Abstract: Provided are a method and system for processing image data, the method comprising: capturing raw image data of multiple images of one or more scenes under one or more lighting conditions; machine vision processing the raw image data to generate machine vision data; classifying the machine vision data according to a type of the machine vision data; and storing the classified machine vision data in a multi-tiered data structure according to the machine vision data type, configured to enable each of the tiers of data to be processed independently of each other.

Abstract: Provided are a method and system for calibrating parameters of an imaging system comprising at least one imaging device and broad and structured light sources, the method comprising: the at least one imaging device sequentially capturing broad light source image data and structured light source image data of one or more scenes using the broad and structured light sources, respectively; generating a photogrammetric model of the broad light source image data and a photogrammetric model of the structured light source image data using respective coordinates of the broad and structured light source image data; determining corresponding features in the respective photogrammetric models; iteratively solving parameters of the imaging system to correct variations between corresponding features in the respective photogrammetric models, converge the models and obtain calibration parameters; and applying the calibration parameters to the imaging system to compensate for errors in the relative positions of the imaging dev

Abstract: Provided are a method and system for calibrating parameters of an imaging system comprising at least one imaging device and broad and structured light sources, the method comprising: the at least one imaging device sequentially capturing broad light source image data and structured light source image data of one or more scenes using the broad and structured light sources, respectively; generating a photogrammetric model of the broad light source image data and a photogrammetric model of the structured light source image data using respective coordinates of the broad and structured light source image data; determining corresponding features in the respective photogrammetric models; iteratively solving parameters of the imaging system to correct variations between corresponding features in the respective photogrammetric models, converge the models and obtain calibration parameters; and applying the calibration parameters to the imaging system to compensate for errors in the relative positions of the imaging dev

Abstract: Provided are a method and system for processing image data, the method comprising: capturing raw image data of multiple images of one or more scenes under one or more lighting conditions; machine vision processing the raw image data to generate machine vision data; classifying the machine vision data according to a type of the machine vision data; and storing the classified machine vision data in a multi-tiered data structure according to the machine vision data type, configured to enable each of the tiers of data to be processed independently of each other.

Abstract: Provided is a method for generating a 3D point cloud and colour visualisation of an underwater scene, the point cloud comprising a set of (x, y, z) coordinates relating to points in the scene, the method operating in a system comprising at least one camera module, at least one structured light source, and a processing module, each of the at least one camera module being directed at the scene and having substantially the same overlapped field of view.

Abstract: The present invention relates to a method of processing survey data of an underwater scene comprising acquiring an augmented image of each of a plurality of fields of view within the scene, wherein each augmented image comprises at least a scene image of the scene, a location tag associated with that scene image, and metadata associated with that scene image.

Abstract: The present invention relates to an underwater method and system for gathering range and dimensional information of subsea objects, the system comprising a camera module suitable for capturing images of sub-sea scenes; and a reference projection light source that, in use, projects a structured light beam onto a target. The structured light beam is preferably generated by a laser and may comprise spots, lines, grids and the like.

Abstract: The present invention relates to methods and systems for performing underwater surveys, in particular on sub-sea installations such as oil and gas pipelines, risers, well-heads and so on. Further the invention relates to providing an augmented underwater image of a scene for use in an under-water survey, using an underwater imaging system comprising a light module, image processing module and a camera module, the light module comprising a plurality of light classes each light class having one or more light sources. The invention uses sequential imaging to provide the augmented output image.

Abstract: Provided is a method for generating a 3D point cloud and colour visualisation of an underwater scene, the point cloud comprising a set of (x, y, z) coordinates relating to points in the scene, the method operating in a system comprising at least one camera module, at least one structured light source, and a processing module, each of the at least one camera module being directed at the scene and having substantially the same overlapped field of view.

Abstract: Provided is a method of carrying out an underwater video survey of a scene, the method operating in an underwater imaging system comprising a first camera module, a second camera module and a lighting module to provide a plurality of illumination profiles, wherein the method comprises repeating the following steps at a desired frame rate: the first camera module capturing a first image of the scene, where the scene is illuminated according to a first illumination profile; and the second camera module capturing a second image of the scene, where the scene is illuminated according to a second illumination profile; characterised in that the first camera module is a HD colour camera module and the first illumination profile provides white light suitable for capturing a HD image; and the second camera module is a low light camera module, and the second illumination profile is suitable for use with the low light camera module.

Abstract: The present invention relates to methods and systems for performing underwater surveys, in particular on sub-sea installations such as oil and gas pipelines, risers, well-heads and so on. Further the invention relates to providing an augmented underwater image of a scene for use in an under-water survey, using an underwater imaging system comprising a light module, image processing module and a camera module, the light module comprising a plurality of light classes each light class having one or more light sources. The invention uses sequential imaging to provide the augmented output image.

Abstract: The present invention relates to an underwater method and system for gathering range and dimensional information of subsea objects, the system comprising a camera module suitable for capturing images of sub-sea scenes; and a reference projection light source that, in use, projects a structured light beam onto a target. The structured light beam is preferably generated by a laser and may comprise spots, lines, grids and the like.

Abstract: A substrate is diced using a program-controlled pulsed laser beam apparatus having an associated memory for storing a laser cutting strategy file. The file contains selected combinations of pulse rate ?t, pulse energy density E and pulse spatial overlap to machine a single layer or different types of material in different layers of the substrate while restricting damage to the layers and maximizing machining rate to produce die having predetermined die strength and yield. The file also contains data relating to the number of scans necessary using a selected combination to cut through a corresponding layer. The substrate is diced using the selected combinations. Gas handling equipment for inert or active gas may be provided for preventing or inducing chemical reactions at the substrate prior to, during or after dicing.

Abstract: A substrate is diced using a program-controlled pulsed laser beam apparatus having an associated memory for storing a laser cutting strategy file. The file contains selected combinations of pulse rate ?t, pulse energy density E and pulse spatial overlap to machine a single layer or different types of material in different layers of the substrate while restricting damage to the layers and maximising machining rate to produce die having predetermined die strength and yield. The file also contains data relating to the number of scans necessary using a selected combination to cut through a corresponding layer. The substrate is diced using the selected combinations. Gas handling equipment for inert or active gas may be provided for preventing or inducing chemical reactions at the substrate prior to, during or after dicing.

Abstract: A method of dicing a semiconductor wafer comprises scribing at least one dielectric layer along dice lanes to remove material from a surface of the wafer using a laser with a pulse-width between 1 picosecond and 1000 picoseconds and with a repetition frequency corresponding to times between pulses shorter than a thermal relaxation time of the material to be scribed. The wafer is then diced through a metal layer and at least partially through a substrate of the semiconductor wafer.

Abstract: A substrate is diced using a program-controlled pulsed laser beam apparatus having an associated memory for storing a laser cutting strategy file. The file contains selected combinations of pulse rate ?t, pulse energy density E and pulse spatial overlap to machine a single layer or different types of material in different layers of the substrate while restricting damage to the layers and maximising machining rate to produce die having predetermined die strength and yield. The file also contains data relating to the number of scans necessary using a selected combination to cut through a corresponding layer. The substrate is diced using the selected combinations. Gas handling equipment for inert or active gas may be provided for preventing or inducing chemical reactions at the substrate prior to, during or after dicing.

Abstract: A method of dicing a semiconductor wafer comprises scribing at least one dielectric layer along dice lanes to remove material from a surface of the wafer using a laser with a pulse-width between 1 picosecond and 1000 picoseconds and with a repetition frequency corresponding to times between pulses shorter than a thermal relaxation time of the material to be scribed. The wafer is then diced through a metal layer and at least partially through a substrate of the semiconductor wafer.

Abstract: A die bonding method and apparatus by which a wafer substrate 11 adhered to a carrier tape 13 by an adhesive layer 12 is laser machined through the wafer substrate and through the adhesive layer at most to scribe the carrier tape to form a singulated die 15 with an attached singulated adhesive layer, without substantial delamination of the adhesive layer 12 and carrier tape 13 or substantial production of burrs from the adhesive layer 12. The carrier tape 13 is cured, preferably by ultraviolet light, to release the adhesive layer from the carrier tape. The singulated die is picked and placed on a die pad and the adhesive layer 12 is cured, preferably by heat, to adhere the die to the die pad.

Abstract: A method and apparatus for machining, or forming a feature in, a patterned silicon wafer includes removing portions of surface layers on the wafer using a first pulsed laser (4) beam with a pulse width between 1 ps and 1000 ps; and removing portions of bulk silicon (1) underlying the surface layers from the wafer using a second pulsed laser (5) beam with a wavelength between 200 nm and 1100 nm. Re-deposited silicon may be removed from the wafer by etching.

Abstract: A substrate (16) is machined to form, for example, a via. The substrate is in a chamber (15) within which the gaseous environment is controlled. The machining laser beam (13) is delivered with control of parameters such as pulsing parameters to achieve desired effects. The gaseous environment may be controlled to control integral development of an insulating lining for a via, thereby avoiding the need for downstream etching and oxide growth steps. Also, machining may be performed in multiple passes in order to minimize thermal damage and to achieve other desired effects such as a particular via geometry.