Abstract: Defect classification includes acquiring one or more images of a specimen, receiving a manual classification of one or more training defects based on one or more attributes of the one or more training defects, generating an ensemble learning classifier based on the received manual classification and the attributes of the one or more training defects, generating a confidence threshold for each defect type of the one or more training defects based on a received classification purity requirement, acquiring one or more images including one or more test defects, classifying the one or more test defects with the generated ensemble learning classifier, calculating a confidence level for each of the one or more test defects with the generated ensemble learning classifier and reporting one or more test defects having a confidence level below the generated confidence threshold via the user interface device for manual classification.

Abstract: A radiological image sensor has an electronic substrate and an imaging chip held within a housing, the imaging chip having electronics that create a dead space, with a cable attached to the housing at a cable button connector, the dead space being at a short distal side of the generally rectangular sensor opposite the short mesial side at which the cable exits the cable button connector. The mesial side of the sensor either does not have a dead space created by electronics of the imaging chip or the dead space found on the mesial side of the sensor is less than approximately 4 mm, and, preferably, approximately 2 mm or less. The cable can be a flat cable with a length of approximately one meter or less that can be connected to a round cable.

Abstract: Defect classification includes acquiring one or more images of a specimen, receiving a manual classification of one or more training defects based on one or more attributes of the one or more training defects, generating an ensemble learning classifier based on the received manual classification and the attributes of the one or more training defects, generating a confidence threshold for each defect type of the one or more training defects based on a received classification purity requirement, acquiring one or more images including one or more test defects, classifying the one or more test defects with the generated ensemble learning classifier, calculating a confidence level for each of the one or more test defects with the generated ensemble learning classifier and reporting one or more test defects having a confidence level below the generated confidence threshold via the user interface device for manual classification.

Abstract: Methods and systems for decision tree construction for automatic classification of defects on semiconductor wafers are provided. One method includes creating a decision tree for classification of defects detected on a wafer by altering one or more floating trees in the decision tree. The one or more floating trees are sub-trees that are manipulated as individual units. In addition, the method includes classifying the defects detected on the wafer by applying the decision tree to the defects.

Abstract: A radiological image sensor has an electronic substrate and an imaging chip held within a housing, the imaging chip having electronics that create a dead space, with a cable attached to the housing at a cable button connector, the dead space being at a short distal side of the generally rectangular sensor opposite the short mesial side at which the cable exits the cable button connector. The mesial side of the sensor either does not have a dead space created by electronics of the imaging chip or the dead space found on the mesial side of the sensor is less than approximately 4 mm, and, preferably, approximately 2 mm or less. The cable can be a flat cable with a length of approximately one meter or less that can be connected to a round cable.

Abstract: A radiological image sensor has an electronic substrate and an imaging chip held within a housing, the imaging chip having electronics that create a dead space, with a cable attached to the housing at a cable button connector, the dead space being at a short distal side of the generally rectangular sensor opposite the short mesial side at which the cable exits the cable button connector. The mesial side of the sensor either does not have a dead space created by electronics of the imaging chip or the dead space found on the mesial side of the sensor is less than approximately 4 mm, and, preferably, approximately 2 mm or less. The cable can be a flat cable with a length of approximately one meter or less that can be connected to a round cable.

Abstract: Various embodiments for determining parameters for wafer inspection and/or metrology are provided.

Abstract: Systems and methods for generating information for use in a wafer inspection process are provided. One method includes acquiring output of an inspection system for die(s) located on wafer(s), combining the output for the die(s) based on within die positions of the output, determining, on a within die position basis, a statistical property of variation in values of characteristic(s) of the combined output, and assigning the within die positions to different groups based on the statistical properties determined for the within die positions. The method also includes storing information for the within die positions and the different groups to which the within die positions are assigned in a storage medium that is accessible to the inspection system for performing the wafer inspection process, which includes applying defect detection parameter(s) to additional output of the inspection system generated for a wafer based on the information thereby detecting defects on the wafer.

Abstract: A universal dental digital sensor holder has a bite block connected to a rod that has a connector which is used to flexibly attach a sensor holder so as to allow rotational movement of the sensor relative to the bite block and multiple sensor holders are removably connected to the connector so that they can be used to obtain different radiographic projection views due to their differing configurations for holding the intraoral sensor in the patient's mouth. The bite block can have an opening formed in it fitted with a sleeve to allow access to a tooth located beneath the opening in the patient's mouth. A cable protector can be formed in the rod adjacent an anterior bite surface so that an intraoral sensor cable can be held adjacent the rod and at least partially protected from one or more teeth biting the anterior bite surface.

Abstract: Systems and methods for generating information for use in a wafer inspection process are provided. One method includes acquiring output of an inspection system for die(s) located on wafer(s), combining the output for the die(s) based on within die positions of the output, determining, on a within die position basis, a statistical property of variation in values of characteristic(s) of the combined output, and assigning the within die positions to different groups based on the statistical properties determined for the within die positions. The method also includes storing information for the within die positions and the different groups to which the within die positions are assigned in a storage medium that is accessible to the inspection system for performing the wafer inspection process, which includes applying defect detection parameter(s) to additional output of the inspection system generated for a wafer based on the information thereby detecting defects on the wafer.

Abstract: Systems and methods for design-based inspection using repeating structures are provided.

Abstract: A variable aperture X-ray collimating device that fits over existing intraoral radiographic sensor positioners enables clinicians to provide radiation protection for their patients while allowing the flexibility to accommodate various commercially available positioning kits. In addition, the variable aperture allows for easy accommodation of various sensor sizes.

Abstract: Methods and systems for determining inspection scenarios without input from a user are presented. Inspection scenarios include at least one acquisition mode, defect detection parameter values, and classification parameter values. In one example, a number of defect events are determined by a hot inspection of a wafer surface. The defect events are classified and attributes associated with each defect event are identified. The defect events are labeled with this information. Based on the identified attributes and classification, inspection scenarios are determined. The inspection scenarios are solutions in a mathematical space formed by the identified attributes. In some examples, a plurality of inspection scenarios are determined and a desired inspection scenario is selected from the plurality based on the number of defects of interest and the number of nuisance events captured by the selected inspection scenario.

Abstract: Methods and systems for decision tree construction for automatic classification of defects on semiconductor wafers are provided. One method includes creating a decision tree for classification of defects detected on a wafer by altering one or more floating trees in the decision tree. The one or more floating trees are sub-trees that are manipulated as individual units. In addition, the method includes classifying the defects detected on the wafer by applying the decision tree to the defects.

Abstract: A multilayer polyolefin film useful for packaging contains a core layer including from 20% to 100% by weight of the core layer of a polyethylene homopolymer having a density of between about 0.94 and about 0.97; an ethylene/alpha-olefin copolymer having a density of between about 0.94 and about 0.97; polypropylene; or a mixture thereof; from 0% to 80% by weight of the core layer of linear low density polyethylene, low density polyethylene, a copolymer of ethylene and vinyl acetate; or a mixture thereof; and a skin layer laminated to the core layer. The skin layer is a layer of linear low density polyethylene, low density polyethylene, a copolymer of ethylene and vinyl acetate; or a mixture thereof. At least one of the core layer and the skin layer includes at least 20% modern carbon. If desired, two skin layers may be laminated to opposing surfaces of the core layer.

Abstract: Various embodiments for determining dynamic care areas are provided. In one embodiment, a first inspection process is performed on a wafer after a first fabrication step has been performed on the wafer and before a second fabrication process has been performed on the wafer. One embodiment includes determining care areas for a second inspection process based on inspection results generated by the first inspection process. The second inspection process will be performed on the wafer after the second fabrication step has been performed on the wafer.

Abstract: Methods and systems for determining inspection scenarios without input from a user are presented. Inspection scenarios include at least one acquisition mode, defect detection parameter values, and classification parameter values. In one example, a number of defect events are determined by a hot inspection of a wafer surface. The defect events are classified and attributes associated with each defect event are identified. The defect events are labeled with this information. Based on the identified attributes and classification, inspection scenarios are determined. The inspection scenarios are solutions in a mathematical space formed by the identified attributes. In some examples, a plurality of inspection scenarios are determined and a desired inspection scenario is selected from the plurality based on the number of defects of interest and the number of nuisance events captured by the selected inspection scenario.

Abstract: A radiological image sensor has an electronic substrate and an imaging chip held within a housing, the imaging chip having electronics that create a dead space, with a cable attached to the housing at a cable button connector, the dead space being at a short distal side of the generally rectangular sensor opposite the short mesial side at which the cable exits the cable button connector. The mesial side of the sensor either does not have a dead space created by electronics of the imaging chip or the dead space found on the mesial side of the sensor is less than approximately 4 mm, and, preferably, approximately 2 mm or less. The cable can be a flat cable with a length of approximately one meter or less that can be connected to a round cable.

Abstract: Various methods, carrier media, and systems for monitoring a characteristic of a specimen are provided. One computer-implemented method for monitoring a characteristic of a specimen includes determining a property of individual pixels on the specimen using output generated by inspecting the specimen with an inspection system. The method also includes determining a characteristic of individual regions on the specimen using the properties of the individual pixels in the individual regions. The method further includes monitoring the characteristic of the specimen based on the characteristics of the individual regions.

Abstract: Systems and methods for design-based inspection using repeating structures are provided.