Abstract: According to an aspect of the invention, there is provided a chip die 2 manipulator apparatus arranged for picking and placing of a chip die 2 in a chip manufacturing process, wherein an imaging system 11 comprising an arc form convex spherical mirror 13 arranged at a second off-axis position B and centered relative to the center position 5; a folding mirror 4 arranged in a light path between the convex spherical mirror 13 and the center position 5 for folding the light path to a third off-axis position C; and an arc form concave spherical mirror 15 arranged at the third off-axis position C having a curvature to image from at least one of the center position 5 and the component 2 on the image detection system 9. The imaging system 11 corrects for the angled image detection of the center position 5.

Abstract: The present invention relates to an illumination system for use in a stereolithography apparatus. The illumination system includes a plurality of light-emitting diodes (LEDs), each LED having at least a first light-emitting surface and a second surface, at least one of the first and the second surface being substantially flat. The illumination further includes a plurality of electrical pathways, selectively connected to the respective LEDs, such that each LED can be individually controlled and a leveling surface. The leveling surface is substantially flat and in leveling contact with the at least one substantially flat surface of each LED, such that a two-dimensional array of LEDs extends in a plane parallel to the leveling surface.

Abstract: A system and method of layerwise production of a tangible object (5), they system comprising a construction shape (6) to form a liquid layer to be brought in contact with the tangible object; solidifying means (9) for solidifying a predetermined area of a layer (10) of the liquid (3), so as to obtain a solid layer (14) of the tangible object (5), the solid layer thus having a predetermined shape, separating means (18; 19?; 19?) for separating said solid layer from said construction shape; moving means (18) for moving, relative to one another, the construction shape (6) to a predetermined position relative to the tangible object (5), for carrying out a successive such method cycle for solidifying a predetermined area of a successive such liquid layer; the system is arranged to provide a limited volume of liquid adhered to the construction shape to form a liquid layer of limited height that does not contact the tangible object; wherein said moving of said construction shape and said solidifying of said predeter

Abstract: A system and method for layer-by-layer production of an object is provided. The system includes a construction shape having a carrying surface adapted for carrying a layer of build material, a plate having a holding surface adapted for holding an object in an object build area, a moveable reservoir having a plurality of containment surfaces defining a containment area adapted for containing a volume of build material within the moveable reservoir, and an exposure unit adapted for exposing at least a portion of the layer of build material in the object build area so that the portion of the layer of build material solidifies to form a solidified layer of the object.

Abstract: A system and method for layer-by-layer production of an object is provided. The system includes a construction shape having a carrying surface adapted for carrying a layer of build material, a plate having a holding surface adapted for holding an object in an object build area, a moveable reservoir having a plurality of containment surfaces defining a containment area adapted for containing a volume of build material within the moveable reservoir, and an exposure unit adapted for exposing at least a portion of the layer of build material in the object build area so that the portion of the layer of build material solidifies to form a solidified layer of the object.

Abstract: Method for depositing a layer on a surface of a substrate. The method comprises injecting a precursor gas from a precursor supply into a deposition cavity for contacting the substrate surface, draining part of the injected precursor gas from the deposition cavity, and positioning the deposition cavity and the substrate relative to each other along a plane of the substrate surface. The method further comprising providing a first electrode and a second electrode, positioning the first electrode and the substrate relative to each other, and generating a plasma discharge near the substrate for contacting the substrate by generating a high-voltage difference between the first electrode and the second electrode. The method comprises generating the plasma discharge selectively, for patterning the surface by means of the plasma. A portion of the substrate contacted by the precursor gas selectively overlaps with a portion of the substrate contacted by the plasma.

Abstract: Apparatus for atomic layer deposition on a surface of a sheeted substrate, comprising: an injector head comprising a deposition space provided with a precursor supply and a precursor drain; said supply and drain arranged for providing a precursor gas flow from the precursor supply via the deposition space to the precursor drain; the deposition space in use being bounded by the injector head and the substrate surface; a gas bearing comprising a bearing gas injector, arranged for injecting a bearing gas between the injector head and the substrate surface, the bearing gas thus forming a gas-bearing; a conveying system providing relative movement of the substrate and the injector head along a plane of the substrate to form a conveying plane along which the substrate is conveyed.

Abstract: Apparatus for atomic layer deposition on a surface of a sheeted substrate, comprising: an injector head comprising a deposition space provided with a precursor supply and a precursor drain; said supply and drain arranged for providing a precursor gas flow from the precursor supply via the deposition space to the precursor drain; the deposition space in use being bounded by the injector head and the substrate surface; a gas bearing comprising a bearing gas injector, arranged for injecting a bearing gas between the injector head and the substrate surface, the bearing gas thus forming a gas-bearing; a conveying system providing relative movement of the substrate and the injector head along a plane of the substrate to form a conveying plane along which the substrate is conveyed.

Abstract: Apparatus for atomic layer deposition on a surface of a sheeted substrate, comprising: an injector head comprising a deposition space provided with a precursor supply and a precursor drain; said supply and drain arranged for providing a precursor gas flow from the precursor supply via the deposition space to the precursor drain; the deposition space in use being bounded by the injector head and the substrate surface; a gas bearing comprising a bearing gas injector, arranged for injecting a bearing gas between the injector head and the substrate surface, the bearing gas thus forming a gas-bearing; a conveying system providing relative movement of the substrate and the injector head along a plane of the substrate to form a conveying plane along which the substrate is conveyed.

Abstract: The invention relates to an apparatus for reactive ion etching of a substrate, comprising: a plasma etch zone including an etch gas supply and arranged with a plasma generating structure for igniting a plasma and comprising an electrode structure arranged to accelerate the etch plasma toward a substrate portion to have ions impinge on the surface of the substrate; a passivation zone including a cavity provided with a passivation gas supply; said supply arranged for providing a passivation gas flow from the supply to the cavity; the cavity in use being bounded by the injector head and the substrate surface; and a gas purge structure comprising a gas exhaust arranged between said etch zone and passivation zone; the gas purge structure thus forming a spatial division of the etch and passivation zones.

Abstract: Method of depositing an atomic layer on a substrate. The method comprises supplying a precursor gas from a precursor-gas supply of a deposition head that may be part of a rotatable drum. The precursor gas is provided from the precursor-gas supply towards the substrate. The method further comprises moving the precursor-gas supply by rotating the deposition head along the substrate which in its turn is moved along the rotating drum.

Abstract: A method of manufacturing a substrate with a patterned layer of deposited material, the patterned layer being deposited from a processing head, the method comprising applying bearing gas from the processing head to keep the processing head hovering over the substrate on a gas bearing; moving the substrate and the hovering processing head relative to each other; applying a primer material for selective deposition of a deposition material to the substrate, the primer material being applied from a first area of a surface of the processing head that faces the substrate, and spatially patterning the primer on the substrate after or during application; applying the deposition material to the substrate from a second area of the surface of the processing head that faces the substrate, the second area lying downstream of the first area in a direction of the movement of the substrate relative to the processing head.

Abstract: Method for depositing a layer on a surface of a substrate. The method comprises injecting a precursor gas from a precursor supply into a deposition cavity for contacting the substrate surface, draining part of the injected precursor gas from the deposition cavity, and positioning the deposition cavity and the substrate relative to each other along a plane of the substrate surface. The method further comprising providing a first electrode and a second electrode, positioning the first electrode and the substrate relative to each other, and generating a plasma discharge near the substrate for contacting the substrate by generating a high-voltage difference between the first electrode and the second electrode. The method comprises generating the plasma discharge selectively, for patterning the surface by means of the plasma. A portion of the substrate contacted by the precursor gas selectively overlaps with a portion of the substrate contacted by the plasma.

Abstract: According to an aspect of the invention, there is provided a chip die 2 manipulator apparatus arranged for picking and placing of a chip die 2 in a chip manufacturing process, wherein an imaging system 11 comprising an arc form convex spherical mirror 13 arranged at a second off-axis position B and centered relative to the centre position 5; a folding mirror 4 arranged in a light path between the convex spherical mirror 13 and the centre position 5 for folding the light path to a third off-axis position C; and an arc form concave spherical mirror 15 arranged at the third off-axis position C having a curvature to image from at least one of the centre position 5 and the component 2 on the image detection system 9. The imaging system 11 corrects for the angled image detection of the centre position 5.

Abstract: A system and method for layer-by-layer production of an object is provided. The system includes a construction shape having a carrying surface adapted for carrying a layer of build material, a plate having a holding surface adapted for holding an object in an object build area, a moveable reservoir having a plurality of containment surfaces defining a containment area adapted for containing a volume of build material within the moveable reservoir, and an exposure unit adapted for exposing at least a portion of the layer of build material in the object build area so that the portion of the layer of build material solidifies to form a solidified layer of the object.

Abstract: Apparatus for atomic layer deposition on a surface of a sheeted substrate, comprising: an injector head comprising a deposition space provided with a precursor supply and a precursor drain; said supply and drain arranged for providing a precursor gas flow from the precursor supply via the deposition space to the precursor drain; the deposition space in use being bounded by the injector head and the substrate surface; a gas bearing comprising a bearing gas injector, arranged for injecting a bearing gas between the injector head and the substrate surface, the bearing gas thus forming a gas-bearing; a conveying system providing relative movement of the substrate and the injector head along a plane of the substrate to form a conveying plane along which the substrate is conveyed.

Abstract: A system and method of layerwise production of a tangible object (5), they system comprising a construction shape (6) to form a liquid layer to be brought in contact with the tangible object; solidifying means (9) for solidifying a predetermined area of a layer (10) of the liquid (3), so as to obtain a solid layer (14) of the tangible object (5), the solid layer thus having a predetermined shape, separating means (18; 19?; ·?) for separating said solid layer from said construction shape; moving means (18) for moving, relative to one another, the construction shape (6) to a predetermined position relative to the tangible object (5), for carrying out a successive such method cycle for solidifying a predetermined area of a successive such liquid layer; the system is arranged to provide a limited volume of liquid adhered to the construction shape to form a liquid layer of limited height that does not contact the tangible object; wherein said moving of said construction shape and said solidifying of said predeterm

Abstract: An illumination system (30), comprising: a plurality of light-emitting diodes (LEDs) (34), each LED having at least a first, light-emitting surface (36) and a second surface (37), at least one of the first and the second surface being substantially flat; a plurality of electrical pathways (56), selectively connected to the respective LEDs, such that each LED can be individually controlled; and a levelling surface (46, 52), wherein the levelling surface is substantially flat and in levelling contact with the at least one substantially flat surface (37, 36) of each LED, such that a two-dimensional array of LEDs extends in a plane parallel to the levelling surface.

Abstract: A component placement apparatus includes: a tray storing device having slots for storing trays, a tray transporting device for transporting a tray from the tray storing device to a pickup area, a controller for controlling the transport of the trays into and out of the tray storing device, and at least one component pickup and placement device for picking-up a component in a tray located in the pickup area and placing the component on a substrate. The tray storing device includes first and second parts located proximal and distal the pickup area, respectively. The first part stores trays (i) from which at least one component may be removed and/or (ii) that are expected to be needed at the pickup area in the short term. The second part stores trays, which are empty, full, or are not expected to be needed in the pickup area in the short term.

Abstract: A pick-and-place machine, comprising: a pick station; a place station; a pick/place head for transporting a die from the pick station along a transport path to the place station; wherein the machine further comprises a die-face processing means, comprising an inspection unit and/or a cleaning unit, operable to process a face of the die on the transport path.