Patents by Inventor Adeel Ahmad
Adeel Ahmad has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240128748Abstract: A power flow control system is disclosed. The system includes impedance injection modules (IIMs) distributed along and connected in series to one or more power transmission lines. The system further includes dual-ring fiber optic networks, with each dual-ring fiber optic network including a pair of fiber rings that provide data flow in opposite directions. The system further includes redundant power line coordinators in communication with the IIMs through the dual-ring fiber optic networks.Type: ApplicationFiled: October 13, 2023Publication date: April 18, 2024Inventors: Michael Thomas Garrison Stuber, Adeel Ahmad Khan
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Patent number: 11921229Abstract: An apparatus, including processing unit (PU) cores and computer readable storage devices storing machine instructions for determining a distance between a target object and a radar sensor circuit. The PU cores receive a beat signal generated by the radar sensor circuit and compensate for a phase difference between the received beat signal and a reconstruction of the received beat signal to obtain a phase compensated beat signal. The phase compensated beat signal is then filtered to remove spurious reflections by demodulating the phase compensated beat signal using an estimated frequency of the phase compensated beat signal. The PU cores then apply a low pass filter to the demodulated phase compensated beat signal, resulting in a modified beat signal. The PU cores then determine the distance between the target object and the radar sensor circuit using the modified beat signal.Type: GrantFiled: September 20, 2021Date of Patent: March 5, 2024Assignee: Texas Instruments IncorporatedInventors: Muhammad Zubair Ikram, Adeel Ahmad, Dan Wang, Murtaza Ali
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Publication number: 20240063169Abstract: A bonding system for bonding a semiconductor element to a substrate is provided. The bonding system includes a reducing gas delivery system configured to provide a reducing gas to a bonding area of a bonding system. The bonding system also includes a gas delivery line configured to transport the reducing gas from a reducing gas source to the reducing gas delivery system. At least a portion of the gas delivery line is heated.Type: ApplicationFiled: July 27, 2023Publication date: February 22, 2024Inventors: Adeel Ahmad Bajwa, Thomas J. Colosimo, JR., Matthew B. Wasserman, Robert N. Chylak
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Patent number: 11879968Abstract: A radar system comprises a set of transmitters and a processor coupled to the set of transmitters. The processor is configured to modulate a first portion of a chirp in a chirp frame according to a first phase. The processor is further configured to modulate a second portion of the chirp in the chirp frame according to a second phase and configured to combine the first and second portions of the chirp to produce a phase-modified chirp. The processor is further configured to instruct the set of transmitters to transmit the phase-modified chirp by applying time division multiple access (TDMA) and by directing radio frequency energy according to a target angle and a target gain.Type: GrantFiled: March 30, 2021Date of Patent: January 23, 2024Assignee: Texas Instruments IncorporatedInventors: Dan Wang, Sandeep Rao, Adeel Ahmad
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Publication number: 20230420986Abstract: In an impedance injection module in which multiple converter units are placed in series to realize a high level of impedance injection, switches, preferably vacuum interrupters, are connected to short the input and the output terminals of each individual unit. Unlike the fault-protecting switch across the entire module, these switches at the individual converter unit level serve several purposes, overload and surge protection of a unit, insertion loss minimization of an idle unit when the required impedance injection is small, and electrically removing a defective injection unit from the power flow to increase the overall reliability of the impedance injection module in the face of the failure of one unit or a few units. For more rapid response, particularly in response to faults, the vacuum interrupter at the unit level may be accompanied by an SCR switch in parallel with it.Type: ApplicationFiled: September 12, 2023Publication date: December 28, 2023Inventors: Wooyoung Choi, Adeel Ahmad Khan, Haroon Inam
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Patent number: 11850027Abstract: A mm-wave system includes transmission of a millimeter wave (mm-wave) signal by a plurality of transmitters to multiple objects, and receiving of return—mm-wave signals from the multiple objects by a plurality of receivers. A processor is configured to perform an algorithm to derive complex-valued samples and angle measurements from each receiver to identify one object from another object. The processor further extracts signal waveforms that correspond to each object and process the extracted signal waveforms to estimate breathing rate and heart rate of the identified object.Type: GrantFiled: August 8, 2022Date of Patent: December 26, 2023Assignee: Texas Instruments IncorporatedInventors: Dan Wang, June Chul Roh, Adeel Ahmad
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Publication number: 20230326903Abstract: A bonding system is provided. The bonding system includes (a) a bond head assembly configured for carrying a bonding tool for bonding a semiconductor element to a substrate and (b) a reducing gas conduit for carrying a reducing gas from (i) a reducing gas source to (ii) a bonding area of a bonding system. The reducing gas is configured for use during bonding of the semiconductor element to the substrate at the bonding area. The reducing gas conduit includes a catalyst for producing excess reducing species in the reducing gas prior to the reducing gas reaching the bonding area.Type: ApplicationFiled: March 17, 2023Publication date: October 12, 2023Inventors: Adeel Ahmad Bajwa, Thomas J. Colosimo, JR., Matthew B. Wasserman
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Patent number: 11776933Abstract: A method of bonding a semiconductor element to a substrate includes: carrying a semiconductor element including a plurality of first electrically conductive structures with a bonding tool; supporting a substrate including a plurality of second electrically conductive structures with a support structure; providing a reducing gas in contact with each of the plurality of first conductive structures and the plurality of second conductive structures; establishing contact between corresponding ones of the plurality of first conductive structures and the plurality of second conductive structures; moving at least one of the semiconductor element and the substrate such that the corresponding ones of the plurality of first conductive structures and the plurality of second conductive structures are separated; re-establishing contact between the plurality of first conductive structures and the plurality of second conductive structures; and bonding the plurality of first conductive structures to the respective ones of theType: GrantFiled: November 5, 2020Date of Patent: October 3, 2023Assignee: Kulicke and Soffa Industries, Inc.Inventor: Adeel Ahmad Bajwa
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Patent number: 11728649Abstract: Disclosed is a reactance-injecting module and its method of use to balance the currents among the phases of polyphase electric power transmission lines or to manage power flow among alternate paths, where the reactance-injecting module has high-speed, dedicated communication links to enable the immediate removal or reduction of injected reactance from all phases of a phase balancing cluster when a fault is detected on any one of the multiple phases. The reactance-injecting module may communicate information on a detected fault to the other reactance-injecting modules of the phase balancing cluster within 10 microseconds after the fault is detected to allow the phase balancing cluster to eliminate injected reactance from all phases within a time that is short compared to a cycle of the alternating current, such as 1 millisecond after the fault is detected. This provides extremely fast neutralization of injected reactance to minimize interference with fault localization analyses.Type: GrantFiled: June 18, 2021Date of Patent: August 15, 2023Assignee: Smart Wires Inc.Inventors: Leonard J. Kovalsky, Hamed Khalilinia, Niloofar Torabi, Michael T. Garrison Stuber, Sana Tayyab, Adeel Ahmad Khan, Haroon Inam
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Patent number: 11711090Abstract: In accordance with the present invention a system and method for calibration of the current steering DAC is elaborated which helps to reduce design complexity and reduce silicon area required in the design. Present invention is utilising a clocked comparator and plurality of switch transistors 405,305 and AUX DAC in conjunction with digital estimator and digital compensator blocks to estimate the errors in the current sources 406 and compensate the errors using same AUX DAC during normal operation mode.Type: GrantFiled: November 25, 2020Date of Patent: July 25, 2023Assignee: VERVESEMI MICROELECTRONICS PRIVATE LIMITEDInventors: Pratap Narayan Singh, Adeel Ahmad, Chinmaya Dash
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Publication number: 20230152439Abstract: A device is provided. In some examples, the device includes a radar sensor configured to receive reflected chirps. In addition, the device includes processing circuitry configured to determine that a first object is moving. The processing circuitry is further configured to, responsive to determining that the first object is moving, determine a first location of the first object using a single frame of the reflected chirps. The processing circuitry is also configured to determine that a second object is stationary. In addition, the processing circuitry is configured to, responsive to determining that the second object is stationary, determine a second location of the second object using a plurality of frames of the reflected chirps.Type: ApplicationFiled: October 28, 2022Publication date: May 18, 2023Inventors: Muhammet Yanik, Dan Wang, Adeel Ahmad
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Patent number: 11616042Abstract: A bonding system for bonding a semiconductor element to a substrate is provided. The bonding system includes a substrate oxide reduction chamber configured to receive a substrate. The substrate includes a plurality of first electrically conductive structures. The substrate oxide reduction chamber is configured to receive a reducing gas to contact each of the plurality of first electrically conductive structures. The bonding system also includes a substrate oxide prevention chamber for receiving the substrate after the reducing gas contacts the plurality of first electrically conductive structures. The substrate oxide prevention chamber has an inert environment when receiving the substrate. The bonding system also includes a reducing gas delivery system for providing a reducing gas environment during bonding of a semiconductor element to the substrate.Type: GrantFiled: August 26, 2021Date of Patent: March 28, 2023Assignee: Kulicke and Soffa Industries, Inc.Inventors: Adeel Ahmad Bajwa, Thomas J. Colosimo, Jr.
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Publication number: 20230026149Abstract: A device includes one or more processors configured to receive radar data, and generate a plurality of occupancy grid maps based on the radar data. Each of the occupancy grid maps corresponds to a respective one of a plurality of candidate angles. The one or more processors is also configured to select one of the candidate angles as a sensor mount angle based on the occupancy grid maps, and trigger an action based on the sensor mount angle and the radar data.Type: ApplicationFiled: September 22, 2022Publication date: January 26, 2023Inventors: Muhammad Zubair IKRAM, Adeel AHMAD
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Publication number: 20220378313Abstract: A mm-wave system includes transmission of a millimeter wave (mm-wave) signal by a plurality of transmitters to multiple objects, and receiving of return—mm-wave signals from the multiple objects by a plurality of receivers. A processor is configured to perform an algorithm to derive complex-valued samples and angle measurements from each receiver to identify one object from another object. The processor further extracts signal waveforms that correspond to each object and process the extracted signal waveforms to estimate breathing rate and heart rate of the identified object.Type: ApplicationFiled: August 8, 2022Publication date: December 1, 2022Inventors: Dan Wang, June Chul Roh, Adeel Ahmad
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Patent number: 11515286Abstract: A bonding system for bonding a semiconductor element to a substrate is provided. The bonding system includes a substrate oxide reduction chamber configured to receive a substrate. The substrate includes a plurality of first electrically conductive structures. The substrate oxide reduction chamber is configured to receive a reducing gas to contact each of the plurality of first electrically conductive structures. The bonding system also includes a substrate oxide prevention chamber for receiving the substrate after the reducing gas contacts the plurality of first electrically conductive structures. The substrate oxide prevention chamber has an inert environment when receiving the substrate. The bonding system also includes a reducing gas delivery system for providing a reducing gas environment during bonding of a semiconductor element to the substrate.Type: GrantFiled: May 11, 2021Date of Patent: November 29, 2022Assignee: Kulicke and Soffa Industries, Inc.Inventors: Adeel Ahmad Bajwa, Thomas J. Colosimo, Jr.
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Publication number: 20220342036Abstract: In accordance with described examples, a method determines if a velocity of an object detected by a radar is greater than a maximum velocity by receiving on a plurality of receivers at least one frame of chirps transmitted by at least two transmitters and reflected off of the object. A velocity induced phase shift (?d) in a virtual array vector S of signals received by each receiver corresponding to a sequence of chirps (frame) transmitted by each transmitter is estimated. Phases of each element of virtual array vector S are corrected using ?d to generate a corrected virtual array vector Sc. A first Fourier transform is performed on the corrected virtual array vector Sc to generate a corrected virtual array spectrum to detect a signature that indicates that the object has an absolute velocity greater than a maximum velocity.Type: ApplicationFiled: July 1, 2022Publication date: October 27, 2022Inventors: Sandeep Rao, Karthik Subburaj, Dan Wang, Adeel Ahmad
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Publication number: 20220317285Abstract: A radar system comprises a set of transmitters and a processor coupled to the set of transmitters. The processor is configured to modulate a first portion of a chirp in a chirp frame according to a first phase. The processor is further configured to modulate a second portion of the chirp in the chirp frame according to a second phase and configured to combine the first and second portions of the chirp to produce a phase-modified chirp. The processor is further configured to instruct the set of transmitters to transmit the phase-modified chirp by applying time division multiple access (TDMA) and by directing radio frequency energy according to a target angle and a target gain.Type: ApplicationFiled: March 30, 2021Publication date: October 6, 2022Inventors: Dan WANG, Sandeep RAO, Adeel AHMAD
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Patent number: 11454698Abstract: A device includes one or more processors configured to receive radar data, and generate a plurality of occupancy grid maps based on the radar data. Each of the occupancy grid maps corresponds to a respective one of a plurality of candidate angles. The one or more processors is also configured to select one of the candidate angles as a sensor mount angle based on the occupancy grid maps, and trigger an action based on the sensor mount angle and the radar data.Type: GrantFiled: November 11, 2019Date of Patent: September 27, 2022Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Muhammad Zubair Ikram, Adeel Ahmad
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Patent number: 11412937Abstract: A mm-wave system includes transmission of a millimeter wave (mm-wave) signal by a plurality of transmitters to multiple objects, and receiving of return-mm-wave signals from the multiple objects by a plurality of receivers. A processor is configured to perform an algorithm to derive complex-valued samples and angle measurements from each receiver to identify one object from another object. The processor further extracts signal waveforms that correspond to each object and process the extracted signal waveforms to estimate breathing rate and heart rate of the identified object.Type: GrantFiled: September 27, 2017Date of Patent: August 16, 2022Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Adeel Ahmad, Dan Wang, June Chul Roh
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Patent number: 11378649Abstract: In accordance with described examples, a method determines if a velocity of an object detected by a radar is greater than a maximum velocity by receiving on a plurality of receivers at least one frame of chirps transmitted by at least two transmitters and reflected off of the object. A velocity induced phase shift (?d) in a virtual array vector S of signals received by each receiver corresponding to a sequence of chirps (frame) transmitted by each transmitter is estimated. Phases of each element of virtual array vector S are corrected using ?d to generate a corrected virtual array vector Sc. A first Fourier transform is performed on the corrected virtual array vector Sc to generate a corrected virtual array spectrum to detect a signature that indicates that the object has an absolute velocity greater than a maximum velocity.Type: GrantFiled: March 10, 2020Date of Patent: July 5, 2022Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Sandeep Rao, Karthik Subburaj, Dan Wang, Adeel Ahmad