Abstract: One example includes a device that is comprised of a plurality of printed circuit boards, a plurality of vias, and a plurality of castellations. The plurality of printed circuit boards are laminated together, at least some of the plurality of printed circuit boards including a dielectric panel and a plurality of conductor pads. The plurality of vias, through the plurality of conductor pads, include a conductive material to respectively electrically couple the plurality of conductor pads with each other. The plurality of castellations, on at least one side of the plurality of printed circuit boards, to electrically couple each of a plurality of contact pins of an integrated circuit socket with respective contact pads of the plurality of conductor pads.