Abstract: The present disclosure pertains to electric machines such as electric propulsion systems for aircraft that integrated cooling systems, and methods of cooling such an electric machine. Exemplary electric machines include an electric motor that has a stator, a rotor, and a drive shaft operably coupled to the rotor. Exemplary electric machines further include a motor cooling conduit that defines a pathway for conveying a cooling fluid through or around at least a portion of the electric motor, a casing assembly that circumferentially surrounds at least a portion of the electric motor, a casing assembly conduit integrally formed within at least a portion of the casing assembly which defines a pathway for conveying the cooling fluid through the at least a portion of the casing assembly, and a pump or compressor operably coupled to the drive shaft and configured to circulate the cooling fluid through the motor cooling conduit and the casing assembly conduit.

Abstract: The present disclosure relates to an integrated power semiconductor packaging apparatus and a power converter containing the integrated power semiconductor packaging apparatus. The integrated power semiconductor packaging apparatus comprises a plurality of power semiconductor devices and an electrically insulative substrate formed integrally. The electrically insulative substrate comprises a flat surface, at least one separation wall protruding from the flat surface and a flow channel inside the electrically insulative substrate. The at least one separation wall is configured to separate the flat surface into a plurality of flat areas, and each of the plurality of flat areas is configured to receive one of the plurality of power semiconductor devices. The flow channel is configured for allowing a coolant flowing through to remove heat from the plurality of power semiconductor devices.

Abstract: A vehicle weather damage-prevention system is provided. The system may include a vehicle computing device associated with a vehicle, a covered parking location (CPL) computing device associated with a covered parking location, and an insurance computing device. The vehicle computing device may receive weather data and determine whether the vehicle is affected by inclement weather. The vehicle computing device may receive from the CPL computing device information indicating whether the covered parking location has available parking spots. The vehicle computing device may transmit a request to the CPL computing device to reserve a parking spot. The CPL computing device may selectively permit the vehicle access to the covered parking location. The insurance computing device may monitor the vehicle computing device and/or the CPL computing device and determine if an insurance policy is eligible for insurance-related benefits based upon a usage profile of the vehicle or the covered parking location.

Abstract: A cooling system includes one or more heat generating components located within an enclosure. A first conduit is thermally connected to one or more of the heat generating components, and the first conduit is fluidly connected to a distribution manifold and a condensing unit. The condensing unit is located external to the enclosure and above the heat generating components. The distribuition manifold is located below the heat generating components. A second conduit is fluidly connected to the condensing unit and the distribution manifold. The cooling system includes a two-phase cooling medium. The first conduit, condensing unit, second conduit and distribution manifold form a loop in which the cooling medium circulates.

Abstract: An insurance computing device is provided. The insurance computing device may include a processor and a memory. The processor may be programmed to receive a registration request from a vehicle computing device associated with a vehicle and/or a covered parking location (CPL) computing device associated with a covered parking location, generate a usage profile associated with at least one of the vehicle and the covered parking location, monitor the vehicle computing device and/or the CPL computing device for any requests to reserve an available parking spot of the covered parking location, update the usage profile, determine if an insurance policy associated with the vehicle and/or the covered parking location is eligible for insurance-related benefits based upon the usage profile.

Abstract: A computer-implemented method for providing covered parking to vehicles is provided. The method may include transmitting a location identifier of a covered parking location and a communication address of a covered parking location (CPL) computing device to a vehicle computing device and/or an insurance computing device. The method may further include transmitting a signal to the vehicle computing device indicating a number of available parking spots of the covered parking location when the vehicle computing device contacts the CPL computing device, receiving a request from the vehicle computing device to reserve a parking spot of the covered parking location, determining whether to accept the request, and transmitting a response to the vehicle computing device. Accepting the request causes the CPL computing device to permit a vehicle associated with the vehicle computing device access to the covered parking location.

Abstract: An electrical system for use in powering an electrical device includes a housing, a plurality of electrical components positioned within the housing, and a cooling system coupled in flow communication with the plurality of electrical components. The cooling system includes a sorption chiller positioned proximate the housing and is configured to utilize waste heat from the plurality of electrical components to condition air within the housing such that an internal temperature of the housing is less than an ambient temperature external to the housing.

Abstract: A heat transfer assembly useful for dissipating heat from the heat emitting device is disclosed. The assembly includes a module inlet for receiving a coolant, at least one module having a first part with a recess to receive a portion of the heat emitting device, and a second part having a shaped cutout portion and a solid portion, where the second part allows a uniform compression of a seal component disposed on the first part. The first part and the second part are mechanically connected to each other; and a module outlet is used for discharging a heat absorbed coolant after absorbing heat from the heat emitting device, where the at least one module is connected to the module inlet and the module outlet. In another embodiment, multiple modules are configured in a symmetrical layout to provide a balanced flow of the coolant in the heat transfer assembly.

Abstract: Heat dissipation system, a power converter using such a heat dissipation system, and an associated method of thermal management of the power converter are disclosed. The heat dissipation system includes a condenser, a first cooling loop, and a second cooling loop. The first cooling loop is coupled to the condenser and includes a first two-phase heat transfer device. The second cooling loop is coupled to the condenser and includes a second two-phase heat transfer device. The condenser is disposed above the first and second two-phase heat transfer devices.

Abstract: A heat transfer assembly useful for dissipating heat from the heat emitting device is disclosed. The assembly includes a module inlet for receiving a coolant, at least one module having a first part with a recess to receive a portion of the heat emitting device, and a second part having a shaped cutout portion and a solid portion, where the second part allows a uniform compression of a seal component disposed on the first part. The first part and the second part are mechanically connected to each other; and a module outlet is used for discharging a heat absorbed coolant after absorbing heat from the heat emitting device, where the at least one module is connected to the module inlet and the module outlet. In another embodiment, multiple modules are configured in a symmetrical layout to provide a balanced flow of the coolant in the heat transfer assembly.

Abstract: The present disclosure relates to an integrated power semiconductor packaging apparatus and a power converter containing the integrated power semiconductor packaging apparatus. The integrated power semiconductor packaging apparatus comprises a plurality of power semiconductor devices and an electrically insulative substrate formed integrally. The electrically insulative substrate comprises a flat surface, at least one separation wall protruding from the flat surface and a flow channel inside the electrically insulative substrate. The at least one separation wall is configured to separate the flat surface into a plurality of flat areas, and each of the plurality of flat areas is configured to receive one of the plurality of power semiconductor devices. The flow channel is configured for allowing a coolant flowing through to remove heat from the plurality of power semiconductor devices.

Abstract: A heat removal assembly for use with a power converter that includes a condenser and an evaporator coupled in flow communication with the condenser. The evaporator is configured to channel working fluid therebetween. The evaporator includes a supply housing, a receiving housing, and at least one expansion housing extending between the supply housing and the receiving housing. The at least one expansion housing includes a flow inlet defined at the supply housing and a flow outlet defined at said receiving housing, and the flow inlet is sized smaller in cross-sectional size than the flow outlet.

Abstract: A heat removal assembly for use with a power converter that includes a condenser and an evaporator coupled in flow communication with the condenser. The evaporator is configured to channel working fluid therebetween. The evaporator includes a supply housing, a receiving housing, and at least one expansion housing extending between the supply housing and the receiving housing. The at least one expansion housing includes a flow inlet defined at the supply housing and a flow outlet defined at said receiving housing, and the flow inlet is sized smaller in cross-sectional size than the flow outlet.

Abstract: Provided are systems and methods for cooling a power converter. For example, there is provided a controller programmed to control a heat transport rate between a coolant disposed in a cooling system and a power converter coupled thereto by regulating a pressure of the coolant in the cooling system.

Abstract: A subsea power module includes an outer pressure compensated vessel defining an interior chamber and one or more heat generating electrical components disposed within the interior chamber. The outer pressure compensated vessel is configured to maintain a pressure within the interior chamber substantially the same as an ambient pressure outside the outer pressure compensated vessel. Each of the electrical components may be disposed within an inner chamber of a pressure vessel disposed within the interior chamber of the outer pressure compensated vessel. Each of the one or more heat generating electrical components is configured to transfer heat generated within the interior chamber of the outer pressure compensated vessel through the wall defining the interior chamber to a fluid, such as seawater, surrounding the outer pressure compensated vessel.

Abstract: A modular substation (10) for subsea applications includes a plurality of modular DC/AC converters (32) configured for converting DC electrical power transmitted along a DC transmission link (24) into AC electrical power for supplying to a plurality of subsea loads (56). The plurality of modular DC/AC converters (32) is configured to couple in series to the DC transmission link (24) and couple in parallel to an AC distribution network (52). At least a first modular DC/AC converter (32) is configured to be selectively electrically and mechanically disconnected from the DC transmission link (24) and the AC distribution network (52) to facilitate maintenance of the first modular DC/AC converters (32) while the AC distribution network (52) continues to supply AC electrical power to at least one of the plurality of subsea loads (56). The modular substation (10) also comprises protection and bypass circuits (26) intended to isolate faulty DC/AC converters (32) and to facilitate safe maintenance and repair.

Abstract: A submersible power distribution system is provided. The system includes at least one receptacle configured to be exposed to an underwater environment and a plurality of power conversion modules positioned within the at least one receptacle. Each of the plurality of power conversion modules includes a first enclosure configured to be exposed to the underwater environment, the first enclosure defining a first interior cavity configured to have a first pressure. Power conversion modules also include at least one second enclosure positioned within the first interior cavity. The at least one second enclosure defines a second interior cavity configured to have a second pressure that is lower than the first pressure. The at least one second enclosure is configured to restrict exposure of non-pressure-tolerant power electronics in the second interior cavity to the first pressure.

Abstract: A submersible power distribution system is provided. The system includes at least one receptacle configured to be exposed to an underwater environment and a plurality of power conversion modules positioned within the at least one receptacle. Each of the plurality of power conversion modules includes a first enclosure configured to be exposed to the underwater environment, the first enclosure defining a first interior cavity configured to have a first pressure. Power conversion modules also include at least one second enclosure positioned within the first interior cavity. The at least one second enclosure defines a second interior cavity configured to have a second pressure that is lower than the first pressure. The at least one second enclosure is configured to restrict exposure of non-pressure-tolerant power electronics in the second interior cavity to the first pressure.

Abstract: A subsea power module includes an outer pressure compensated vessel defining an interior chamber and one or more heat generating electrical components disposed within the interior chamber. The outer pressure compensated vessel is configured to maintain a pressure within the interior chamber substantially the same as an ambient pressure outside the outer pressure compensated vessel. Each of the electrical components may be disposed within an inner chamber of a pressure vessel disposed within the interior chamber of the outer pressure compensated vessel. Each of the one or more heat generating electrical components is configured to transfer heat generated within the interior chamber of the outer pressure compensated vessel through the wall defining the interior chamber to a fluid, such as seawater, surrounding the outer pressure compensated vessel.

Abstract: A method for forming a conductive pattern on a substrate deposits, onto a surface of the substrate, a nanoparticle ink that comprises nanoparticles of a conductive or semiconductor material, at least one low boiling point solvent, and from 0.1 weight % to 50 weight % of a high boiling point solvent. The method forms a partially wet patterned substrate by drying the deposited nanoparticle ink to a wetness range between about 3 weight % and 8 weight % solvent. The method directs a patterned illumination of laser light to cure the deposited ink pattern on the partially wet patterned substrate.