Abstract: SRAM memory bit cell comprising: a n-TFET and a p-TFET; a storage node formed by the connection of a first electrode of the n-TFET to a first electrode of the p-TFET (drains or sources); a control circuit able to apply supply voltages on second electrodes of the n-TFET and p-TFET (sources or drains); wherein the control circuit is configured to provide: during a retention mode, supply and bias voltages reverse biasing the n-TFET and p-TFET in a state wherein a conduction current is obtained by band-to-band tunneling in the n-TFET and p-TFET; during a writing of a bit, supply and bias voltages forward biasing the n-TFET and p-TFET and such that one of the n-TFET and p-TFET is in OFF state and that the other of the n-TFET and p-TFET is in ON state.

Abstract: Memory cell of the SRAM type, including storage transistors forming a memory point for storing a bit and a read port having at least one MOS transistor, a TFET transistor, a power terminal and a read bit line whereof a potential is designed to vary depending on the value of the stored bit, and such that: the gate of the MOS transistor is connected to the memory point, and the gate of the TFET transistor is able to receive a read command signal; a first electrode of the MOS transistor is connected to the power supply terminal; a second electrode of the MOS transistor is connected to a first electrode of the TFET transistor; a second electrode of the TFET transistor is connected to the read bit line.

Abstract: A content addressable memory having at least one CAM cell including first and second inverters cross-coupled between first and second storage nodes; a first transistor coupling the first storage node to a bitline, the first transistor being controlled by a first control signal; a second transistor coupling the second storage node to the bitline, the second transistor being controlled by a second control signal; and a control circuit adapted to perform a CAM read operation by pre-charging the bitline to a first voltage level, and then selectively activating either the first or second transistor based on a bit of input data.

Abstract: A content addressable memory having at least one CAM cell including first and second inverters cross-coupled between first and second storage nodes; a first transistor coupling the first storage node to a bitline, the first transistor being controlled by a first control signal; a second transistor coupling the second storage node to the bitline, the second transistor being controlled by a second control signal; and a control circuit adapted to perform a CAM read operation by pre-charging the bitline to a first voltage level, and then selectively activating either the first or second transistor based on a bit of input data.

Abstract: Memory cell of the SRAM type, including storage transistors forming a memory point for storing a bit and a read port having at least one MOS transistor, a TFET transistor, a power terminal and a read bit line whereof a potential is designed to vary depending on value of the stored bit, and such that: the gate of the MOS transistor is connected to the memory point, and the gate of the TFET transistor is able to receive a read command signal; a first electrode of the MOS transistor is connected to the power supply terminal; a second electrode of the MOS transistor is connected to a first electrode of the TFET transistor; a second electrode of the TFET transistor is connected to the read bit line.

Abstract: A memory device includes a matrix of several columns of SRAM memory cells each including transistors forming a memory point, a read port and a write port, and such that the transistors of the read port and/or the P-type transistors include a second well with a conductivity type opposite that of a first well of the other transistors. The memory device also includes a polarization unit for the second wells, able to select and apply polarization potentials on the second wells, including a memory circuit of the polarization states of the second wells for each column or group of columns and a selection circuit applying a polarization potential on the second wells according to one of the values received as input, as a function of the stored polarization state associated with the column or group of columns.

Abstract: A non-volatile memory including a plurality of elementary cells, each cell including: a first programmable-resistance storage element connected between first and second nodes of the cell; a first access transistor coupling the second node to a third node of the cell; and a second access transistor coupling the second node to a fourth node of the cell.

Abstract: A memory device includes a matrix of several columns of SRAM memory cells each including transistors forming a memory point, a read port and a write port, and such that the transistors of the read port and/or the P-type transistors include a second well with a conductivity type opposite that of a first well of the other transistors. The memory device also includes a polarization unit for the second wells, able to select and apply polarization potentials on the second wells, including a memory circuit of the polarization states of the second wells for each column or group of columns and a selection circuit applying a polarization potential on the second wells according to one of the values received as input, as a function of the stored polarization state associated with the column or group of columns.

Abstract: A tunnel effect transistor includes a channel made of an intrinsic semiconductor material; source and drain extension regions on either side of the channel, the source extension region being made of a semiconductor material doped according to a first type of doping P or N and the drain extension region being made of a semiconductor material doped according to a second type of doping opposite to said first type of doping; source and drain conductive regions respectively in contact with the source and drain extension regions; a gate structure including a gate dielectric layer in contact with the channel and a gate area arranged such that the gate dielectric layer is arranged between the gate area and the channel; and an area doped according to the first type of doping inserted between the channel and the drain extension region.

Abstract: A non-volatile memory including a plurality of elementary cells, each cell including: a first programmable-resistance storage element connected between first and second nodes of the cell; a first access transistor coupling the second node to a third node of the cell; and a second access transistor coupling the second node to a fourth node of the cell.

Abstract: CMOS integrated circuits with very low consumption when idle, and notably the SRAM volatile memories, are provided. The inverters of the circuit are made up of an NMOS transistor and a PMOS transistor. A bias circuit applies a first rear bias voltage NBIAS to the wells of the NMOS transistors and a second rear bias voltage PBIAS to the wells of the PMOS transistors. The bias circuit comprises: a detection array made up of many inverters in parallel, having a common output supplying a logic signal whose value depends on the rear bias voltages applied to the array, a circuit for producing incrementation or decrementation pulses, controlled by the output of the detection array, and an integration circuit linked to the pulse-producing circuit, for producing and varying, progressively by increments in response to these pulses, a bias voltage PBIAS and a bias voltage NBIAS.

Abstract: CMOS integrated circuits with very low consumption when idle, and notably the SRAM volatile memories, are provided. The inverters of the circuit are made up of an NMOS transistor and a PMOS transistor. A bias circuit applies a first rear bias voltage NBIAS to the wells of the NMOS transistors and a second rear bias voltage PBIAS to the wells of the PMOS transistors. The bias circuit comprises: a detection array made up of many inverters in parallel, having a common output supplying a logic signal whose value depends on the rear bias voltages applied to the array, a circuit for producing incrementation or decrementation pulses, controlled by the output of the detection array, and an integration circuit linked to the pulse-producing circuit, for producing and varying, progressively by increments in response to these pulses, a bias voltage PBIAS and a bias voltage NBIAS.

Abstract: A tunnel effect transistor includes a channel made of an intrinsic semiconductor material; source and drain extension regions on either side of the channel, the source extension region being made of a semiconductor material doped according to a first type of doping P or N and the drain extension region being made of a semiconductor material doped according to a second type of doping opposite to said first type of doping; source and drain conductive regions respectively in contact with the source and drain extension regions; a gate structure including a gate dielectric layer in contact with the channel and a gate area arranged such that the gate dielectric layer is arranged between the gate area and the channel; and an area doped according to the first type of doping inserted between the channel and the drain extension region.