Patents by Inventor Akihiko Okubora

Akihiko Okubora has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7138294
    Abstract: A circuit substrate device composed of a circuit unit 2 and a multi-layer wiring substrate 3 in which a pattern conductor of the circuit unit 2 may be prevented from being warped or inundated. The circuit substrate device includes a circuit unit 2 having a pattern conductor formed by a thin film technique, and an insulating layer, and a multi-layer wiring substrate 3 having a connecting terminal portion 14 exposed from its major surface. The circuit unit is formed on a dummy substrate. The circuit unit is connected to the multi-layer wiring substrate 3 so that the pattern conductor is connected to the connecting terminal portion 14. The dummy substrate is then removed to give a structure comprised of the circuit unit 2 formed on the multi-layer wiring substrate 3. The pattern conductor of the circuit unit 2 is freed of warping or inundations along the direction of thickness of the circuit unit 2.
    Type: Grant
    Filed: March 3, 2004
    Date of Patent: November 21, 2006
    Assignee: Sony Corporation
    Inventors: Yuji Nishitani, Tsuyoshi Ogawa, Hiroshi Asami, Akihiko Okubora
  • Publication number: 20060133764
    Abstract: An optoelectric device able to easily maintain a flexibility of a design so as to manage a design change and able to manage a production of a small amount and numerous varieties of products, and a method for the same, in which a processing head is provided at a top of a capillary unit, and a tip portion of the processing head has a first and a second planes crossing a symmetry axis of the processing head at an angle of 45° and crossing perpendicularly each other. The processing head is driven into an optical waveguide sheet in which an optical waveguide having a cladding and a core buried into the cladding is formed, at a position to be an end portion of the optical waveguide, so a shape of the first and the second planes is transferred at the end portion to form a mirror plane.
    Type: Application
    Filed: November 17, 2005
    Publication date: June 22, 2006
    Inventors: Akihiko Okubora, Hirokazu Nakayama
  • Patent number: 7064630
    Abstract: The present invention provides a high-frequency module device having a distributed constant circuit formed therein, the device comprising: a base board (2) having a high-frequency element layer forming surface (3) formed by performing flattening processing on an uppermost layer of a multilayer printed wiring part in which a printed wiring layer having a ground part and a dielectric insulating layer made of a dielectric insulating material are formed in a multilayer form on one major surface of a core board (6); and a high-frequency element layer part (5) having a passive element and a circuit element for receiving power or a signal supplied from the base board (2) via a dielectric insulating part made of a dielectric insulating material, on the high-frequency element layer forming surface (3) of the base board (2). The base board (2) has a distributed constant circuit (4) formed by pattern wiring.
    Type: Grant
    Filed: April 25, 2002
    Date of Patent: June 20, 2006
    Assignee: Sony Corporation
    Inventors: Takayuki Hirabayashi, Takahiko Kosemura, Akihiko Okubora, Tatsuya Ogino, Kuniyuki Hayashi
  • Publication number: 20060079177
    Abstract: The present invention is directed to a wireless communication apparatus provided at various electronic equipments having wireless communication function, and performs, by a system control unit (6), in accordance with communication band used, a control to select plural communication circuits (4), (5) having communication bands different from each other, which are connected to a wireless communication antenna (1) including plural antenna element patterns connected through switches formed on an antenna board, and having plural resonance frequencies selected by switching connecting state of the antenna element patterns by the switch, and to select resonance frequency of the wireless communication antenna.
    Type: Application
    Filed: December 11, 2003
    Publication date: April 13, 2006
    Inventor: Akihiko Okubora
  • Publication number: 20060023991
    Abstract: A photoelectronic device capable of maintaining the degree of freedom in designing for dealing with design changes and responding to producing a variety of kinds in a small amount, and the production method are provided: wherein a light emitting element for emitting a light to be a clock signal, a semiconductor chip provided with light receiving portions for receiving the light, and an optical waveguide sheet formed to be a sheet, wherein an outer circumference of a core is covered with a clad, adhered to said semiconductor chip are provided; and the optical waveguide sheet is configured to be irradiated at a light incident portion of a core with a light from the light emitting element and includes one or more T-shaped branch having a vertical opening portion having a vertical inner wall, which is vertical with respect to the direction within a surface of the optical waveguide sheet and becomes a mirror surface for dividing and reflecting the light, and a sloping opening portion having a sloping inner wall, w
    Type: Application
    Filed: June 29, 2005
    Publication date: February 2, 2006
    Inventor: Akihiko Okubora
  • Publication number: 20050288392
    Abstract: The present invention is directed to a high frequency module used for wireless communication module, and comprises a first organic substrate (11) in which conductive pattern or patterns are formed on the principal surface thereof and one element body (7) or more are mounted, and a second organic substrate (12) in which a recessed portion (22) is formed in correspondence with the area where the element body or bodies (7) are mounted at the connecting surface to the first organic substrate (11). In the state where the second organic substrate (12) is connected to the first organic substrate (11), an element body accommodating portion (24) which seals the element body or bodies (7) is constituted by the recessed portion (22), wherein the element body accommodating portion (24) is adapted so that moisture resistance characteristic and oxidation resistance characteristic are maintained.
    Type: Application
    Filed: June 19, 2003
    Publication date: December 29, 2005
    Inventor: Akihiko Okubora
  • Publication number: 20050195891
    Abstract: The present invention relates to a high frequency module board device having a high frequency transmitting and receiving circuit for modulating and demodulating a high frequency signal. The high frequency module board device comprises a base board (2) whose main surface is formed as a build-up surface (2a) and a high frequency circuit part (3) formed on the build-up surface of the base board (2) and having passive elements formed. The base board (2) has an area (29) in which wiring is not formed in a lower layer from a fourth wiring layer (8b). The high frequency circuit part (3) has an upper electrode part (36) and a lower electrode part (35) in positions corresponding to the area (29) in which the wiring is not formed. Thus, since a capacitance (18) is provided just above the area (29) in which the wiring is not formed, a parasitic capacity that the capacitance (18) receives from ground patterns (14) is reduced. Accordingly, the characteristics of the capacitance (18) can be improved.
    Type: Application
    Filed: April 12, 2005
    Publication date: September 8, 2005
    Inventors: Tatsuya Ogino, Akihiko Okubora, Takayuki Hirabayashi, Takahiko Kosemura, Kuniyuki Hayashi
  • Publication number: 20050146403
    Abstract: A high-frequency module having a communication function is provided which includes a base substrate block (2) formed from organic substrates (11, 12), the organic substrate (11) having wiring layers (14, 15) formed on main sides, respectively, thereof while the organic substrate (12) has wiring layers (16, 17) formed on main sides, respectively, thereof, the base substrate block (2) having a buildup surface formed by flattening an uppermost layer, and an elements block (3) formed from organic insulative layers (26, 28) formed on the buildup surface of the base substrate block (2) and in which a plurality of conductive parts (19, 20, 32) forming passive elements and distributed parameter elements, which transmit a high-frequency signal, are formed along with wiring layers (27, 29). The conductive parts (19, 20, 32) in the elements block (3) are formed correspondingly to portions of the organic substrate (11) in the base substrate block (2) where no woven glass fabric is laid.
    Type: Application
    Filed: January 24, 2003
    Publication date: July 7, 2005
    Applicant: Sony Corporation
    Inventor: Akihiko Okubora
  • Publication number: 20050100298
    Abstract: An optical waveguide having a optical waveguide path capable of securing a high light propagation characteristic regardless of the type of a supporting base, provided with a multilayer circuit board, an optical waveguide path arranged on the multilayer circuit board, a light receiving element, IC chips, and a light emitting element, the optical waveguide path formed on a transparent substrate excellent in flatness and transferred to the multilayer circuit board. The light propagation loss becomes small, and a signal to be transmitted at a high speed being transmitted as a light signal and a signal which can be transmitted at a relatively low speed being transmitted as an electrical signal, whereby the signal propagation delay which becomes the problem when a signal is transmitted by only electrical wiring is overcome, and the influence of electromagnetic noise becomes small.
    Type: Application
    Filed: November 19, 2004
    Publication date: May 12, 2005
    Inventors: Akihiko Okubora, Tsuyoshi Ogawa
  • Patent number: 6889155
    Abstract: The present invention relates to a high frequency module board device having a high frequency transmitting and receiving circuit for modulating and demodulating a high frequency signal. The high frequency module board device comprises a base board (2) whose main surface is formed as a build-up surface (2a) and a high frequency circuit part (3) formed on the build-up surface of the base board (2) and having passive elements formed. The base board (2) has an area (29) in which wiring is not formed in a lower layer from a fourth wiring layer (8b). The high frequency circuit part (3) has an upper electrode part (36) and a lower electrode part (35) in positions corresponding to the area (29) in which the wiring is not formed. Thus, since a capacitance (18) is provided just above the area (29) in which the wiring is not formed, a parasitic capacity that the capacitance (18) receives from ground patterns (14) is reduced. Accordingly, the characteristics of the capacitance (18) can be improved.
    Type: Grant
    Filed: October 3, 2002
    Date of Patent: May 3, 2005
    Assignee: Sony Corporation
    Inventors: Tatsuya Ogino, Akihiko Okubora, Takayuki Hirabayashi, Takahiko Kosemura, Kuniyuki Hayashi
  • Publication number: 20050037535
    Abstract: This invention is a method for manufacturing a high-frequency module device. A high-frequency circuit unit (2) in which first to third unit wiring layers (5) to (7), each having a capacitor (12) or the like at a part, are stacked and formed on flattened one surface of a dummy board (30) so that a third pattern wiring is exposed from a connection surface (2a) of an uppermost layer is mounted on a mounting surface (3a) of a base board (3) where an input/output terminal part (18) is exposed, in such a manner that the third pattern wiring and the input/output terminal part are connected with each other, and after that, the dummy board is removed. A high-frequency module device is thus manufactured.
    Type: Application
    Filed: September 3, 2003
    Publication date: February 17, 2005
    Inventors: Tsuyoshi Ogawa, Takahiko Kosemura, Akira Muto, Akihiko Okubora
  • Patent number: 6831357
    Abstract: A circuit substrate device composed of a circuit unit 2 and a multi-layer wiring substrate 3 in which a pattern conductor of the circuit unit 2 may be prevented from being warped or inundated. The circuit substrate device includes a circuit unit 2 having a pattern conductor formed by a thin film technique, and an insulating layer, and a multi-layer wiring substrate 3 having a connecting terminal portion 14 exposed from its major surface. The circuit unit is formed on a dummy substrate. The circuit unit is connected to the multi-layer wiring substrate 3 so that the pattern conductor is connected to the connecting terminal portion 14. The dummy substrate is then removed to give a structure comprised of the circuit unit 2 formed on the multi-layer wiring substrate 3. The pattern conductor of the circuit unit 2 is freed of warping or inundations along the direction of thickness of the circuit unit 2.
    Type: Grant
    Filed: March 26, 2003
    Date of Patent: December 14, 2004
    Assignee: Sony Corporation
    Inventors: Yuji Nishitani, Tsuyoshi Ogawa, Hiroshi Asami, Akihiko Okubora
  • Patent number: 6803324
    Abstract: A wiring circuit block is produced by forming a release layer on one of planarized principal surfaces of a mother substrate, forming an insulating layer on the release layer, patterning the insulating layer and forming a wiring layer on the patterned insulating layer, and separating the insulating layer and wiring layer from the release layer on the mother substrate. The circuit block has components, and deposited on the wiring layer, and is mounted on a base circuit board to provide a wiring device. Also, semiconductor chips are mounted on the circuit block, and the circuit block is mounted on a base circuit board to provide a semiconductor device.
    Type: Grant
    Filed: March 6, 2003
    Date of Patent: October 12, 2004
    Assignee: Sony Corporation
    Inventors: Tsuyoshi Ogawa, Yuji Nishitani, Akihiko Okubora
  • Patent number: 6800936
    Abstract: The present invention provides a high-frequency module configuring a micro communication functional module, which includes a base substrate (2) which has multiple pattern wiring layers (6a) (6b) (9a) (9b) and dielectric insulating layers (5) (8) (11) formed therein, and has a buildup surface for smoothing the upper layer thereof, and a high-frequency element layer (4) formed on the buildup surface, which has an inductor (20) formed therein via an insulating layer (19) formed on the buildup surface. The base substrate (2) is provided with a region (30) where the pattern wiring layers (6a) (6b) (9a) (9b) are not formed from the upper layer to at least the mid portion thereof along the thickness direction, and the inductor (20) of the high-frequency element layer (4) is formed directly above the region (30).
    Type: Grant
    Filed: January 3, 2003
    Date of Patent: October 5, 2004
    Assignee: Sony Corporation
    Inventors: Takahiko Kosemura, Akihiko Okubora, Takayuki Hirabayashi, Tatsuya Ogino, Kuniyuki Hayashi
  • Patent number: 6797890
    Abstract: A high frequency module device of a thin type, high precision and high functions in which the size and the cost of the package may be diminished. The module device includes a base substrate (2) and a high frequency device layer (4). The base substrate (2) is formed by forming a patterned wiring layer (9) on a first major surface (5a) of a core substrate (5) molded of an organic material exhibiting thermal resistance and high frequency characteristics. The uppermost layer of the base substrate (2) is planarized to form a high frequency device layer forming surface (3). The high frequency device layer portion (4) is formed on the high frequency device layer forming surface (3) by a thin film or thick film forming technique and includes intra-layer passive elements, made up of a resistor (27) and a capacitor (26). The passive elements are supplied with power or signals from the side base substrate.
    Type: Grant
    Filed: August 22, 2002
    Date of Patent: September 28, 2004
    Assignee: Sony Corporation
    Inventors: Akihiko Okubora, Tsuyoshi Ogawa, Hirokazu Nakayama, Yoichi Oya
  • Publication number: 20040171190
    Abstract: A circuit substrate device composed of a circuit unit 2 and a multi-layer wiring substrate 3 in which a pattern conductor of the circuit unit 2 may be prevented from being warped or inundated. The circuit substrate device includes a circuit unit 2 having a pattern conductor formed by a thin film technique, and an insulating layer, and a multi-layer wiring substrate 3 having a connecting terminal portion 14 exposed from its major surface. The circuit unit is formed on a dummy substrate. The circuit unit is connected to the multi-layer wiring substrate 3 so that the pattern conductor is connected to the connecting terminal portion 14. The dummy substrate is then removed to give a structure comprised of the circuit unit 2 formed on the multi-layer wiring substrate 3. The pattern conductor of the circuit unit 2 is freed of warping or inundations along the direction of thickness of the circuit unit 2.
    Type: Application
    Filed: March 3, 2004
    Publication date: September 2, 2004
    Inventors: Yuji Nishitani, Tsuyoshi Ogawa, Hiroshi Asami, Akihiko Okubora
  • Publication number: 20040155734
    Abstract: The present invention provides a high frequency module having a base substrate unit (2) which has its uppermost layer planarized to form a buildup-forming surface (16), a high frequency circuit unit (3) having multiple wiring layers which are formed on the base substrate unit (2), each of which layers has a wiring pattern and film elements formed on a dielectric insulating layer thereof, whose uppermost wiring layer (17) has plural lands (22) and ground patterns (20) formed thereon together with the wiring pattern and inductor elements (19), and a semiconductor chip (4) mounted on the wiring layer (17) of the high frequency circuit unit (3). Transmission lines (24) to connect the inductor elements (19) and lands (22) which are formed on the wiring layer (17) are directed within hollowed pattern regions (20c) formed at the ground pattern (20) to constitute coplanar type transmission lines.
    Type: Application
    Filed: October 27, 2003
    Publication date: August 12, 2004
    Inventors: Takahiko Kosemura, Akihiko Okubora
  • Publication number: 20040130877
    Abstract: A high-frequency module having a communication function is provided which uses a circuit board including an organic substrate (5) formed from a woven glass fabric (21) formed by weaving glass fibers (22) into a mesh pattern and also an organic material (20) provided integrally on the woven glass fabric (21) as a core. The organic substrate (5) has the glass fibers (22) distributed at close intervals of &lgr;e/4 (&lgr;e: effective wavelength of high-frequency signal) in the wavelength traveling direction of the high-frequency signal in the conductor patterns where resonant lines for transmission of the high-frequency and passive elements are formed. In the high-frequency module, the “variations” of the dielectric constant etc. of the organic substrate, which would be caused by any thick and thin distributions of the glass fibers, can be reduced, and thus the conductive parts can work with stable performances, respectively.
    Type: Application
    Filed: February 17, 2004
    Publication date: July 8, 2004
    Inventor: Akihiko Okubora
  • Patent number: 6753815
    Abstract: The present invention is an antenna apparatus attached to an electronic device and includes an antenna section (11) having an antenna element (18) provided with two or more power supply points (19) and two or more earth points (20); and an earth point switch (21) which is provided correspondingly to each earth point (20) and connects or disconnects the earth point (20) from a ground. Selectively turning on or off the earth point switch (21) selects the earth point to adjust the resonance frequency.
    Type: Grant
    Filed: January 16, 2003
    Date of Patent: June 22, 2004
    Assignees: Sony Corporation
    Inventors: Akihiko Okubora, Takayuki Hirabayashi, Norikazu Nakayama, Hiroyuki Arai
  • Publication number: 20040066617
    Abstract: This invention is a circuit board device having a filter element. It has a base board (4), a circuit part (2) mounted on the base board (4), a filter element (5) arranged between the circuit part (2) and the base board (4), and a semiconductor component (3) mounted on the same plate as the circuit part (2) on the base board (4). The semiconductor component (3) is mounted on a thin plate region (17) that is thinner than a thick plate region (16) having its thickness increased by mounting the circuit part (2) on the base board (4). Thus, the thickness of the whole circuit board device is reduced and the filter element (5) is covered with a sufficiently thick dielectric insulating material so as to prevent deterioration in filter characteristic.
    Type: Application
    Filed: August 8, 2003
    Publication date: April 8, 2004
    Inventors: Takayuki Hirabayashi, Akihiko Okubora