Abstract: An apparatus and method for dynamically centering a setup-time and hold-time window. An access window defined by a setup-time and a hold-time is determined. A determination is made whether the access window is centered about a centerline. The centerline is a point between a predetermined setup-time limit and a predetermined hold-time limit. A dynamic access window centering process is performed in response to the determination that the access window is not centered about the centerline. The dynamic access window centering process includes: determining that the access window has shifted from the centerline; and providing at least one of a dynamic delay and a dynamic speed-up of the access window based upon the determination that the access window has shifted from the centerline.

Abstract: A semiconductor component includes adjustment circuitry configured to adjust selected physical and electrical characteristics of the component or elements thereof, and an input/output configuration of the component. The component includes a semiconductor die, a substrate attached to the die, and terminal contacts on the substrate. The adjustment circuitry includes conductors and programmable links, such as fuses or anti-fuses, in electrical communication with the die and the terminal contacts. The adjustment circuit can also include capacitors and inductance conductors. The programmable links can be placed in a selected state (e.g., short or open) using a laser or programming signals. A method for fabricating the component includes the steps of forming the adjustment circuitry, and then placing the programmable links in the selected state to achieve the selected adjustment.

Abstract: A method and apparatus to characterize a synchronous device after it is packaged. For synchronous devices, such as SDRAMs implementing a Delay Locked Loop (DLL) to synchronize one signal, such as an external clock signal with a second signal, such as a data signal, a counter is coupled to the phase detector of the DLL to track the entry point of the delay line. The entry point information can be taken over a variety of voltages, temperatures, and frequencies to characterize the DLL. The counter may be located on the synchronous device or external to the device.

Abstract: A delay-locked loop adjusts a delay of a clock signal that is generated in response to an external clock signal. The clock signal is applied to an output buffer to clock the buffer so that data or clock signals from the buffer are synchronized with the external clock signal. The output buffer operates in a full-drive and reduced-drive mode in response to an output drive strength bit having first and second logic states, respectively. The delay-locked loop adjusts the delay of the clock signal in response to the state of the output drive strength bit to keep the data or clock signals from the buffer synchronized during both modes of operation.

Abstract: Apparatus and methods for measuring the potential for mutual coupling in an integrated circuit package of any type or configuration using a network analyzer in conjunction with a coaxial test probe. Simple, low-cost test fixturing and methods of testing may be used to measure the parasitic capacitance and inductance of one or more I/O leads of an integrated circuit package, the measured parasitic capacitances and inductances providing an indication of the susceptibility of the integrated circuit package to mutual coupling between electrical leads of the package or between an electrical lead and other components of the integrated circuit package.

Abstract: Apparatus and methods for measuring the potential for mutual coupling in an integrated circuit package of any type or configuration using a network analyzer in conjunction with a coaxial test probe. Simple, low-cost test fixturing and methods of testing may be used to measure the parasitic capacitance and inductance of one or more I/O leads of an integrated circuit package, the measured parasitic capacitances and inductances providing an indication of the susceptibility of the integrated circuit package to mutual coupling between electrical leads of the package or between an electrical lead and other components of the integrated circuit package.

Abstract: Apparatus and methods for measuring the potential for mutual coupling in an integrated circuit package of any type or configuration using a network analyzer in conjunction with a coaxial test probe. Simple, low-cost test fixturing and methods of testing may be used to measure the parasitic capacitance and inductance of one or more I/O leads of an integrated circuit package, the measured parasitic capacitances and inductances providing an indication of the susceptibility of the integrated circuit package to mutual coupling between electrical leads of the package or between an electrical lead and other components of the integrated circuit package.

Abstract: Apparatus and methods for measuring the potential for mutual coupling in an integrated circuit package of any type or configuration using a network analyzer in conjunction with a coaxial test probe. Simple, low-cost test fixturing and methods of testing may be used to measure the parasitic capacitance and inductance of one or more I/O leads of an integrated circuit package, the measured parasitic capacitances and inductances providing an indication of the susceptibility of the integrated circuit package to mutual coupling between electrical leads of the package or between an electrical lead and other components of the integrated circuit package.

Abstract: A method and apparatus to characterize a synchronous device after it is packaged. For synchronous devices, such as SDRAMs implementing a Delay Locked Loop (DLL) to synchronize one signal, such as an external clock signal with a second signal, such as a data signal, a counter is coupled to the phase detector of the DLL to track the entry point of the delay line. The entry point information can be taken over a variety of voltages, temperatures, and frequencies to characterize the DLL. The counter may be located on the synchronous device or external to the device.

Abstract: An circuit device includes a stack of electrostatic discharge protection devices shared between a plurality of contact pads on the device. In addition, each contact pad is coupled to its own individual protection device. Together, the individual protection devices and the stack establish a trip point for shunting a charge from the contact pads in the event that any of the pads reach a voltage potential greater then the trip point. In doing so, the stack protects internal operations circuits from damage. At the same time, the shared stack conserves die space.

Abstract: A delay-locked loop adjusts a delay of a clock signal that is generated in response to an external clock signal. The clock signal is applied to an output buffer to clock the buffer so that data or clock signals from the buffer are synchronized with the external clock signal. The output buffer operates in a full-drive and reduced-drive mode in response to an output drive strength bit having first and second logic states, respectively. The delay-locked loop adjusts the delay of the clock signal in response to the state of the output drive strength bit to keep the data or clock signals from the buffer synchronized during both modes of operation.

Abstract: A delay-locked loop adjusts a delay of a clock signal that is generated in response to an external clock signal. The clock signal is applied to an output buffer to clock the buffer so that data or clock signals from the buffer are synchronized with the external clock signal. The output buffer operates in a full-drive and reduced-drive mode in response to an output drive strength bit having first and second logic states, respectively. The delay-locked loop adjusts the delay of the clock signal in response to the state of the output drive strength bit to keep the data or clock signals from the buffer synchronized during both modes of operation.

Abstract: A method and apparatus to characterize a synchronous device after it is packaged. For synchronous devices, such as SDRAMs implementing a Delay Locked Loop (DLL) to synchronize one signal, such as an external clock signal with a second signal, such as a data signal, a counter is coupled to the phase detector of the DLL to track the entry point of the delay line. The entry point information can be taken over a variety of voltages, temperatures, and frequencies to characterize the DLL. The counter may be located on the synchronous device or external to the device.

Abstract: A method and apparatus for improving output skew across the data bus of a synchronous integrated circuit device. The device includes a clock input buffer that receives a system clock signal and generates a buffered clock signal, a delay line that receives the buffered clock signal and generates a delayed clock signal, and an output circuit including output signal paths for outputting the output signals synchronously with the system clock signal by using the delayed clock signal. At least one of the output signal paths includes a delay circuit and an output buffer. Each delay circuit provides a programmable delay to the delayed clock signal to generate a unique delayed clock signal used to clock an output signal into the respective output buffer. By programming the delays based upon output skew, the output skew can be improved.

Abstract: An circuit device includes a stack of electrostatic discharge protection devices shared between a plurality of contact pads on the device. In addition, each contact pad is coupled to its own individual protection device. Together, the individual protection devices and the stack establish a trip point for shunting a charge from the contact pads in the event that any of the pads reach a voltage potential greater than the trip point. In doing so, the stack protects internal operations circuits from damage. At the same time, the shared stack conserves die space.

Abstract: A semiconductor assembly includes two leads, a primary die and a secondary support structure. Impedance networks of the secondary support structure establish an impedance between each lead and a different bond pad of the primary die. Although the distances between each bond pad and lead are substantially different, the impedances between each bond pad and lead are substantially the same.

Abstract: A semiconductor assembly includes two leads, a primary die and a secondary support structure. Impedance networks of the secondary support structure establish an impedance between each lead and a different bond pad of the primary die. Although the distances between each bond pad and lead are substantially different, the impedances between each bond pad and lead are substantially the same.

Abstract: An circuit device includes a stack of electrostatic discharge protection devices shared between a plurality of contact pads on the device. In addition, each contact pad is coupled to its own individual protection device. Together, the individual protection devices and the stack establish a trip point for shunting a charge from the contact pads in the event that any of the pads reach a voltage potential greater than the trip point. In doing so, the stack protects internal operations circuits from damage. At the same time, the shared stack conserves die space.