermally isolated from the first ground plane. A superconducting coupler electrically couples the first ground plane and the second ground plane while maintaining relative thermal isolation between the first ground plane and the second ground plane.
    Type: Grant
    Filed: October 31, 2017
    Date of Patent: April 21, 2020
    Assignee: NORTHROP GRUMMAN SYSTEMS CORPORATION
    Inventors: Patrick Alan Loney, Aaron Ashley Hathaway, Daniel Robert Queen, John X. Przybysz, Robert Miles Young
  • Publication number: 20190157184
    Abstract: An integrated circuit is provided that comprises a thermal sink layer, a first ground plane associated with a first set of circuits that have a first operational temperature requirement, and a first thermally conductive via that couples the first ground plane to the thermal sink layer. The circuit further comprises a second ground plane associated with a second set of circuits that have a second operational temperature requirement that is higher than the first operational temperature requirement, and a second thermally conductive via that couples the second ground plane to the thermal sink layer, wherein the first thermally conductive via has a greater volume of thermal conductive material than the second thermally conductive via to remove heat from the first set of circuits with less gradient than the second set of circuits.
    Type: Application
    Filed: January 7, 2019
    Publication date: May 23, 2019
    Applicant: NORTHROP GRUMMAN SYSTEMS CORPORATION
    Inventors: PATRICK LONEY, ROBERT MILES YOUNG, DANIEL ROBERT QUEEN, AARON ASHLEY HATHAWAY, JOHN X. PRZYBYSZ
  • Publication number: 20190131246
    Abstract: An integrated circuit is provided that comprises a first ground plane associated with a first set of circuits that have a first operational temperature requirement, and a second ground plane associated with a second set of circuits that have a second operational temperature requirement that is higher than the first operational temperature requirement. The second ground plane is substantially thermally isolated from the first ground plane. A superconducting coupler electrically couples the first ground plane and the second ground plane while maintaining relative thermal isolation between the first ground plane and the second ground plane.
    Type: Application
    Filed: October 31, 2017
    Publication date: May 2, 2019
    Applicant: NORTHROP GRUMMAN SYSTEMS CORPORATION
    Inventors: PATRICK ALAN LONEY, AARON ASHLEY HATHAWAY, DANIEL ROBERT QUEEN, JOHN X. PRZYBYSZ, ROBERT MILES YOUNG
  • Publication number: 20190080983
    Abstract: An integrated circuit is provided that comprises a thermal sink layer, a first ground plane associated with a first set of circuits that have a first operational temperature requirement, and a first thermally conductive via that couples the first ground plane to the thermal sink layer. The circuit further comprises a second ground plane associated with a second set of circuits that have a second operational temperature requirement that is higher than the first operational temperature requirement, and a second thermally conductive via that couples the second ground plane to the thermal sink layer, wherein the first thermally conductive via has a greater volume of thermal conductive material than the second thermally conductive via to remove heat from the first set of circuits with less gradient than the second set of circuits.
    Type: Application
    Filed: September 14, 2017
    Publication date: March 14, 2019
    Applicant: NORTHROP GRUMMAN SYSTEMS CORPORATION
    Inventors: PATRICK LONEY, ROBERT MILES YOUNG, DANIEL ROBERT QUEEN, AARON ASHLEY HATHAWAY, JOHN X. PRZYBYSZ
  • Patent number: 10229864
    Abstract: An integrated circuit is provided that comprises a thermal sink layer, a first ground plane associated with a first set of circuits that have a first operational temperature requirement, and a first thermally conductive via that couples the first ground plane to the thermal sink layer. The circuit further comprises a second ground plane associated with a second set of circuits that have a second operational temperature requirement that is higher than the first operational temperature requirement, and a second thermally conductive via that couples the second ground plane to the thermal sink layer, wherein the first thermally conductive via has a greater volume of thermal conductive material than the second thermally conductive via to remove heat from the first set of circuits with less gradient than the second set of circuits.
    Type: Grant
    Filed: September 14, 2017
    Date of Patent: March 12, 2019
    Assignee: NORTHROP GRUMMAN SYSTEMS CORPORATION
    Inventors: Patrick Loney, Robert Miles Young, Daniel Robert Queen, Aaron Ashley Hathaway, John X. Przybysz
  • Publication number: 20180331443
    Abstract: One example includes a device that is comprised of a plurality of printed circuit boards, a plurality of vias, and a plurality of castellations. The plurality of printed circuit boards are laminated together, at least some of the plurality of printed circuit boards including a dielectric panel and a plurality of conductor pads. The plurality of vias, through the plurality of conductor pads, include a conductive material to respectively electrically couple the plurality of conductor pads with each other. The plurality of castellations, on at least one side of the plurality of printed circuit boards, to electrically couple each of a plurality of contact pins of an integrated circuit socket with respective contact pads of the plurality of conductor pads.
    Type: Application
    Filed: May 12, 2017
    Publication date: November 15, 2018
    Applicant: NORTHROP GRUMMAN SYSTEMS CORPORATION
    Inventors: AARON ASHLEY HATHAWAY, ROBERT MILLER, ERICA ANNE SANKER
  • Patent number: 10128592
    Abstract: One example includes a device that is comprised of a plurality of printed circuit boards, a plurality of vias, and a plurality of castellations. The plurality of printed circuit boards are laminated together, at least some of the plurality of printed circuit boards including a dielectric panel and a plurality of conductor pads. The plurality of vias, through the plurality of conductor pads, include a conductive material to respectively electrically couple the plurality of conductor pads with each other. The plurality of castellations, on at least one side of the plurality of printed circuit boards, to electrically couple each of a plurality of contact pins of an integrated circuit socket with respective contact pads of the plurality of conductor pads.
    Type: Grant
    Filed: May 12, 2017
    Date of Patent: November 13, 2018
    Assignee: NORTHROP GRUMMAN SYSTEMS CORPORATION
    Inventors: Aaron Ashley Hathaway, Robert Miller, Erica Anne Sanker