Abstract: A method of bonding a semiconductor element to a substrate is provided. The method includes the steps of: (a) providing the semiconductor element at a position separated from the substrate, the semiconductor element including a plurality of conductive structures, each of the conductive structures including a contact portion; (b) heating the semiconductor element at the position such that the contact portions are in a molten state; and (c) bonding the semiconductor element to the substrate such that each of the contact portions is bonded to a corresponding conductive structure of the substrate.

Abstract: A radar system includes a set of transmitters and a processor coupled to the set of transmitters, which includes first, second, third and fourth transmitters. In operation, the processor generates a first chirp of a set of chirps, in which outputs of the first and second transmitters are modulated by a first phase and outputs of the third and fourth transmitters are modulated by a second phase; and generate a second chirp of the set of chirps, in which outputs of the first and fourth transmitters are modulated by the first phase and outputs of the second and third transmitters are modulated by the second phase.

Abstract: A bonding system is provided. The bonding system includes (a) a bond head assembly configured for carrying a bonding tool for bonding a semiconductor element to a substrate and (b) a reducing gas conduit for carrying a reducing gas from (i) a reducing gas source to (ii) a bonding area of a bonding system. The reducing gas is configured for use during bonding of the semiconductor element to the substrate at the bonding area. The reducing gas conduit includes a catalyst for producing excess reducing species in the reducing gas prior to the reducing gas reaching the bonding area.

Abstract: A method of processing a substrate on a bonding system is provided. The method includes: (a) providing an oxide reduction delivery system on a bonding system; (b) supporting a substrate on a support structure of the bonding system; and (c) moving at least one of the oxide reduction delivery system and the support structure with respect to one another, such that a gas provided by the oxide reduction delivery system contacts the substrate.

Abstract: A bonding system is provided. The bonding system includes (a) a bond head assembly configured for carrying a bonding tool for bonding a semiconductor element to a substrate and (b) a reducing gas conduit for carrying a reducing gas from (i) a reducing gas source to (ii) a bonding area of a bonding system. The reducing gas is configured for use during bonding of the semiconductor element to the substrate at the bonding area. The reducing gas conduit includes a catalyst for producing excess reducing species in the reducing gas prior to the reducing gas reaching the bonding area.

Abstract: A bonding system for bonding a semiconductor element to a substrate is provided. The bonding system includes a manifold configured to provide a reducing gas to a bonding area of the bonding system. At least a portion of the manifold is heated.

Abstract: A radar system includes a set of transmitters and a processor coupled to the set of transmitters, which includes first, second, third and fourth transmitters. In operation, the processor generates a first chirp of a set of chirps, in which outputs of the first and second transmitters are modulated by a first phase and outputs of the third and fourth transmitters are modulated by a second phase; and generate a second chirp of the set of chirps, in which outputs of the first and fourth transmitters are modulated by the first phase and outputs of the second and third transmitters are modulated by the second phase.

Abstract: In accordance with described examples, a method determines if a velocity of an object detected by a radar is greater than a maximum velocity by receiving on a plurality of receivers at least one frame of chirps transmitted by at least two transmitters and reflected off of the object. A velocity induced phase shift (?d) in a virtual array vector S of signals received by each receiver corresponding to a sequence of chirps (frame) transmitted by each transmitter is estimated. Phases of each element of virtual array vector S are corrected using ?d to generate a corrected virtual array vector Sc. A first Fourier transform is performed on the corrected virtual array vector Sc to generate a corrected virtual array spectrum to detect a signature that indicates that the object has an absolute velocity greater than a maximum velocity.

Abstract: A power flow control system is disclosed. The system includes impedance injection modules (IIMs) distributed along and connected in series to one or more power transmission lines. The system further includes dual-ring fiber optic networks, with each dual-ring fiber optic network including a pair of fiber rings that provide data flow in opposite directions. The system further includes redundant power line coordinators in communication with the IIMs through the dual-ring fiber optic networks.

Abstract: An apparatus, including processing unit (PU) cores and computer readable storage devices storing machine instructions for determining a distance between a target object and a radar sensor circuit. The PU cores receive a beat signal generated by the radar sensor circuit and compensate for a phase difference between the received beat signal and a reconstruction of the received beat signal to obtain a phase compensated beat signal. The phase compensated beat signal is then filtered to remove spurious reflections by demodulating the phase compensated beat signal using an estimated frequency of the phase compensated beat signal. The PU cores then apply a low pass filter to the demodulated phase compensated beat signal, resulting in a modified beat signal. The PU cores then determine the distance between the target object and the radar sensor circuit using the modified beat signal.

Abstract: A bonding system for bonding a semiconductor element to a substrate is provided. The bonding system includes a reducing gas delivery system configured to provide a reducing gas to a bonding area of a bonding system. The bonding system also includes a gas delivery line configured to transport the reducing gas from a reducing gas source to the reducing gas delivery system. At least a portion of the gas delivery line is heated.

Abstract: A radar system comprises a set of transmitters and a processor coupled to the set of transmitters. The processor is configured to modulate a first portion of a chirp in a chirp frame according to a first phase. The processor is further configured to modulate a second portion of the chirp in the chirp frame according to a second phase and configured to combine the first and second portions of the chirp to produce a phase-modified chirp. The processor is further configured to instruct the set of transmitters to transmit the phase-modified chirp by applying time division multiple access (TDMA) and by directing radio frequency energy according to a target angle and a target gain.

Abstract: In an impedance injection module in which multiple converter units are placed in series to realize a high level of impedance injection, switches, preferably vacuum interrupters, are connected to short the input and the output terminals of each individual unit. Unlike the fault-protecting switch across the entire module, these switches at the individual converter unit level serve several purposes, overload and surge protection of a unit, insertion loss minimization of an idle unit when the required impedance injection is small, and electrically removing a defective injection unit from the power flow to increase the overall reliability of the impedance injection module in the face of the failure of one unit or a few units. For more rapid response, particularly in response to faults, the vacuum interrupter at the unit level may be accompanied by an SCR switch in parallel with it.

Abstract: A mm-wave system includes transmission of a millimeter wave (mm-wave) signal by a plurality of transmitters to multiple objects, and receiving of return—mm-wave signals from the multiple objects by a plurality of receivers. A processor is configured to perform an algorithm to derive complex-valued samples and angle measurements from each receiver to identify one object from another object. The processor further extracts signal waveforms that correspond to each object and process the extracted signal waveforms to estimate breathing rate and heart rate of the identified object.

Abstract: A bonding system is provided. The bonding system includes (a) a bond head assembly configured for carrying a bonding tool for bonding a semiconductor element to a substrate and (b) a reducing gas conduit for carrying a reducing gas from (i) a reducing gas source to (ii) a bonding area of a bonding system. The reducing gas is configured for use during bonding of the semiconductor element to the substrate at the bonding area. The reducing gas conduit includes a catalyst for producing excess reducing species in the reducing gas prior to the reducing gas reaching the bonding area.

Abstract: A method of bonding a semiconductor element to a substrate includes: carrying a semiconductor element including a plurality of first electrically conductive structures with a bonding tool; supporting a substrate including a plurality of second electrically conductive structures with a support structure; providing a reducing gas in contact with each of the plurality of first conductive structures and the plurality of second conductive structures; establishing contact between corresponding ones of the plurality of first conductive structures and the plurality of second conductive structures; moving at least one of the semiconductor element and the substrate such that the corresponding ones of the plurality of first conductive structures and the plurality of second conductive structures are separated; re-establishing contact between the plurality of first conductive structures and the plurality of second conductive structures; and bonding the plurality of first conductive structures to the respective ones of the

Abstract: Disclosed is a reactance-injecting module and its method of use to balance the currents among the phases of polyphase electric power transmission lines or to manage power flow among alternate paths, where the reactance-injecting module has high-speed, dedicated communication links to enable the immediate removal or reduction of injected reactance from all phases of a phase balancing cluster when a fault is detected on any one of the multiple phases. The reactance-injecting module may communicate information on a detected fault to the other reactance-injecting modules of the phase balancing cluster within 10 microseconds after the fault is detected to allow the phase balancing cluster to eliminate injected reactance from all phases within a time that is short compared to a cycle of the alternating current, such as 1 millisecond after the fault is detected. This provides extremely fast neutralization of injected reactance to minimize interference with fault localization analyses.

Abstract: In accordance with the present invention a system and method for calibration of the current steering DAC is elaborated which helps to reduce design complexity and reduce silicon area required in the design. Present invention is utilising a clocked comparator and plurality of switch transistors 405,305 and AUX DAC in conjunction with digital estimator and digital compensator blocks to estimate the errors in the current sources 406 and compensate the errors using same AUX DAC during normal operation mode.

Abstract: A device is provided. In some examples, the device includes a radar sensor configured to receive reflected chirps. In addition, the device includes processing circuitry configured to determine that a first object is moving. The processing circuitry is further configured to, responsive to determining that the first object is moving, determine a first location of the first object using a single frame of the reflected chirps. The processing circuitry is also configured to determine that a second object is stationary. In addition, the processing circuitry is configured to, responsive to determining that the second object is stationary, determine a second location of the second object using a plurality of frames of the reflected chirps.

Abstract: A bonding system for bonding a semiconductor element to a substrate is provided. The bonding system includes a substrate oxide reduction chamber configured to receive a substrate. The substrate includes a plurality of first electrically conductive structures. The substrate oxide reduction chamber is configured to receive a reducing gas to contact each of the plurality of first electrically conductive structures. The bonding system also includes a substrate oxide prevention chamber for receiving the substrate after the reducing gas contacts the plurality of first electrically conductive structures. The substrate oxide prevention chamber has an inert environment when receiving the substrate. The bonding system also includes a reducing gas delivery system for providing a reducing gas environment during bonding of a semiconductor element to the substrate.