Patents by Inventor Abhishek Gupta

Abhishek Gupta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120158675
    Abstract: The subject disclosure is directed towards changing a file from a fully deduplicated state to a partially deduplicated state in which some of the file data is deduplicated in a chunk store, and some is recalled into the file, that is, in the file's storage volume. A partial recall mechanism such as in a file system filter tracks (e.g., via a bitmap in a file reparse point) whether file data is maintained in the chunk store or has been recalled to the file. Data is recalled from the chunk store as needed, and committed (e.g., flushed) to the file. Also described is efficiently returning the file to a fully deduplicated state by using the tracking information to determine which parts of the file are already deduplicated into the chunk store so as to avoid their further deduplication processing.
    Type: Application
    Filed: December 16, 2010
    Publication date: June 21, 2012
    Applicant: MICROSOFT CORPORATION
    Inventors: Abhishek Gupta, Ran Kalach, Chun Ho Cheung, James Robert Benton, Joerg-Thomas Pfenning
  • Publication number: 20120131025
    Abstract: Data streams may be stored in a chunk store in the form of stream maps and data chunks. Data chunks corresponding to a data stream may be stored in a chunk container, and a stream map corresponding to the data stream may point to the data chunks in the chunk container. Multiple stream maps may be stored in a stream container, and may point to the data chunks in the chunk container in a manner that duplicate data chunks are not present. Techniques are provided herein for localizing the storage of related data chunks in such chunk containers, for locating data chunks stored in chunk containers, for storing data streams in chunk stores in localized manners that enhance locality and decrease defragmentation, and for reorganizing stored data streams in chunks stores.
    Type: Application
    Filed: November 18, 2010
    Publication date: May 24, 2012
    Applicant: MICROSOFT CORPORATION
    Inventors: Chun Ho (Ian) Cheung, Paul Adrian Oltean, Ran Kalach, Abhishek Gupta, James Robert Benton, Ronakkumar Desai
  • Patent number: 8174113
    Abstract: Methods and associated structures of forming an indium containing solder material directly on an active region of a copper IHS is enabled. A copper indium containing solder intermetallic is formed on the active region of the IHS. The solder intermetallic improves the solder-TIM integration process for microelectronic packaging applications.
    Type: Grant
    Filed: September 17, 2008
    Date of Patent: May 8, 2012
    Assignee: Intel Corporation
    Inventors: Abhishek Gupta, Mike Boyd, Carl Deppisch, Jinlin Wang, Daewoong Suh, Brad Drew
  • Publication number: 20120109841
    Abstract: A business object model, which reflects data that is used during a given business transaction, is utilized to generate interfaces. This business object model facilitates commercial transactions by providing consistent interfaces that are suitable for use across industries, across businesses, and across different departments within a business during a business transaction. In some operations, software creates, updates, or otherwise processes information related to a freight order, a maintenance plan, a maintenance task list, a request for supplier freight quote, and/or a supplier freight quote business object.
    Type: Application
    Filed: December 29, 2011
    Publication date: May 3, 2012
    Inventors: Ahmed Daddi Moussa, Oliver Dannat, Ruediger Fritz, Abhishek Gupta, Martin Janssen, Heidi Johann, Steve Mallack, Younus Mohammed, Elmar Paul, Kallu Vinay Kumar Reddy, Thomas Roesch, Dirk Schiebeler, Torsten Schmitt, Andreas Schoknecht, Michael Schweitzer, Shankar V
  • Publication number: 20110312131
    Abstract: In one embodiment, the present invention includes a method for placing a thermal interface material (TIM) between a die including a backside metallic (BSM) layer including copper (Cu) and a heat spreader having a contact surface including Cu, where the TIM is formed of an alloy including indium (In) and tin (Sn), and bonding the TIM to the die and the heat spreader to form at least one quaternary intermetallic compound (IMC) layer. Other embodiments are described and claimed.
    Type: Application
    Filed: August 30, 2011
    Publication date: December 22, 2011
    Inventors: Mukul Renavikar, Daewoong Suh, Carl Deppisch, Abhishek Gupta
  • Publication number: 20110275453
    Abstract: Golf club heads include: (a) a body member constructed, at least in part, from cellular structure material; (b) a ball striking face engaged or integrally formed with the body member; and/or (c) a shaft member engaged with the body member. Weight savings realized through the use of lightweight cellular structure materials allows additional weight to be placed at other desired locations in the club head structure. By adjusting and selectively placing weight in the club head structure, the club head's moment of inertia, center of gravity, and/or stability characteristics may be favorably affected and/or the resulting ball flight may be influenced and/or customized to a specific individual golfer, to provide a more controlled, consistent, and/or straight ball flight.
    Type: Application
    Filed: July 18, 2011
    Publication date: November 10, 2011
    Applicant: Nike, Inc.
    Inventors: Gary G. Tavares, David N. Franklin, Abhishek Gupta, David S. Lee, John T. Stites
  • Patent number: 8030757
    Abstract: In one embodiment, the present invention includes a method for placing a thermal interface material (TIM) between a die including a backside metallic (BSM) layer including copper (Cu) and a heat spreader having a contact surface including Cu, where the TIM is formed of an alloy including indium (In) and tin (Sn), and bonding the TIM to the die and the heat spreader to form at least one quaternary intermetallic compound (IMC) layer. Other embodiments are described and claimed.
    Type: Grant
    Filed: June 29, 2007
    Date of Patent: October 4, 2011
    Assignee: Intel Corporation
    Inventors: Mukul Renavikar, Daewoong Suh, Carl Deppisch, Abhishek Gupta
  • Patent number: 7981831
    Abstract: Catalysts are described in which an active catalyst is disposed on a low surface area, oxide support. Methods of forming catalysts are described in which a Cr-containing metal is oxidized to form a chromium oxide layer and an active catalyst is applied directly on the chromium oxide layer. Methods of making new catalysts are described in which the surface is sonicated prior to depositing the catalyst. Catalyst systems and methods of oxidation are also described. The inventive systems, catalysts and methods are, in some instances, characterized by surprisingly superior results.
    Type: Grant
    Filed: December 18, 2007
    Date of Patent: July 19, 2011
    Assignee: Velocys
    Inventors: Barry Lee-Mean Yang, Ruiqiang Long, Junko M. Watson, Abhishek Gupta
  • Publication number: 20110167104
    Abstract: Embodiments are directed selectively mixing media at an application server arbitrating a group communication session for a communication group. In an embodiment, the application server receives media, from one or more session participants of the group communication session, for transmission to the communication group. The application server determines a number of session participants that are providing the received media. The application server determines whether to bypass the received media from entry into a de-jitter buffer based at least in part on the determined number, wherein the de-jitter buffer is configured to queue media from session participants for mixing by the application server during the group communication session. For example, the application server can determine to bypass the received media from entry into the de-jitter buffer if the number is below a threshold number. The application server transmits the received media to the communication group.
    Type: Application
    Filed: July 8, 2010
    Publication date: July 7, 2011
    Applicant: QUALCOMM Incorporated
    Inventors: Abhishek Gupta, Arvind V. Santhanam, Vidyadhar Kamath, Rajan Verma
  • Patent number: 7879935
    Abstract: The invention provides for production of nanoparticles dispersed in polymers where the nanoparticles include metals and metal oxides/sulfides that provide enhanced properties (e.g. higher refractive index) to the material. The nanoparticles are typically formed in situ within the polymer. Typically the nanoparticles are in the form of nanocrystals.
    Type: Grant
    Filed: June 7, 2005
    Date of Patent: February 1, 2011
    Assignee: Battelle Memorial Institute
    Inventors: Lalgudi S. Ramanathan, Bhima R. Vijayendran, Michael D. Schulte, Stephen S. Hardaker, Angela Hardaker, legal representative, Abhishek Gupta, Joel D. Elhard
  • Publication number: 20100317444
    Abstract: Human computation games are provided wherein a player is shown a page, such as a web page. The player is then asked to provide one or more terms that are intended to cause a search engine to return the page in response to performing a query using the terms. The terms provided by the player during game play are then collected, stored, and utilized to improve the performance of the search engine.
    Type: Application
    Filed: June 10, 2009
    Publication date: December 16, 2010
    Applicant: Microsoft Corporation
    Inventors: Raman Chandrasekar, Christopher Brian Quirk, Sarthak Deepak Shah, Matthew Richardson, Christopher John Champness Burges, Abhishek Gupta, Hao Ma
  • Patent number: 7808992
    Abstract: A PVLAN having a primary and secondary VLAN's where the primary and secondary VLAN's have ports and the users connected to those ports. The MAC addresses of those users are learned in the primary or the secondary VLAN's and together with the port designation are stored preferably in tables associated with the VLAN's and the associated VLAN's. Processes are provided that replicate the tables in the other VLAN's so that the information necessary to transfer packets between source and destination ports is available to the associated VLAN's.
    Type: Grant
    Filed: December 30, 2004
    Date of Patent: October 5, 2010
    Assignee: Cisco Technology, Inc.
    Inventors: Sanjib Homchaudhuri, Senthil Arunacahalam, Sundher Narayanaswamy, Krishna Kumar Vavilala, Abhishek Gupta
  • Publication number: 20100162294
    Abstract: This disclosure details the implementation of methods, systems and computer program products for remote digital video recorder (DVR) interface provisioning (hereinafter, “DIP”). DIP systems allow for authentication, validation, and registration of users and/or user devices as well as management of identifiers associated with those users and devices. Through interaction with DIP systems, users may associate different devices with each other and/or with one or more underlying service systems and/or accounts to allow integrated use of multiple devices in association with those services. In one implementation, DIP systems may be employed to register one or more mobile and/or remote devices (e.g., mobile phones) with DVR systems to allow for remote manipulation of video recording schedules, content management, parental control management, and/or the like DVR features.
    Type: Application
    Filed: December 19, 2008
    Publication date: June 24, 2010
    Applicant: Verizon Data Service, LLC
    Inventors: Fenglin Yin, Diego Sebastian Rozensztejn, Abhishek Gupta, Okeno Palmer, Guillermo Ortiz, Jack Jianxiu Hao
  • Publication number: 20100126981
    Abstract: An electrically conductive coating composition is provided for use on aircraft and other substrate surfaces to prevent the formation of ice or to melt ice. The conductive coating composition may include a nanomaterial such as carbon nanotubes dispersed in a solvent which may be applied to a substrate surface to form a thin film which is resistively heatable. The conductive coating may also comprise a nanomaterial formed from carbon nanotubes or fullerenes grafted to a polymer containing an active functional group which renders a substrate surface icephobic and is also resistively heatable.
    Type: Application
    Filed: August 1, 2007
    Publication date: May 27, 2010
    Applicant: BATTELLE MEMORIAL INSTITUTE
    Inventors: Amy M. Heintz, Anne-Claire Christiaen, Bhima Rao Vijayendran, Joel D. Elhard, Ramanathan S. Lalgudi, Wayne B. Robbins, Abhishek Gupta, Jeffrey Cafmeyer
  • Publication number: 20100098598
    Abstract: Catalysts are described in which an active catalyst is disposed on a low surface area, oxide support. Methods of forming catalysts are described in which a Cr-containing metal is oxidized to form a chromium oxide layer and an active catalyst is applied directly on the chromium oxide layer. Methods of making new catalysts are described in which the surface is sonicated prior to depositing the catalyst. Catalyst systems and methods of oxidation are also described. The inventive systems, catalysts and methods are, in some instances, characterized by surprisingly superior results.
    Type: Application
    Filed: December 18, 2007
    Publication date: April 22, 2010
    Inventors: Barry Lee-Mean Yang, Ruiqiang Long, Junko M. Waston, Abhishek Gupta
  • Publication number: 20100065246
    Abstract: Methods and associated structures of forming an indium containing solder material directly on an active region of a copper HIS is enabled. A copper indium containing solder intermetallic is formed on the active region of the IHS. The solder intermetallic improves the solder-TIM integration process for microelectronic packaging applications.
    Type: Application
    Filed: September 17, 2008
    Publication date: March 18, 2010
    Inventors: Abhishek Gupta, Mike Boyd, Carl Deppisch, Jinlin Wang, Daewoong Suh, Brad Drew
  • Publication number: 20090327105
    Abstract: A business object model, which reflects data that is used during a given business transaction, is utilized to generate interfaces. This business object model facilitates commercial transactions by providing consistent interfaces that are suitable for use across industries, across businesses, and across different departments within a business during a business transaction. In some operations, software creates, updates, or otherwise processes information related to a freight order, a maintenance plan, a maintenance task list, a request for supplier freight quote, and/or a supplier freight quote business object.
    Type: Application
    Filed: June 26, 2008
    Publication date: December 31, 2009
    Inventors: Ahmed Daddi Moussa, Oliver Dannat, Ruediger Fritz, Abhishek Gupta, Martin Janssen, Heidi Johann, Steve Mallack, Younus Mohammed, Elmar Paul, Kallu Vinay Kumar Reddy, Thomas Roesch, Dirk Schiebeler, Torsten Schmitt, Andreas Schoknecht, Michael Schweitzer, Shankar V
  • Publication number: 20090172757
    Abstract: An approach is provided for remotely controlling set-top boxes. A command is received from a computing device for controlling a plurality of set-top boxes. The set-top boxes are configured according to the received command.
    Type: Application
    Filed: December 28, 2007
    Publication date: July 2, 2009
    Applicant: Verizon Data Services Inc.
    Inventors: Raul Aldrey, Abhishek Gupta, Anil Solleti, Enrique Ruiz Velasco Fonseca, Laxmi Patel, Pericharla Anjaneya, Sudeep Dasgupta
  • Publication number: 20090001557
    Abstract: In one embodiment, the present invention includes a method for placing a thermal interface material (TIM) between a die including a backside metallic (BSM) layer including copper (Cu) and a heat spreader having a contact surface including Cu, where the TIM is formed of an alloy including indium (In) and tin (Sn), and bonding the TIM to the die and the heat spreader to form at least one quaternary intermetallic compound (IMC) layer. Other embodiments are described and claimed.
    Type: Application
    Filed: June 29, 2007
    Publication date: January 1, 2009
    Inventors: Mukul Renavikar, Daewoong Suh, Carl Deppisch, Abhishek Gupta
  • Publication number: 20080277779
    Abstract: A microelectronic package comprises a substrate (110), a die (120) having a front side (121) and a back side (122) located over the substrate, a thermally conducting layer (130) on the back side of the die, a microchannel (140) above the thermally conducting layer, and a cap (150) on the microchannel. The thermally conducting layer between the die and the microchannel may lend mechanical strength to the package, may be thin enough to be compliant and avoid contributing meaningful CTE mismatch with the die, and may prevent the formation or propagation of cracks in the microchannel.
    Type: Application
    Filed: May 7, 2007
    Publication date: November 13, 2008
    Inventors: Abhishek Gupta, Zhiyong Wang, Chuan Hu