Abstract: In accordance with described examples, a method determines if a velocity of an object detected by a radar is greater than a maximum velocity by receiving on a plurality of receivers at least one frame of chirps transmitted by at least two transmitters and reflected off of the object. A velocity induced phase shift (?d) in a virtual array vector S of signals received by each receiver corresponding to a sequence of chirps (frame) transmitted by each transmitter is estimated. Phases of each element of virtual array vector S are corrected using ?d to generate a corrected virtual array vector Sc. A first Fourier transform is performed on the corrected virtual array vector Sc to generate a corrected virtual array spectrum to detect a signature that indicates that the object has an absolute velocity greater than a maximum velocity.

Abstract: An apparatus, including processing unit (PU) cores and computer readable storage devices storing machine instructions for determining a distance between a target object and a radar sensor circuit. The PU cores receive a beat signal generated by the radar sensor circuit and compensate for a phase difference between the received beat signal and a reconstruction of the received beat signal to obtain a phase compensated beat signal. The phase compensated beat signal is then filtered to remove spurious reflections by demodulating the phase compensated beat signal using an estimated frequency of the phase compensated beat signal. The PU cores then apply a low pass filter to the demodulated phase compensated beat signal, resulting in a modified beat signal. The PU cores then determine the distance between the target object and the radar sensor circuit using the modified beat signal.

Abstract: A bonding system for bonding a semiconductor element to a substrate is provided. The bonding system includes a substrate oxide reduction chamber configured to receive a substrate. The substrate includes a plurality of first electrically conductive structures. The substrate oxide reduction chamber is configured to receive a reducing gas to contact each of the plurality of first electrically conductive structures. The bonding system also includes a substrate oxide prevention chamber for receiving the substrate after the reducing gas contacts the plurality of first electrically conductive structures. The substrate oxide prevention chamber has an inert environment when receiving the substrate. The bonding system also includes a reducing gas delivery system for providing a reducing gas environment during bonding of a semiconductor element to the substrate.

Abstract: A bonding system for bonding a semiconductor element to a substrate is provided. The bonding system includes a substrate oxide reduction chamber configured to receive a substrate. The substrate includes a plurality of first electrically conductive structures. The substrate oxide reduction chamber is configured to receive a reducing gas to contact each of the plurality of first electrically conductive structures. The bonding system also includes a substrate oxide prevention chamber for receiving the substrate after the reducing gas contacts the plurality of first electrically conductive structures. The substrate oxide prevention chamber has an inert environment when receiving the substrate. The bonding system also includes a reducing gas delivery system for providing a reducing gas environment during bonding of a semiconductor element to the substrate.

Abstract: Disclosed is a reactance-injecting module and its method of use to balance the currents among the phases of polyphase electric power transmission lines or to manage power flow among alternate paths, where the reactance-injecting module has high-speed, dedicated communication links to enable the immediate removal or reduction of injected reactance from all phases of a phase balancing cluster when a fault is detected on any one of the multiple phases. The reactance-injecting module may communicate information on a detected fault to the other reactance-injecting modules of the phase balancing cluster within 10 microseconds after the fault is detected to allow the phase balancing cluster to eliminate injected reactance from all phases within a time that is short compared to a cycle of the alternating current, such as 1 millisecond after the fault is detected. This provides extremely fast neutralization of injected reactance to minimize interference with fault localization analyses.

Abstract: An apparatus, including processing unit (PU) cores and computer readable storage devices storing machine instructions for determining a distance between a target object and a radar sensor circuit. The PU cores receive a beat signal generated by the radar sensor circuit and compensate for a phase difference between the received beat signal and a reconstruction of the received beat signal to obtain a phase compensated beat signal. The phase compensated beat signal is then filtered to remove spurious reflections by demodulating the phase compensated beat signal using an estimated frequency of the phase compensated beat signal. The PU cores then apply a low pass filter to the demodulated phase compensated beat signal, resulting in a modified beat signal. The PU cores then determine the distance between the target object and the radar sensor circuit using the modified beat signal.

Abstract: A bonding system for bonding a semiconductor element to a substrate is provided. The bonding system includes a substrate oxide reduction chamber configured to receive a substrate. The substrate includes a plurality of first electrically conductive structures. The substrate oxide reduction chamber is configured to receive a reducing gas to contact each of the plurality of first electrically conductive structures. The bonding system also includes a substrate oxide prevention chamber for receiving the substrate after the reducing gas contacts the plurality of first electrically conductive structures. The substrate oxide prevention chamber has an inert environment when receiving the substrate. The bonding system also includes a reducing gas delivery system for providing a reducing gas environment during bonding of a semiconductor element to the substrate.

Abstract: Disclosed is a reactance-injecting module used to balance the currents among the phases of polyphase electric power transmission lines or to manage power flow among alternate paths, where the reactance-injecting module has high-speed, dedicated communication links to enable the immediate removal of injected reactance from all phases of a phase balancing cluster when a fault is detected on any one of the multiple phases. The reactance-injecting module may communicate information on a detected fault to the other reactance-injecting modules of the phase balancing cluster within 10 microseconds after the fault is detected to allow the phase balancing cluster to eliminate injected reactance from all phases within 1 millisecond after the fault is detected. This provides extremely fast neutralization of injected reactance to minimize interference with fault localization analyses.

Abstract: In accordance with the present invention a system and method for calibration of the current steering DAC is elaborated which helps to reduce design complexity and reduce silicon area required in the design. Present invention is utilising a clocked comparator and plurality of switch transistors 405,305 and AUX DAC in conjunction with digital estimator and digital compensator blocks to estimate the errors in the current sources 406 and compensate the errors using same AUX DAC during normal operation mode.

Abstract: A bonding system for bonding a semiconductor element to a substrate is provided. The bonding system includes a substrate oxide reduction chamber configured to receive a substrate. The substrate includes a plurality of first electrically conductive structures. The substrate oxide reduction chamber is configured to receive a reducing gas to contact each of the plurality of first electrically conductive structures. The bonding system also includes a substrate oxide prevention chamber for receiving the substrate after the reducing gas contacts the plurality of first electrically conductive structures. The substrate oxide prevention chamber has an inert environment when receiving the substrate. The bonding system also includes a reducing gas delivery system for providing a reducing gas environment during bonding of a semiconductor element to the substrate.

Abstract: A method of bonding a semiconductor element to a substrate includes: carrying a semiconductor element including a plurality of first electrically conductive structures with a bonding tool; supporting a substrate including a plurality of second electrically conductive structures with a support structure; providing a reducing gas in contact with each of the plurality of first conductive structures and the plurality of second conductive structures; establishing contact between corresponding ones of the plurality of first conductive structures and the plurality of second conductive structures; moving at least one of the semiconductor element and the substrate such that the corresponding ones of the plurality of first conductive structures and the plurality of second conductive structures are separated; re-establishing contact between the plurality of first conductive structures and the plurality of second conductive structures; and bonding the plurality of first conductive structures to the respective ones of the

Abstract: A method of bonding a semiconductor element to a substrate includes: carrying a semiconductor element including a plurality of first electrically conductive structures with a bonding tool; supporting a substrate including a plurality of second electrically conductive structures with a support structure; providing a reducing gas in contact with each of the plurality of first conductive structures and the plurality of second conductive structures; establishing contact between corresponding ones of the plurality of first conductive structures and the plurality of second conductive structures; moving at least one of the semiconductor element and the substrate such that the corresponding ones of the plurality of first conductive structures and the plurality of second conductive structures are separated; re-establishing contact between the plurality of first conductive structures and the plurality of second conductive structures; and bonding the plurality of first conductive structures to the respective ones of the

Abstract: Systems and methods for controlling power distribution in a power distribution system are disclosed. The system comprises a first group of impedance injection nodes that includes two or more impedance injection nodes. Each of the impedance injection nodes of the first group is attached to a respective powerline of the power distribution system, and is configured to: respectively receive messages from other impedance injection nodes in the first group sent at different respective time slots, where each of the received messages includes node information of at least one of the other nodes, and broadcast a message to the other nodes in the first group at a time slot that is different from the respective time slots of the other nodes, where the broadcasted message includes node information of the impedance injection node, or node information of the at least one of the other nodes, or both.

Abstract: In accordance with described examples, a method determines if a velocity of an object detected by a radar is greater than a maximum velocity by receiving on a plurality of receivers at least one frame of chirps transmitted by at least two transmitters and reflected off of the object. A velocity induced phase shift (?d) in a virtual array vector S of signals received by each receiver corresponding to a sequence of chirps (frame) transmitted by each transmitter is estimated. Phases of each element of virtual array vector S are corrected using ?d to generate a corrected virtual array vector Sc. A first Fourier transform is performed on the corrected virtual array vector Sc to generate a corrected virtual array spectrum to detect a signature that indicates that the object has an absolute velocity greater than a maximum velocity.

Abstract: Disclosed is a reactance-injecting module used to balance the currents among the phases of polyphase electric power transmission lines or to manage power flow among alternate paths, where the reactance-injecting module has high-speed, dedicated communication links to enable the immediate removal of injected reactance from all phases of a phase balancing cluster when a fault is detected on any one of the multiple phases. The reactance-injecting module may communicate information on a detected fault to the other reactance-injecting modules of the phase balancing cluster within 10 microseconds after the fault is detected to allow the phase balancing cluster to eliminate injected reactance from all phases within 1 millisecond after the fault is detected. This provides extremely fast neutralization of injected reactance to minimize interference with fault localization analyses.

Abstract: A device includes one or more processors configured to receive radar data, and generate a plurality of occupancy grid maps based on the radar data. Each of the occupancy grid maps corresponds to a respective one of a plurality of candidate angles. The one or more processors is also configured to select one of the candidate angles as a sensor mount angle based on the occupancy grid maps, and trigger an action based on the sensor mount angle and the radar data.

Abstract: In accordance with described examples, a method determines if a velocity of an object detected by a radar is greater than a maximum velocity by receiving on a plurality of receivers at least one frame of chirps transmitted by at least two transmitters and reflected off of the object. A velocity induced phase shift (?d) in a virtual array vector S of signals received by each receiver corresponding to a sequence of chirps (frame) transmitted by each transmitter is estimated. Phases of each element of virtual array vector S are corrected using ?d to generate a corrected virtual array vector Sc. A first Fourier transform is performed on the corrected virtual array vector Sc to generate a corrected virtual array spectrum to detect a signature that indicates that the object has an absolute velocity greater than a maximum velocity.

Abstract: Described herein is a radio access provider configured to communicate with wireless access devices over frequency bands. The radio access provider receives service priorities associated with active applications of the wireless communication devices. Based at least in part on the service priorities, the radio access provider selects blocks or channels from one or more of the frequency bands for a radio communication link for each of at least a subset of the wireless communication devices. The selecting may include selecting block or channels from multiple ones of the frequency bands for the radio communication link for at least one of the subset of the wireless communication devices. The selecting may also be based at least in part on signal quality metrics for the frequency bands, cross-correlations of the frequency bands, or power capacities of the wireless communication devices.

Abstract: Described herein is a radio access provider configured to communicate with wireless access devices over frequency bands. The radio access provider receives service priorities associated with active applications of the wireless communication devices. Based at least in part on the service priorities, the radio access provider selects blocks or channels from one or more of the frequency bands for a radio communication link for each of at least a subset of the wireless communication devices. The selecting may include selecting block or channels from multiple ones of the frequency bands for the radio communication link for at least one of the subset of the wireless communication devices. The selecting may also be based at least in part on signal quality metrics for the frequency bands, cross-correlations of the frequency bands, or power capacities of the wireless communication devices.

Abstract: A method of bonding a semiconductor element to a substrate includes: carrying a semiconductor element including a plurality of first electrically conductive structures with a bonding tool; supporting a substrate including a plurality of second electrically conductive structures with a support structure; providing a reducing gas in contact with each of the plurality of first conductive structures and the plurality of second conductive structures; establishing contact between corresponding ones of the plurality of first conductive structures and the plurality of second conductive structures; moving at least one of the semiconductor element and the substrate such that the corresponding ones of the plurality of first conductive structures and the plurality of second conductive structures are separated; re-establishing contact between the plurality of first conductive structures and the plurality of second conductive structures; and bonding the plurality of first conductive structures to the respective ones of the