Patents by Inventor Adolph Miller Allen
Adolph Miller Allen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11932934Abstract: Physical vapor deposition methods for reducing the particulates deposited on the substrate are disclosed. The pressure during sputtering can be increased to cause agglomeration of the particulates formed in the plasma. The agglomerated particulates can be moved to an outer portion of the process chamber prior to extinguishing the plasma so that the agglomerates fall harmlessly outside of the diameter of the substrate.Type: GrantFiled: September 9, 2022Date of Patent: March 19, 2024Assignee: Applied Materials, Inc.Inventors: Halbert Chong, Lei Zhou, Adolph Miller Allen, Vaibhav Soni, Kishor Kalathiparambil, Vanessa Faune, Song-Moon Suh
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Publication number: 20230402271Abstract: Methods and apparatus for processing substrates are disclosed. In some embodiments, a process chamber for processing a substrate includes: a body having an interior volume and a target to be sputtered, the interior volume including a central portion and a peripheral portion; a substrate support disposed in the interior volume opposite the target and having a support surface configured to support the substrate; a collimator disposed in the interior volume between the target and the substrate support; a first magnet disposed about the body proximate the collimator; a second magnet disposed about the body above the support surface and entirely below the collimator and spaced vertically below the first magnet; and a third magnet disposed about the body and spaced vertically between the first magnet and the second magnet. The first, second, and third magnets are configured to generate respective magnetic fields to redistribute ions over the substrate.Type: ApplicationFiled: August 25, 2023Publication date: December 14, 2023Inventors: Xiaodong WANG, Joung Joo LEE, Fuhong ZHANG, Martin Lee RIKER, Keith A. MILLER, William FRUCHTERMAN, Rongjun WANG, Adolph Miller ALLEN, Shouyin ZHANG, Xianmin TANG
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Patent number: 11835927Abstract: Process recipe data associated a process to be performed for a substrate at a process chamber is provided as input to a trained machine learning model. A set of process recipe settings for the process that minimizes scratching on one or more surfaces of the substrate is determined based on one or more outputs of the machine learning model. The process is performed for the substrate at the process chamber in accordance with the determined set of process recipe settings.Type: GrantFiled: December 19, 2022Date of Patent: December 5, 2023Assignee: APPLIED MATERIALS, INC.Inventors: Kartik B Shah, Satish Radhakrishnan, Karthik Ramanathan, Karthikeyan Balaraman, Adolph Miller Allen, Xinyuan Chong, Mitrabhanu Sahu, Wenjing Xu, Michael Sterling Jackson, Weize Hu, Feng Chen
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Patent number: 11810770Abstract: Methods and apparatus for processing substrates are disclosed. In some embodiments, a process chamber for processing a substrate includes: a body having an interior volume and a target to be sputtered, the interior volume including a central portion and a peripheral portion; a substrate support disposed in the interior volume opposite the target and having a support surface configured to support the substrate; a collimator disposed in the interior volume between the target and the substrate support; a first magnet disposed about the body proximate the collimator; a second magnet disposed about the body above the support surface and entirely below the collimator and spaced vertically below the first magnet; and a third magnet disposed about the body and spaced vertically between the first magnet and the second magnet. The first, second, and third magnets are configured to generate respective magnetic fields to redistribute ions over the substrate.Type: GrantFiled: September 30, 2021Date of Patent: November 7, 2023Assignee: APPLIED MATERIALS, INC.Inventors: Xiaodong Wang, Joung Joo Lee, Fuhong Zhang, Martin Lee Riker, Keith A. Miller, William Fruchterman, Rongjun Wang, Adolph Miller Allen, Shouyin Zhang, Xianmin Tang
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Publication number: 20230222264Abstract: A method includes receiving, from sensors, sensor data associated with processing a substrate via a processing chamber of substrate processing equipment. The sensor data includes a first subset received from one or more first sensors and a second subset received from one or more second sensors, the first subset being mapped to the second subset. The method further includes identifying model input data and model output data. The model output data is output from a physics-based model based on model input data. The method further includes training a machine learning model with data input including the first subset and the model input data, and target output data including the second subset and the model output data to tune calibration parameters of the machine learning model. The calibration parameters are to be used by the physics-based model to perform corrective actions associated with the processing chamber.Type: ApplicationFiled: January 7, 2022Publication date: July 13, 2023Inventors: Rohit Mahakali, Elizabeth Kathryn Neville, Adolph Miller Allen, Xiaoxiong Yuan, Weize Hu, Karthik Ramanathan
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Patent number: 11658016Abstract: A shield encircles a sputtering target that faces a substrate support in a substrate processing chamber. The shield comprises an outer band having a diameter sized to encircle the sputtering target, the outer band having upper and bottom ends, and the upper end having a tapered surface extending radially outwardly and adjacent to the sputtering target. A base plate extends radially inward from the bottom end of the outer band. An inner band joined to the base plate at least partially surrounds a peripheral edge of a substrate support. The shield can also have a heat exchanger comprising a conduit with an inlet and outlet to flow heat exchange fluid therethrough.Type: GrantFiled: May 10, 2019Date of Patent: May 23, 2023Assignee: APPLIED MATERIALS, INC.Inventors: Kathleen Scheible, Michael Allen Flanigan, Goichi Yoshidome, Adolph Miller Allen, Cristopher Pavloff
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Publication number: 20230141298Abstract: Methods and apparatus for generating a magnetic field external to a physical vapor deposition (PVD) chamber to improve etch or deposition uniformity on a substrate disposed inside of the PVD chamber are provided herein. In some embodiments, a process chamber, includes a chamber body defining an interior volume therein; a pedestal disposed in the interior volume for supporting a substrate; a coil disposed in the interior volume above the pedestal; and an external magnet assembly, comprising: a housing coupled to the chamber body; and a plurality of magnets disposed external to the chamber body coupled to the housing and arranged asymmetrically about the chamber body.Type: ApplicationFiled: July 14, 2022Publication date: May 11, 2023Inventors: Anthony Chih-Tung CHAN, Adolph Miller ALLEN, Mehul CHAUHAN
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Publication number: 20230121513Abstract: Process recipe data associated a process to be performed for a substrate at a process chamber is provided as input to a trained machine learning model. A set of process recipe settings for the process that minimizes scratching on one or more surfaces of the substrate is determined based on one or more outputs of the machine learning model. The process is performed for the substrate at the process chamber in accordance with the determined set of process recipe settings.Type: ApplicationFiled: December 19, 2022Publication date: April 20, 2023Inventors: Kartik B. Shah, Satish Radhakrishnan, Karthik Ramanathan, Karthikeyan Balaraman, Adolph Miller Allen, Xinyuan Chong, Mitrabhanu Sahu, Wenjing Xu, Michael Sterling Jackson, Weize Hu, Feng Chen
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Publication number: 20230088552Abstract: Magnet assemblies comprising a housing with a top plate each comprising aligned openings are described. The housing has a bottom ring and an annular wall with a plurality of openings formed in the bottom ring. The top plate is on the housing and has a plurality of openings aligned with the plurality of openings in the bottom ring of the housing. The magnet assembly may also include a non-conducting base plate and/or a conductive cover plate. Methods for using the magnet assembly and magnetic field tuning are also described.Type: ApplicationFiled: September 17, 2021Publication date: March 23, 2023Applicant: Applied Materials, Inc.Inventors: Borui Xia, Anthony Chih-Tung Chan, Shiyu Yue, Wei Lei, Aravind Miyar Kamath, Mukund Sundararajan, Rongjun Wang, Adolph Miller Allen
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Patent number: 11586160Abstract: Methods and systems for reducing substrate particle scratching using machine learning are provided. A machine learning model is trained to predict process recipe settings for a substrate temperature control process to be performed for a current substrate at a manufacturing system. First training data and second training data are generated for the machine learning model. The first training data includes historical data associated with prior process recipe settings for a prior substrate temperature control process performed for a prior substrate at a prior process chamber. The second training data is associated with a historical scratch profile of one or more surfaces of the prior substrate after performance of the prior substrate temperature control process according to the prior process recipe settings.Type: GrantFiled: June 28, 2021Date of Patent: February 21, 2023Assignee: Applied Materials, Inc.Inventors: Kartik B Shah, Satish Radhakrishnan, Karthik Ramanathan, Karthikeyan Balaraman, Adolph Miller Allen, Xinyuan Chong, Mitrabhanu Sahu, Wenjing Xu, Michael Sterling Jackson, Weize Hu, Feng Chen
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Publication number: 20230002885Abstract: Physical vapor deposition methods for reducing the particulates deposited on the substrate are disclosed. The pressure during sputtering can be increased to cause agglomeration of the particulates formed in the plasma. The agglomerated particulates can be moved to an outer portion of the process chamber prior to extinguishing the plasma so that the agglomerates fall harmlessly outside of the diameter of the substrate.Type: ApplicationFiled: September 9, 2022Publication date: January 5, 2023Applicant: Applied Materials, Inc.Inventors: Halbert Chong, Lei Zhou, Adolph Miller Allen, Vaibhav Soni, Kishor Kalathiparambil, Vanessa Faune, Song-Moon Suh
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Publication number: 20220413452Abstract: Methods and systems for reducing substrate particle scratching using machine learning are provided. A machine learning model is trained to predict process recipe settings for a substrate temperature control process to be performed for a current substrate at a manufacturing system. First training data and second training data are generated for the machine learning model. The first training data includes historical data associated with prior process recipe settings for a prior substrate temperature control process performed for a prior substrate at a prior process chamber. The second training data is associated with a historical scratch profile of one or more surfaces of the prior substrate after performance of the prior substrate temperature control process according to the prior process recipe settings.Type: ApplicationFiled: June 28, 2021Publication date: December 29, 2022Inventors: Kartik B. Shah, Satish Radhakrishnan, Karthik Ramanathan, Karthikeyan Balaraman, Adolph Miller Allen, Xinyuan Chong, Mitrabhanu Sahu, Wenjing Xu, Michael Sterling Jackson, Weize Hu, Feng Chen
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Patent number: 11473189Abstract: Physical vapor deposition methods for reducing the particulates deposited on the substrate are disclosed. The pressure during sputtering can be increased to cause agglomeration of the particulates formed in the plasma. The agglomerated particulates can be moved to an outer portion of the process chamber prior to extinguishing the plasma so that the agglomerates fall harmlessly outside of the diameter of the substrate.Type: GrantFiled: February 11, 2020Date of Patent: October 18, 2022Assignee: Applied Materials, Inc.Inventors: Halbert Chong, Lei Zhou, Adolph Miller Allen, Vaibhav Soni, Kishor Kalathiparambil, Vanessa Faune, Song-Moon Suh
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Publication number: 20220328285Abstract: Methods and apparatus for processing a substrate are provided herein. For example, a gas supply configured for use with a processing chamber includes an ampoule that stores a precursor and comprises an input to receive a carrier gas and an output to provide a mixture of the carrier gas and the precursor to the processing chamber and a sensor assembly comprising a detector and an infrared source operably connected to an outside of an enclosure, through which the mixture flows, and a gas measurement volume disposed within the enclosure and along an inner wall thereof so that a concentration of the precursor in the mixture can be measured by the detector and transmitted to a controller.Type: ApplicationFiled: October 7, 2021Publication date: October 13, 2022Inventors: Abdullah ZAFAR, William John DURAND, Xinyuan CHONG, Kenric CHOI, Weize HU, Kelvin CHAN, Amir BAYATI, Michelle SANPEDRO, Philip A. KRAUS, Adolph Miller ALLEN
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Publication number: 20220020577Abstract: Methods and apparatus for processing substrates are disclosed. In some embodiments, a process chamber for processing a substrate includes: a body having an interior volume and a target to be sputtered, the interior volume including a central portion and a peripheral portion; a substrate support disposed in the interior volume opposite the target and having a support surface configured to support the substrate; a collimator disposed in the interior volume between the target and the substrate support; a first magnet disposed about the body proximate the collimator; a second magnet disposed about the body above the support surface and entirely below the collimator and spaced vertically below the first magnet; and a third magnet disposed about the body and spaced vertically between the first magnet and the second magnet. The first, second, and third magnets are configured to generate respective magnetic fields to redistribute ions over the substrate.Type: ApplicationFiled: September 30, 2021Publication date: January 20, 2022Inventors: Xiaodong WANG, Joung Joo LEE, Fuhong ZHANG, Martin Lee RIKER, Keith A. MILLER, William FRUCHTERMAN, Rongjun WANG, Adolph Miller ALLEN, Shouyin ZHANG, Xianmin TANG
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Publication number: 20210335586Abstract: Methods and apparatus for cleaning a showerhead are provided. For example, the methods includes moving a substrate support including a heater disposed therein from a substrate processing position a first distance away from the showerhead to a cleaning position a second distance away from the showerhead, wherein the second distance is less than the first distance; heating the showerhead using the heater disposed in the substrate support to a predetermined temperature; at least one of supplying at least one cleaning gas to the processing chamber to form a plasma or supplying the plasma from a remote plasma source; and providing a predetermined pressure within an inner volume of the processing chamber and maintaining the plasma within the inner volume of the processing chamber while heating the showerhead to the predetermined temperature.Type: ApplicationFiled: April 22, 2020Publication date: October 28, 2021Inventors: Tom H. YU, Wei Min CHAN, Peiqi WANG, Kai WU, Adolph Miller ALLEN, Kazuya DAITO
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Patent number: 11049701Abstract: Apparatus and methods for reducing and eliminating accumulation of excessive charged particles from substrate processing systems are provided herein. In some embodiments a process kit for a substrate process chamber includes: a cover ring having a body and a lip extending radially inward from the body, wherein the body has a bottom, a first wall, and a second wall, and wherein a first channel is formed between the second wall and the lip; a grounded shield having a lower inwardly extending ledge that terminates in an upwardly extending portion configured to interface with the first channel of the cover ring; and a bias power receiver coupled to the body and extending through an opening in the grounded shield.Type: GrantFiled: November 27, 2017Date of Patent: June 29, 2021Assignee: APPLIED MATERIALS, INC.Inventors: Adolph Miller Allen, William Johanson, Viachslav Babayan, Zhong Qiang Hua, Carl R. Johnson, Vanessa Faune, Jingjing Liu, Vaibhav Soni, Kirankumar Savandaiah, Sundarapandian Ramalinga Vijayalaks Reddy
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Patent number: 11037768Abstract: Methods and apparatus for controlling the ion fraction in physical vapor deposition processes are disclosed. In some embodiments, a process chamber for processing a substrate having a given diameter includes: an interior volume and a target to be sputtered, the interior volume including a central portion and a peripheral portion; a rotatable magnetron above the target to form an annular plasma in the peripheral portion; a substrate support disposed in the interior volume to support a substrate having the given diameter; a first set of magnets disposed about the body to form substantially vertical magnetic field lines in the peripheral portion; a second set of magnets disposed about the body and above the substrate support to form magnetic field lines directed toward a center of the support surface; a first power source to electrically bias the target; and a second power source to electrically bias the substrate support.Type: GrantFiled: March 3, 2017Date of Patent: June 15, 2021Assignee: APPLIED MATERIALS, INC.Inventors: Xiaodong Wang, Joung Joo Lee, Fuhong Zhang, Martin Lee Riker, Keith A. Miller, William Fruchterman, Rongjun Wang, Adolph Miller Allen, Shouyin Zhang, Xianmin Tang
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Patent number: 10972280Abstract: Profile_ID files, containing proprietary hardware operating details of an originating user who originates a process recipe, are encrypted before dissemination of the process recipe to an end user. Blockchain technology is used to enable the end user to validate the encrypted process recipe and control uniform validated process across multiple chambers and locations.Type: GrantFiled: October 9, 2018Date of Patent: April 6, 2021Assignee: Applied Materials, Inc.Inventors: Adolph Miller Allen, Paul Kiely, Noufal Kappachali
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Publication number: 20210071294Abstract: Methods and apparatus for controlling the ion fraction in physical vapor deposition processes are disclosed. In some embodiments, a physical vapor deposition chamber includes: a body having an interior volume and a lid assembly including a target to be sputtered; a magnetron disposed above the target, wherein the magnetron is configured to rotate a plurality of magnets about a central axis of the physical vapor deposition chamber; a substrate support disposed in the interior volume opposite the target and having a support surface configured to support a substrate; a collimator disposed between the target and the substrate support, the collimator having a central region having a first thickness and a peripheral region having a second thickness less than the first thickness; a first power source coupled to the target to electrically bias the target; and a second power source coupled to the substrate support to electrically bias the substrate support.Type: ApplicationFiled: November 23, 2020Publication date: March 11, 2021Inventors: Xiaodong WANG, Joung Joo LEE, Fuhong ZHANG, Martin Lee RIKER, Keith A. MILLER, William FRUCHTERMAN, Rongjun WANG, Adolph Miller ALLEN, Shouyin ZHANG, Xianmin TANG