Abstract: The disclosure provides aluminum alloys having varying ranges of alloying elements and properties.

Abstract: A beryllium-free high-strength copper alloy includes, about 10-30 vol % of L12-(Ni,Cu)3(Al,Sn), and substantially excludes cellular discontinuous precipitation around grain boundaries. The alloy may include at least one component selected from the group consisting of: Ag, Cr, Mn, Nb, Ti, and V, and the balance Cu.

Abstract: A patch for a device in an electronic housing including an aluminum layer having a threshold thickness, a non-conductive layer on a first side of the aluminum layer, and a radio-frequency (RF) transparent layer on a second side of the aluminum layer is provided. A method for manufacturing an antenna window including a patch as above is also provided, the method including determining a thickness of the aluminum layer adjacent to an anodized aluminum layer. A method for manufacturing an antenna window including coating an aluminum layer having a threshold thickness on a radio-frequency (RF) transparent layer to form an RF transparent laminate is also provided. A method for manufacturing an antenna window including removing a thickness of aluminum is also provided. A method for manufacturing an antenna window including disposing a mask on an aluminum substrate and anodizing the aluminum substrate to a selected thickness is also provided.

Abstract: Micro additions of certain elements such as zirconium or titanium are added to high strength aluminum alloys to counter discoloring effects of other micro-alloying elements when the high strength alloys are anodized. The other micro-alloying elements are added to increase the adhesion of an anodic film to the aluminum alloy substrate. However, these micro-alloying elements can also cause slight discoloration, such as a yellowing, of the anodic film. Such micro-alloying elements that can cause discoloration can include copper, manganese, iron and silver. The micro additions of additional elements, such as one or more of zirconium, tantalum, molybdenum, hafnium, tungsten, vanadium, niobium and tantalum, can dilute the discoloration of the micro-alloying elements. The resulting anodic films are substantially colorless.

Abstract: Alloys, processes for preparing the alloys, and articles including the alloys are provided. The alloys can include, by weight, about 0.01% to about 1% vanadium, 0% to about 0.04% carbon, 0% to about 8% niobium, 0% to about 1% titanium, 0% to about 0.04% boron, 0% to about 1% tungsten, 0% to about 1% tantalum, 0% to about 1% hafnium, and 0% to about 1% ruthenium, the balance essentially molybdenum and incidental elements and impurities.

Abstract: An alloy includes, in weight percentage, about 20.0% to about 25.0% chromium, 0% to about 5.0% molybdenum, about 3.0% to about 15.0% cobalt, about 1.5% to about 6.0% niobium, about 1.0% to about 3.0% tantalum, about 1.0% to about 5.0% tungsten, 0% to about 1.0% aluminum, 0% to about 0.05% carbon, 0% to about 0.01% titanium, and the balance nickel and incidental elements and impurities, wherein the alloy includes L12 and D022 precipitates in a compact morphology.

Abstract: A patch for a device in an electronic housing including an aluminum layer having a threshold thickness, a non-conductive layer on a first side of the aluminum layer, and a radio-frequency (RF) transparent layer on a second side of the aluminum layer is provided. A method for manufacturing an antenna window including a patch as above is also provided, the method including determining a thickness of the aluminum layer adjacent to an anodized aluminum layer. A method for manufacturing an antenna window including coating an aluminum layer having a threshold thickness on a radio-frequency (RF) transparent layer to form an RF transparent laminate is also provided. A method for manufacturing an antenna window including removing a thickness of aluminum is also provided. A method for manufacturing an antenna window including disposing a mask on an aluminum substrate and anodizing the aluminum substrate to a selected thickness is also provided.

Abstract: A patch for a device in an electronic housing including an aluminum layer having a threshold thickness, a non-conductive layer on a first side of the aluminum layer, and a radio-frequency (RF) transparent layer on a second side of the aluminum layer is provided. A method for manufacturing an antenna window including a patch as above is also provided, the method including determining a thickness of the aluminum layer adjacent to an anodized aluminum layer. A method for manufacturing an antenna window including coating an aluminum layer having a threshold thickness on a radio-frequency (RF) transparent layer to form an RF transparent laminate is also provided. A method for manufacturing an antenna window including removing a thickness of aluminum is also provided. A method for manufacturing an antenna window including disposing a mask on an aluminum substrate and anodizing the aluminum substrate to a selected thickness is also provided.

Abstract: The disclosure provides an aluminum alloy comprising second phase particles having an Al(FeMn)Si phase with an (Fe+Mn):Si ratio of 0.5 to 2.5 and a mean particle diameter of 0.5 ?m to 10 ?m. The disclosure also provides an aluminum alloy comprising 0.02 to 0.11 wt % Fe, 0 to 0.16 wt % Mn, 0 to 0.08 wt. % Cr, 0.40 to 0.90 wt % Mg, and 0.20 to 0.60 wt % Si, wherein the aluminum alloy is homogenized at a temperature from 550 to 590° C.

Abstract: A patch for a device in an electronic housing including an aluminum layer having a threshold thickness, a non-conductive layer on a first side of the aluminum layer, and a radio-frequency (RF) transparent layer on a second side of the aluminum layer is provided. A method for manufacturing an antenna window including a patch as above is also provided, the method including determining a thickness of the aluminum layer adjacent to an anodized aluminum layer. A method for manufacturing an antenna window including coating an aluminum layer having a threshold thickness on a radio-frequency (RF) transparent layer to form an RF transparent laminate is also provided. A method for manufacturing an antenna window including removing a thickness of aluminum is also provided. A method for manufacturing an antenna window including disposing a mask on an aluminum substrate and anodizing the aluminum substrate to a selected thickness is also provided.

Abstract: A lead-free copper alloy includes, in combination by weight, about 10.0% to about 20.0% bismuth, about 0.05% to about 0.3% phosphorous, about 2.2% to about 10.0% tin, up to about 5.0% antimony, and up to about 0.02% boron, the balance essentially copper and incidental elements and impurities. The alloy contains no more than about 0.05 wt. % or 0.10 wt. % lead.

Abstract: The disclosure relates to an alloy comprising, by weight, about 5.8% to about 6.8% zinc, about 2.5% to about 3.0% magnesium, about 1.5% to about 2.3% copper, 0% to about 0.2% scandium, 0% to about 0.2% zirconium, and optionally less than about 0.50% silver, the balance essentially aluminum and incidental elements and impurities. In embodiments, the alloy has a stress-corrosion cracking threshold stress of at least about 240 MPa using an ASTM G47 short-transverse test specimen and a yield strength of at least about 510 MPa using an ASTM E8 longitudinal test specimen.

Abstract: A lead-free copper alloy includes, in combination by weight, about 10.0% to about 20.0% bismuth, about 0.05% to about 0.3% phosphorous, about 2.2% to about 10.0% tin, up to about 5.0% antimony, and up to about 0.02% boron, the balance essentially copper and incidental elements and impurities. The alloy contains no more than about 0.05 wt. % or 0.10 wt. % lead.

Abstract: An aluminum casting alloy resistant to hot tearing includes, in wt %, about 4.0 to about 6.9 Zn, about 2.0 to about 3.5 Mg, about 0.6 to about 1.2 Cu, about 0.38 to about 0.57 Sc, about 0.18 to about 0.28 Zr, and the balance Al and impurities, substantially excluding Fe, Mn, and Si, said alloy characterized by a freezing range of less than about 150° C., solidus temperature above about 490° C., and eutectic phase fraction above about 5% at the late stages of solidification. The alloy is processed to form a dispersion of L12 particles inoculating fcc grains with a grain diameter of about 40 to about 60 ?m, and ??-phase precipitates enabling an ambient yield strength from about 410 MPa to about 540 MPa.

Abstract: A beryllium-free high-strength copper alloy includes, about 10-30 vol % of L12-(Ni,Cu)3(Al,Sn), and substantially excludes cellular discontinuous precipitation around grain boundaries. The alloy may include at least one component selected from the group consisting of: Ag, Cr, Mn, Nb, Ti, and V, and the balance Cu.

Abstract: Oxidation resistant niobium based alloys have a composition to provide a stable ternary phase such as PtYAl or PdYAl, which supplies yttrium and aluminum to the system and forms a protective oxide such as Yttria-Aluminum-Garnet (YAG) scale at elevated temperature. These niobium based alloys further achieve an optimal combination of oxidation resistance and creep strength through a fine dispersion of a coherent second phase. The alloys, withstanding higher combustion temperatures, are useful for extreme-environment propulsion and power applications, including hot sections of gas turbine engines, aerospace turbine blades, and chemical and petroleum plants, where higher turbine efficiency and reduction of operating costs, by-products emissions, and global fuel reserves consumption are desired.