Patents by Inventor Abraham Ravid
Abraham Ravid has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20150376782Abstract: Apparatus and methods of dimension control and monitoring between a processes fixture and a susceptor, and position determination of wafers are described.Type: ApplicationFiled: August 28, 2014Publication date: December 31, 2015Inventors: Kevin Griffin, Abraham Ravid, Alex Minkovich, Somesh Khandelwal, Joseph Yudovsky, Todd Egan
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Publication number: 20140367265Abstract: A measurement tool for measuring an electrical parameter of a metal film deposited on a front side of a workpiece includes an electrical sensor connected to a workpiece contact point, an energy beam source with a beam impact location on the front side, a holder and a translation mechanism capable of translating the holder relative to the workpiece support, the beam source supported on the holder, and a computer programmed to sense a behavior of an electrical parameter sensed by the sensor.Type: ApplicationFiled: October 29, 2013Publication date: December 18, 2014Applicant: APPLIED MATERIALS, INC.Inventors: Abraham Ravid, Dmitry A. Dzilno, Todd J. Egan, Robert O. Miller
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Publication number: 20140367267Abstract: An electroplating reactor includes an electro-plating solution in a bath, a ring cathode in the bath and located to contact a workpiece such that only the front side of the workpiece is immersed in the solution, plural anodes immersed in the bath below the ring cathode, and plural anode voltage sources coupled to the plural anodes; plural thickness sensors at spatially separate locations on the back side of the workpiece with feedback control to the anode voltage sources.Type: ApplicationFiled: October 29, 2013Publication date: December 18, 2014Applicant: APPLIED MATERIALS, INC.Inventors: Todd J. Egan, Edward W. Budiarto, Robert O. Miller, Abraham Ravid, Bridger E. Hoerner, Robert W. Batz, JR., Daniel J. Woodruff
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Patent number: 8698889Abstract: A metrology system has an elongate stationary camera pixel array facing a workpiece transit path of a robot with an field of view corresponding to a workpiece diameter and extending transverse to the transit path portion, and a stationary elongate light emitting array generally parallel to the pixel array. An image control processor causes the camera to capture successive image frames while the robot is moving the workpiece through the transit path.Type: GrantFiled: February 17, 2010Date of Patent: April 15, 2014Assignee: Applied Materials, Inc.Inventors: Abraham Ravid, Todd Egan, Karen Lingel, Mitchell DiSanto, Hari Kishore Ambal, Edward Budiarto
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Patent number: 8639377Abstract: Methods of determining thickness and phase of a GST layer on a semiconductor substrate are described using intensity spectra within the infra-red range. In particular, techniques for using certain transmission at certain frequencies are disclosed for faster thickness and phase determination in an in-line or standalone metrology/monitoring system for CMP processes.Type: GrantFiled: November 7, 2008Date of Patent: January 28, 2014Assignee: Applied Materials, Inc.Inventors: Kun Xu, Feng Q Liu, Yuchun Wang, Abraham Ravid, Wen-Chiang Tu
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Patent number: 8620064Abstract: A method is provided for imaging a workpiece by capturing successive frames of an elongate stationary field of view transverse to a workpiece transit path of a robot, while the workpiece is transported by the robot. The robot transit path is illuminated with an elongate illumination pattern transverse to the transit path to obtain a workpiece image of successive frames. Motion-induced image distortion is prevented or reduced adjusting the camera frame rate in real time in proportion to changes in robot velocity profile of the workpiece along the transit path.Type: GrantFiled: February 17, 2010Date of Patent: December 31, 2013Assignee: Applied Materials, Inc.Inventors: Abraham Ravid, Todd Egan, Karen Lingel
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Patent number: 8452077Abstract: A method is provided for imaging a workpiece by capturing successive frames of an elongate stationary field of view transverse to a workpiece transit path of a robot, while the workpiece is transported by the robot. The robot transit path is illuminated with an elongate illumination pattern transverse to the transit path to obtain a workpiece image of successive frames. Motion-induced image distortion is corrected by computing respective correct locations of respective ones of the frames along the transit path.Type: GrantFiled: February 17, 2010Date of Patent: May 28, 2013Assignee: Applied Materials, Inc.Inventors: Abraham Ravid, Todd Egan, Karen Lingel
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Publication number: 20120274318Abstract: A method and apparatus to determine a parameter of a metal-containing film are provided herein. In some embodiments, a method of determining a parameter of a metal-containing film may include generating a first magnetic field by flowing an alternating current through a coil disposed adjacent to and spaced apart from the metal-containing film, wherein the first magnetic field induces a second magnetic field proximate the metal-containing film; heating the metal-containing film from a first temperature to a second temperature; measuring a response of the first magnetic field to the second magnetic field as the metal-containing film is heated from the first temperature to the second temperature; and correlating the response with a rate of temperature change of the metal-containing film as the metal-containing film is heated from the first temperature to the second temperature to determine a parameter of the metal-containing film.Type: ApplicationFiled: April 27, 2011Publication date: November 1, 2012Applicant: APPLIED MATERIALS, INC.Inventor: ABRAHAM RAVID
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Patent number: 8125654Abstract: Systems, methods and apparatus are provided for determining a substrate polishing endpoint. The invention includes a light source adapted to transmit light to an edge of a substrate; one or more detectors adapted to detect an arrangement of light reflected from the substrate edge; and a controller adapted to determine a polishing endpoint for the substrate edge based on the arrangement of reflected light. Numerous other aspects are provided.Type: GrantFiled: April 16, 2009Date of Patent: February 28, 2012Assignee: Applied Materials, Inc.Inventors: Dominic J. Benvegnu, Boguslaw A. Swedek, Sen-Hou Ko, Abraham Ravid, Paul V. Miller
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Publication number: 20110294400Abstract: A method of determining a physical property of a substrate includes recording a first spectrum obtained from a substrate, the first spectrum being obtained during a polishing process that alters a physical property of the substrate. The method includes identifying, in a database, at least one of several previously recorded spectra that is similar to the recorded first spectrum. Each of the spectra in the database has a physical property value associated therewith. The method includes generating a signal indicating that a first value of the physical property is associated with the first spectrum, the first value being determined using the physical property value associated with the identified previously recorded spectrum in the database. A system for determining a physical property of a substrate includes a polishing machine, an endpoint determining module, and a database.Type: ApplicationFiled: July 28, 2011Publication date: December 1, 2011Inventors: Abraham Ravid, Boguslaw A. Swedek, Jeffrey Drue David, Jun Qian, Ingemar Carlsson, Dominic J. Benvegnu, Harry Q. Lee, Lakshmanan Karuppiah
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Patent number: 8014004Abstract: A method of determining a physical property of a substrate includes recording a first spectrum obtained from a substrate, the first spectrum being obtained during a polishing process that alters a physical property of the substrate. The method includes identifying, in a database, at least one of several previously recorded spectra that is similar to the recorded first spectrum. Each of the spectra in the database has a physical property value associated therewith. The method includes generating a signal indicating that a first value of the physical property is associated with the first spectrum, the first value being determined using the physical property value associated with the identified previously recorded spectrum in the database. A system for determining a physical property of a substrate includes a polishing machine, an endpoint determining module, and a database.Type: GrantFiled: June 23, 2010Date of Patent: September 6, 2011Assignee: Applied Materials, Inc.Inventors: Abraham Ravid, Boguslaw A. Swedek, Jeffrey Drue David, Jun Qian, Ingemar Carlsson, Dominic J. Benvegnu, Harry Q. Lee, Lakshmanan Karuppiah
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Publication number: 20110199477Abstract: A method is provided for imaging a workpiece by capturing successive frames of an elongate stationary field of view transverse to a workpiece transit path of a robot, while the workpiece is transported by the robot. The robot transit path is illuminated with an elongate illumination pattern transverse to the transit path to obtain a workpiece image of successive frames. Motion-induced image distortion is prevented or reduced adjusting the camera frame rate in real time in proportion to changes in robot velocity profile of the workpiece along the transit path.Type: ApplicationFiled: February 17, 2010Publication date: August 18, 2011Applicant: Applied Materials, Inc.Inventors: Abraham Ravid, Todd Egan, Karen Lingel
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Publication number: 20110200247Abstract: A method is provided for imaging a workpiece by capturing successive frames of an elongate stationary field of view transverse to a workpiece transit path of a robot, while the workpiece is transported by the robot. The robot transit path is illuminated with an elongate illumination pattern transverse to the transit path to obtain a workpiece image of successive frames. Motion-induced image distortion is corrected by computing respective correct locations of respective ones of the frames along the transit path.Type: ApplicationFiled: February 17, 2010Publication date: August 18, 2011Applicant: Applied Materials, Inc.Inventors: Abraham Ravid, Todd Egan, Karen Lingel
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Publication number: 20110199476Abstract: A metrology system has an elongate stationary camera pixel array facing a workpiece transit path of a robot with an field of view corresponding to a workpiece diameter and extending transverse to the transit path portion, and a stationary elongate light emitting array generally parallel to the pixel array. An image control processor causes the camera to capture successive image frames while the, robot is moving the workpiece through the transit path.Type: ApplicationFiled: February 17, 2010Publication date: August 18, 2011Applicant: Applied Materials, Inc.Inventors: Abraham Ravid, Todd Egan, Karen Lingel, Mitchell DiSanto, Hari Kishore Ambal, Edward Budiarto
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Patent number: 7952708Abstract: A substrate processing system includes a processing module to process a substrate, a factory interface module configured to accommodate at least one cassette for holding the substrate, a spectrographic monitoring system positioned in or adjoining the factory interface module, and a substrate handler to transfer the substrate between the at least one cassette, the spectrographic monitoring system and the processing module.Type: GrantFiled: March 31, 2008Date of Patent: May 31, 2011Assignee: Applied Materials, Inc.Inventors: Abraham Ravid, Boguslaw A. Swedek, Dominic J. Benvegnu, Jeffrey Drue David, Jun Qian, Sidney P. Huey, Ingemar Carlsson, Lakshmanan Karuppiah, Harry Q. Lee
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Publication number: 20110046918Abstract: A method of generating a library from a reference substrate for use in processing product wafers is described. The method includes measuring substrate characteristics at a plurality of well-defined points of a reference substrate, measuring spectra at plurality of measurement points of the reference substrate, there being more measurement points than well-defined points, and associating measured spectra with measured substrate characteristics.Type: ApplicationFiled: November 2, 2010Publication date: February 24, 2011Inventors: Abraham Ravid, Boguslaw A. Swedek, Dominic J. Benvegnu, Jeffrey Drue David, Jun Qian, Sidney P. Huey, Ingemar Carlsson, Lakshmanan Karuppiah, Harry Q. Lee
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Patent number: 7840375Abstract: A method of generating a library from a reference substrate for use in processing product wafers is described. The method includes measuring substrate characteristics at a plurality of well-defined points of a reference substrate, measuring spectra at plurality of measurement points of the reference substrate, there being more measurement points than well-defined points, and associating measured spectra with measured substrate characteristics.Type: GrantFiled: March 31, 2008Date of Patent: November 23, 2010Assignee: Applied Materials, Inc.Inventors: Abraham Ravid, Boguslaw A. Swedek, Dominic J. Benvegnu, Jeffrey Drue David, Jun Qian, Sidney P. Huey, Ingemar Carlsson, Lakshmanan Karuppiah, Harry Q. Lee
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Publication number: 20100261413Abstract: A method of determining a physical property of a substrate includes recording a first spectrum obtained from a substrate, the first spectrum being obtained during a polishing process that alters a physical property of the substrate. The method includes identifying, in a database, at least one of several previously recorded spectra that is similar to the recorded first spectrum. Each of the spectra in the database has a physical property value associated therewith. The method includes generating a signal indicating that a first value of the physical property is associated with the first spectrum, the first value being determined using the physical property value associated with the identified previously recorded spectrum in the database. A system for determining a physical property of a substrate includes a polishing machine, an endpoint determining module, and a database.Type: ApplicationFiled: June 23, 2010Publication date: October 14, 2010Applicant: APPLIED MATERIALS, INC.Inventors: Abraham Ravid, Boguslaw A. Swedek, Jeffrey Drue David, Jun Qian, Ingemar Carlsson, Dominic J. Benvegnu, Harry Q. Lee, Lakshmanan Karuppiah
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Patent number: 7746485Abstract: A method of determining a physical property of a substrate includes recording a first spectrum obtained from a substrate, the first spectrum being obtained during a polishing process that alters a physical property of the substrate. The method includes identifying, in a database, at least one of several previously recorded spectra that is similar to the recorded first spectrum. Each of the spectra in the database has a physical property value associated therewith. The method includes generating a signal indicating that a first value of the physical property is associated with the first spectrum, the first value being determined using the physical property value associated with the identified previously recorded spectrum in the database. A system for determining a physical property of a substrate includes a polishing machine, an endpoint determining module, and a database.Type: GrantFiled: October 16, 2008Date of Patent: June 29, 2010Assignee: Applied Materials, Inc.Inventors: Abraham Ravid, Boguslaw A. Swedek, Jeffrey Drue David, Jun Qian, Ingemar Carlsson, Dominic J. Benvegnu, Harry Q. Lee, Lakshmanan Karuppiah
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Publication number: 20100116990Abstract: Methods of determining thickness and phase of a GST layer on a semiconductor substrate are described using intensity spectra within the infra-red range. In particular, techniques for using certain transmission at certain frequencies are disclosed for faster thickness and phase determination in an in-line or standalone metrology/monitoring system for CMP processes.Type: ApplicationFiled: November 7, 2008Publication date: May 13, 2010Applicant: APPLIED MATERIALS, INC.Inventors: Kun Xu, Feng Q. Liu, Yuchun Wang, Abraham Ravid, Wen-Chiang Tu