Abstract: An etchant comprises: greater than or equal to 20 wt % and less than or equal to 45 wt % ammonium bifluoride; greater than or equal to 0.25 wt % and less than or equal to 10 wt % of a silicon compound; greater than or equal to 5 wt % and less than or equal to 30 wt % hydrochloric acid; greater than or equal to 25 wt % and less than or equal to 60 wt % water; and greater than or equal to 0.5 wt % and less than or equal to 20 wt % of polyhydric alcohol. The silicon compound comprises silica, silica gel, ammonium hexafluorosilicate, potassium hexafluorosilicate, sodium hexafluorosilicate, magnesium hexafluorosilicate, or a combination thereof.

Abstract: A silicate-based glass composition includes 15-65 wt. % SiO2, 15-50 wt. % CaO, 1-30 wt. % P2O5, and 1-20 wt. % ZrO2, such that the composition has a hydrolytic resistance of glass grains (HGB) of at most 3, when measured by International Organization for Standardization section 719 (ISO 719), and forms a bioactive crystalline phase in simulated body fluid.

Abstract: Apparatus and method for treating a substrate, for example texturing a substrate. In some embodiments, a masking material is applied to a surface of the substrate in a predetermined pattern, the surface thereafter contacted with an etchant that removes the masking material. Contacting the surface with the etchant produces multiple co-located textures. In other embodiments, the masking step can be eliminated, and the etchant is applied in a predetermined pattern to produce multiple co-located textures. In still other embodiments, the substrate has a chemical composition, and the substrate is exposed to a leachant that leaches at least one constituent of the chemical composition to produce a substrate with a varying chemical composition at the substrate surface.

Abstract: A glass-based article with a textured surface exhibiting low haze is provided. The glass-based articles are produced by utilizing a combination of abrasion and etching, where hydrofluoric acid is not utilized. The process for producing the glass-based articles also includes an ion exchange process.

Abstract: A textured glass article includes: a body comprising an aluminosilicate glass comprising greater than or equal to 16 wt % Al2O3, the body having at least a first surface; a plurality of dendritic surface features extending from the first surface, each of the plurality of dendritic surface features comprising a base on the first surface and a surface feature size at the base greater than or equal to 10 ?m and less than or equal to 350 ?m; and a transmittance haze greater than or equal to 50%.

Abstract: An article that includes: a glass-based substrate comprising a thickness, a primary surface and a compressive stress region that extends from the primary surface to a selected depth; and a textured region defined by the primary surface. The textured region comprises a surface roughness (Ra) of at least 10 nm. The article can also comprise a Knoop Scratch Threshold of at least 9 Newtons (N).

Abstract: The present disclosure relates to a reconstituted wafer- and/or panel-level package comprising a glass substrate having a plurality of cavities. Each cavity is configured to hold a single IC chip. The reconstituted wafer- and/or panel-level package can be used in a fan-out wafer or panel level packaging process. The glass substrate can include at least two layers having different photosensitivities with one layer being sufficiently photosensitive to be capable of being photomachined to form the cavities.

Abstract: A borosilicate-based composition, including: 50-85 mol. % SiO2, 10-40 mol. % B2O3, >0-5 mol. % SnO2, and >0-20 mol. % of at least one alkali oxide selected from Li2O, Na2O, K2O, Rb2O, and Cs2O, such that the composition has a Young's Modulus less than 64 GPa.

Abstract: A method is described herein of making a textured glass article where the method includes: providing a glass substrate having an initial primary surface and an opposing primary surface; disposing a protective coating on at least one of the initial primary surface or the opposing primary surface; and etching the glass substrate with a hydrofluoric acid-free etchant having a pH of about 7 or less to form a leached layer in the glass substrate.

Abstract: The methods generally include contacting an alkali-containing glass article having a first alkali metal cation with a molten salt bath including from 0.1 wt. % to 3 wt. % nanoparticles and at least one alkali metal salt having a second alkali metal cation that has an atomic radius larger than an atomic radius of the first alkali metal cation. The nanoparticles may include at least one of metalloid oxide nanoparticles and metal oxide nanoparticles. The methods also include maintaining contact of the glass article with the molten salt bath to allow the first alkali metal cations to be exchanged with the second alkali metal cations of the molten salt bath. Further, the methods may include removing the glass article from contact with the molten salt bath to produce a strengthened glass article. A Surface Hydrolytic Resistance titration volume of the strengthened glass article may be less than 1.5 mL.

Abstract: A silicate-based glass composition includes 15-65 wt. % SiO2, 2.5-25 wt. % MgO, 1-30 wt. % P2O5, and 15-50 wt. % CaO. The glass composition may also include 0-5 wt. % F?, and 0-10 wt. % ZrO2. The glass composition may also include one of 0-10 wt. % Al2O3, 0-10 wt. % SrO, and 0-10 wt. % ZnO.

Abstract: The present disclosure relates to a reconstituted wafer- and/or panel-level package comprising a glass substrate having a plurality of cavities. Each cavity is configured to hold a single IC chip. The reconstituted wafer- and/or panel-level package can be used in a fan-out wafer or panel level packaging process. The glass substrate can include at least two layers having different photosensitivities with one layer being sufficiently photosensitive to be capable of being photomachined to form the cavities.

Abstract: A glass article is provided that includes: a glass substrate comprising a thickness and a primary surface; and a textured region defined by the primary surface. The textured region comprises a plurality of sub-surface hillocks, each hillock having a top surface and a base, the base located below the primary surface of the substrate. The plurality of hillocks comprises an average lateral feature size from 0.1 ?m to 3 ?m and an average height from 5 nm to 200 nm. Further, the primary surface of the substrate is substantially planar.

Abstract: An article that includes: a glass-based substrate comprising a thickness, a primary surface and a compressive stress region that extends from the primary surface to a selected depth; and a textured region defined by the primary surface. The textured region comprises a surface roughness (Ra) of at least 10 nm. The article can also comprise a Knoop Scratch Threshold of at least 9 Newtons (N).

Abstract: The present disclosure relates to a reconstituted wafer- and/or panel-level package comprising a glass substrate having a plurality of cavities. Each cavity is configured to hold a single IC chip. The reconstituted wafer- and/or panel-level package can be used in a fan-out wafer or panel level packaging process. The glass substrate can include at least two layers having different photosensitivities with one layer being sufficiently photosensitive to be capable of being photomachined to form the cavities.

Abstract: A glass article is provided that includes: a glass substrate comprising a thickness and a primary surface; and a textured region defined by the primary surface. The textured region comprises a plurality of sub-surface hillocks, each hillock having a top surface and a base, the base located below the primary surface of the substrate. The plurality of hillocks comprises an average lateral feature size from 0.1 ?m to 3 ?m and an average height from 5 nm to 200 nm. Further, the primary surface of the substrate is substantially planar.

Abstract: A textured glass article includes: a body comprising an aluminosilicate glass comprising greater than or equal to 16 wt % Al2O3 and a Al2O3/SiO2 ratio less than or equal to 0.3, the body having at least a first surface; a plurality of polyhedral surface features extending from the first surface, each of the plurality of polyhedral surface features comprising a base on the first surface, a plurality of facets extending from the first surface, and a surface feature size at the base greater than or equal to 10 ?m and less than or equal to 100 ?m, wherein the plurality of facets of each polyhedral surface feature converge toward one another; and a transmittance haze greater than or equal to 50%.

Abstract: A textured glass article that includes: a glass substrate comprising a thickness, a primary surface and a bulk composition at the midpoint of the thickness; and a textured region defined by the primary surface and comprising a textured region composition. The textured region comprises a sparkle of 2% or less. Further, the bulk composition comprises about 40 mol % to 80 mol % silica and the textured region composition comprises at least about 40 mol % silica.

Abstract: A method of modifying a substrate comprising an etching step comprising contacting one or more primary surfaces of a glass, glass-ceramic, or ceramic substrate with a solution for a time period of 20 minutes to 8 hours to generate one or more etched primary surfaces, the solution comprising over 10 percent by weight of one or more alkali hydroxides, the solution having a temperature within the range of 100° C. to 150° C., the substrate having a thickness between the primary surfaces that decreases during the time period by 5 ?m to 100 ?m at a rate of 2 ?m per hour or greater. The solution of the etching step does not comprise hydrogen fluoride. The one or more alkali hydroxides of the solution of the etching step can be sodium hydroxide (NaOH), potassium hydroxide (KOH), or a combination of both sodium hydroxide and potassium hydroxide.

Abstract: A textured glass article that includes: a glass substrate comprising a thickness, a primary surface and a bulk composition at the midpoint of the thickness; and a textured region defined by the primary surface and comprising a textured region composition. The textured region comprises a sparkle of 2% or less. Further, the bulk composition comprises about 40 mol % to 80 mol % silica and the textured region composition comprises at least about 40 mol % silica.