Abstract: The disclosure provides aluminum alloys having varying ranges of alloying elements and properties.

Abstract: A component for an electronic device can include a pre-formed substrate comprising a first metal and an additively manufactured portion bonded to the pre-formed substrate. The additively manufactured portion can include a first portion comprising a second metal and defining a volume, the first portion having a first value of a material property, and a second portion disposed in the volume, the second portion having a second value of the material property that is different from the first value.

Abstract: Embodiments are directed to an enclosure for an electronic device. In one aspect, an embodiment includes an enclosure having an enclosure component and an internal component that may be affixed along a bonding region. The enclosure component may be formed from an enclosure material and defines an exterior surface of the enclosure and an opening configured to receive a display. The internal component may be formed from a metal material different than the enclosure material. The bonding region may include an interstitial material that has a melting temperature that is less than a melting temperature of either one of the enclosure material or the metal material. The bonding region may also include one or more of the enclosure material or the metal material.

Abstract: The disclosure provides an aluminum alloy may include iron (Fe) of at least 0.10 wt %, silicon (Si) of at least 0.35 wt %, and magnesium (Mg) of at least 0.45 wt %, manganese (Mn) in amount of at least 0.005 wt %, and additional elements, the remaining wt % being Al and incidental impurities.

Abstract: A method for equity sharing of a property, equity sharing of a property, the method including: receiving details of a property inputted by a user; short listing the property for funding once score of the property is greater than a threshold; dividing the property into a plurality of equity shares, wherein each equity share indicates a fraction of ownership of the property; determining equity rate, wherein the equity rate is rate for each equity share; receiving an input from an investor searching for the property; providing option to the investor to purchase one or more equity shares; receiving indication of number of equity shares to be purchased by the investor; determining amount to be paid by the investor based on number of equity shares and the equity rate; transferring the amount to a trust; and storing ownership data including fractional ownership of the investor based on number of equity shares purchased by the investor.

Abstract: A mold apparatus to form a ceramic (or glass) includes a first mold portion having a first coefficient of thermal expansion and a second mold portion having a second coefficient of thermal expansion. In some embodiments, the first mold portion and/or the second mold portion are substantially immiscible with the ceramic material, such as silicon oxide, at a temperature greater than 600° C. In some embodiments, the first coefficient of thermal expansion and the second coefficient of thermal expansion are substantially similar to that of the glass or ceramic material. In some embodiments, the first coefficient of thermal expansion is different from the second coefficient of thermal expansion. In some embodiments, the first mold portion and the second mold portion contain a surface coating and a passivation layer.

Abstract: This application relates to a composite part that can include a non-metal layer having attachment features, and a metal part that is joined with the non-metal layer. The metal part can include a plurality of interlocking structures that are disposed at an external surface of the metal part, where each of the interlocking structures can include an opening characterized as having a first width, and an undercut region, where the opening leads into the undercut region, and the undercut region is characterized as having a second width that is greater than the first width such that the undercut region captures and retains one of the attachment features of the non-metal layer.

Abstract: A component for an electronic device can include a metal alloy formed by a metal injection molding process. The metal alloy can have a composition of about 32 wt % to about 38 wt % cobalt and about 62 wt % to about 68 wt % iron.

Abstract: This application relates to an enclosure for a portable electronic device is described. The enclosure can include metal bands included along the enclosure and a support structure. The support structure can include a thermally conductive core that is capable of conducting thermal energy generated by the operational components and rails that are bound between the metal bands and the thermally conductive core, where the rails are characterized as having a rate of thermal conductivity that is less than a rate of thermal conductivity of the thermally conductive core so that the thermal energy generated by the operational component is directed away from the operational component and away from the metal bands.

Abstract: An electronic device can include a component including a first material joined to a component including a second, different material. The first material can include steel and copper, while the second material can include aluminum. The first material can be joined to the second material by a pulsed laser welding process that forms an interface region having a ratio of an interface region length to a lateral length greater than about 1.4.

Abstract: A composite housing of an electronic device can include a metal shell including a first material having a first set of material properties and a surface at least partially defining an exterior surface of the electronic device. The composite housing can also include an interior portion including a second material having a second set of material properties independent of the first set of material properties and at least partially defining a feature. The interior portion can be bonded to the shell and disposed interior to the surface of the shell.

Abstract: A beryllium-free high-strength copper alloy includes, about 10-30 vol % of L12-(Ni,Cu)3(Al,Sn), and substantially excludes cellular discontinuous precipitation around grain boundaries. The alloy may include at least one component selected from the group consisting of: Ag, Cr, Mn, Nb, Ti, and V, and the balance Cu.

Abstract: The disclosure provides aluminum alloys having varying ranges of alloying elements and properties.

Abstract: A component for an electronic device can include a metal alloy formed by a metal injection molding process. The metal alloy can have a composition of about 32 wt % to about 38 wt % cobalt and about 62 wt % to about 68 wt % iron.

Abstract: Alloys, processes for preparing the alloys, and articles including the alloys are provided. The alloys can include, by weight, about 0.01% to about 1% vanadium, 0% to about 0.04% carbon, 0% to about 8% niobium, 0% to about 1% titanium, 0% to about 0.04% boron, 0% to about 1% tungsten, 0% to about 1% tantalum, 0% to about 1% hafnium, and 0% to about 1% ruthenium, the balance essentially molybdenum and incidental elements and impurities.

Abstract: The disclosure provides an aluminum alloy may include iron (Fe) of at least 0.10 wt %, silicon (Si) of at least 0.35 wt %, and magnesium (Mg) of at least 0.45 wt %, manganese (Mn) in amount of at least 0.005 wt %, and additional elements, the remaining wt % being Al and incidental impurities.

Abstract: The disclosure provides aluminum alloys having varying ranges of alloying elements and properties. The aluminum alloys have a wt % ratio of Zn to Mg from 2.5 to 3.5.

Abstract: Embodiments are directed to an enclosure for an electronic device. In one aspect, an embodiment includes an enclosure having an enclosure component and an internal component that may be affixed along a bonding region. The enclosure component may be formed from an enclosure material and defines an exterior surface of the enclosure and an opening configured to receive a display. The internal component may be formed from a metal material different than the enclosure material. The bonding region may include an interstitial material that has a melting temperature that is less than a melting temperature of either one of the enclosure material or the metal material. The bonding region may also include one or more of the enclosure material or the metal material.

Abstract: An alloy includes, in weight percentage, about 20.0% to about 25.0% chromium, 0% to about 5.0% molybdenum, about 3.0% to about 15.0% cobalt, about 1.5% to about 6.0% niobium, about 1.0% to about 3.0% tantalum, about 1.0% to about 5.0% tungsten, 0% to about 1.0% aluminum, 0% to about 0.05% carbon, 0% to about 0.01% titanium, and the balance nickel and incidental elements and impurities, wherein the alloy includes L12 and D022 precipitates in a compact morphology.

Abstract: An enclosure is formed by coupling an outer cover to a back enclosure piece. The enclosure defines an interior volume for receiving components of an electronic device. The back enclosure piece is formed from a metal frame component and a non-metal outer cover. A metal layer overlaps the metal frame component and the outer cover within the interior volume. The metal layer has a thickness that provides support and shatter resistance to the non-metal outer cover. The metal layer can form an inductor of a wireless power transfer circuit.