Abstract: A gate-source structure and fabrication method for a surface-gate static induction transistor. The method requires only one masking step during fabrication, thereby eliminating or minimizing mask registration problems during fabrication of the devices. The method and the device are characterized by a two-step etching process which forms T-shaped gate windows in layers of polycrystalline silicon with different doping levels. The source region is formed during an annealing step from the layer with high doping level. During the annealing step, the gate regions are also formed from gate impurities implanted previously in the gate windows. The source structure and the gate structure are separated by a silicon dioxide protective layer.

Abstract: A gate-source structure and fabrication method for a static induction transistor. The method and the device are embodied by the epitaxial layer of, for example, high resistivity p-type semiconductor material grown on an epitaxial layer of high resistivity n-type semiconductor material. A silicon dioxide layer with source and gate windows is formed on the p-type epitaxial layer. Source grooves are formed in the p-type epitaxial layer at source window locations and the grooves are diffused with n-type impurities to form a diffusion region which extends to connect with the n-type epitaxial layer. Source and gate electrodes are formed in the source and gate windows.

Abstract: A gate-source structure and fabrication method for a static induction transistor. The method and the device are embodied by the epitaxial layer of, for example, high resistivity p-type semiconductor material grown on an epitaxial layer of high resistivity n-type semiconductor material. A silicon dioxide layer with source and gate windows is formed on the p-type epitaxial layer. Source grooves are formed in the p-type epitaxial layer at source window locations and the grooves are diffused with n-type impurities to form a diffusion region which extends to connect with the n-type epitaxial layer. Source and gate electrodes are formed in the source and gate windows.

Abstract: A method for fabricating a static induction transistor starting with a high resistivity substrate on which a gate-source structure is formed. The gate-source structure is covered by a supporting layer and the wafer is etched to desired thickness. Ions are implanted in the etched surface and a drain electrode is deposited. A thick metal support layer and heat sink is electroplated on the drain electrode.

Abstract: A method for fabricating a gate-source structure for a recessed-gate static induction transistor. The method is characterized by use of doped polysilicon to fill the recessed gate grooves after the gate grooves have been etched and diffused. The gate grooves have depth greater than width and therefore the surface of the polysilicon layer deposit is substantially planar. The planar surface allows photolithographic techniques to be used for formation of gate contact regions and for depositing of metal gate and source electrodes.