Abstract: A high frequency module device of a thin type, high precision and high functions in which the size and the cost of the package may be diminished. The module device includes a base substrate (2) and a high frequency device layer (4). The base substrate (2) is formed by forming a patterned wiring layer (9) on a first major surface (5a) of a core substrate (5) molded of an organic material exhibiting thermal resistance and high frequency characteristics. The uppermost layer of the base substrate (2) is planarized to form a high frequency device layer forming surface (3). The high frequency device layer portion (4) is formed on the high frequency device layer forming surface (3) by a thin film or thick film forming technique and includes intra-layer passive elements, made up of a resistor (27) and a capacitor (26). The passive elements are supplied with power or signals from the side base substrate.

Abstract: An optical waveguide having a optical waveguide path capable of securing a high light propagation characteristic regardless of the type of a supporting base, provided with a multilayer circuit board, an optical waveguide path arranged on the multilayer circuit board, a light receiving element, IC chips, and a light emitting element, the optical waveguide path formed on a transparent substrate excellent in flatness and transferred to the multilayer circuit board. The light propagation loss becomes small, and a signal to be transmitted at a high speed being transmitted as a light signal and a signal which can be transmitted at a relatively low speed being transmitted as an electrical signal, whereby the signal propagation delay which becomes the problem when a signal is transmitted by only electrical wiring is overcome, and the influence of electromagnetic noise becomes small.

Abstract: The present invention relates to a high frequency module board device having a high frequency transmitting and receiving circuit for modulating and demodulating a high frequency signal. The high frequency module board device comprises a base board (2) whose main surface is formed as a build-up surface (2a) and a high frequency circuit part (3) formed on the build-up surface of the base board (2) and having passive elements formed. The base board (2) has an area (29) in which wiring is not formed in a lower layer from a fourth wiring layer (8b). The high frequency circuit part (3) has an upper electrode part (36) and a lower electrode part (35) in positions corresponding to the area (29) in which the wiring is not formed. Thus, since a capacitance (18) is provided just above the area (29) in which the wiring is not formed, a parasitic capacity that the capacitance (18) receives from ground patterns (14) is reduced. Accordingly, the characteristics of the capacitance (18) can be improved.

Abstract: The present invention is an antenna apparatus attached to an electronic device and includes an antenna section (11) having an antenna element (18) provided with two or more power supply points (19) and two or more earth points (20); and an earth point switch (21) which is provided correspondingly to each earth point (20) and connects or disconnects the earth point (20) from a ground. Selectively turning on or off the earth point switch (21) selects the earth point to adjust the resonance frequency.

Abstract: A circuit substrate device composed of a circuit unit 2 and a multi-layer wiring substrate 3 in which a pattern conductor of the circuit unit 2 may be prevented from being warped or inundated. The circuit substrate device includes a circuit unit 2 having a pattern conductor formed by a thin film technique, and an insulating layer, and a multi-layer wiring substrate 3 having a connecting terminal portion 14 exposed from its major surface. The circuit unit is formed on a dummy substrate. The circuit unit is connected to the multi-layer wiring substrate 3 so that the pattern conductor is connected to the connecting terminal portion 14. The dummy substrate is then removed to give a structure comprised of the circuit unit 2 formed on the multi-layer wiring substrate 3. The pattern conductor of the circuit unit 2 is freed of warping or inundations along the direction of thickness of the circuit unit 2.

Abstract: A wiring circuit block (2) is produced by forming a release layer (6) on one of planarized principal surfaces of a mother substrate (1), forming an insulating layer (7) on the release layer (6), patterning the insulating layer (7) and forming a wiring layer (8) on the patterned insulating layer (7), and separating the insulating layer (7) and wiring layer (8) from the release layer (6) on the mother substrate (1). The circuit block (2) has components (12), (13) and (17) deposited on the wiring layer (8), and is mounted on a base circuit board (3) to provide a wiring device. Also, semiconductor chips (62) are mounted on the circuit block (2), and the circuit block (2) is mounted on a base circuit board (64) to provide a semiconductor device.

Abstract: The present invention provides a high-frequency module device having a distributed constant circuit formed therein, the device comprising: a base board (2) having a high-frequency element layer forming surface (3) formed by performing flattening processing on an uppermost layer of a multilayer printed wiring part in which a printed wiring layer having a ground part and a dielectric insulating layer made of a dielectric insulating material are formed in a multilayer form on one major surface of a core board (6); and a high-frequency element layer part (5) having a passive element and a circuit element for receiving power or a signal supplied from the base board (2) via a dielectric insulating part made of a dielectric insulating material, on the high-frequency element layer forming surface (3) of the base board (2). The base board (2) has a distributed constant circuit (4) formed by pattern wiring.

Abstract: The present invention provides a high-frequency module configuring a micro communication functional module, which includes a base substrate (2) which has multiple pattern wiring layers (6a) (6b) (9a) (9b) and dielectric insulating layers (5) (8) (11) formed therein, and has a buildup surface for smoothing the upper layer thereof, and a high-frequency element layer (4) formed on the buildup surface, which has an inductor (20) formed therein via an insulating layer (19) formed on the buildup surface. The base substrate (2) is provided with a region (30) where the pattern wiring layers (6a) (6b) (9a) (9b) are not formed from the upper layer to at least the mid portion thereof along the thickness direction, and the inductor (20) of the high-frequency element layer (4) is formed directly above the region (30).

Abstract: A circuit device board having a desired characteristic is provided by bonding dielectric substrates. A printed board 11 carrying patterns 11a and 11b incorporating a resonator is joined by a prepreg 13 to a printed board 12 carrying patterns 12a and 12b, which are substantially identical to the patterns 11a and 11b, so that the patterns come opposite to each other. As a grounding conductor is provided on the outer side of each of the printed boards 11 and 12, a band-pass filter having the three-plate structure is completed. The patterns 11a and 12a are connected to each other for determining the signal input while the patterns 11b and 12b are connected to each other for determining the signal output. Accordingly, the frequency response can be obtained at a desired level regardless of the thickness of the prepreg 13.

Abstract: A semiconductor device including a package board having interconnection patterns on one main surface, a semiconductor chip electrically connected through internal terminations to the interconnection patterns of the package board and having an element forming surface facing the package board across a space, and a conductive plate connected to a back surface of the semiconductor chip of a side opposite to the element forming surface through a conductive bonding layer, the semiconductor chip being sealed in a resin formed in a circumferential direction in the space between the package board and the conductive plate, one main surface of the package board being provided with a depression enlarging the space in the thickness direction of the package board.

Abstract: A high frequency module device of a thin type, high precision and high functions in which the size and the cost of the package may be diminished. The module device includes a base substrate (2) and a high frequency device layer (4). The base substrate (2) is formed by forming a patterned wiring layer (9) on a first major surface (5a) of a core substrate (5) molded of an organic material exhibiting thermal resistance and high frequency characteristics. The uppermost layer of the base substrate (2) is planarized to form a high frequency device layer forming surface (3). The high frequency device layer portion (4) is formed on the high frequency device layer forming surface (3) by a thin film or thick film forming technique and includes intra-layer passive elements, made up of a resistor (27) and a capacitor (26). The passive elements are supplied with power or signals from the side base substrate.

Abstract: The invention includes a filter element comprising a dielectric substrate and a strip conductive pattern formed on the dielectric substrate. The dielectric substrate has cavities with apertures on the surface of the dielectric substrate. The strip conductive pattern is formed over the apertures of the cavities to serve as inductance. The strip conductive pattern has an approximately uniform line width that effectively improves the production yield and reliability of the filter element.

Abstract: A method for practically loading a small-sized and compact transmission or receiving module for an optical link in which interference between a receiving circuit and a transmission circuit can be prevented, high speed and high quality communications with a high S/N ratio can be carried out, and generated heat at the IC or the like can be discharged efficiently to a surrounding atmosphere, wherein at least a pair optical fibers 2 are installed at a fiber installing part 4, each light emitting element 5 and light receiving element 6 is arranged in a direction of an optical axis each of transmission optical fiber and receiving optical fiber installed at the fiber installing part, a first board 10 connected to root portions of the lead terminals of the light emitting element and the light receiving element is integrally formed with a second board 12 and a third board 14 respectively connected to both opposing ends of the first board through a flexible board, and the second board and the third board are folded at

Abstract: A high frequency module device of a thin type, high precision and high functions in which the size and the cost of the package may be diminished. The module device includes a base substrate (2) and a high frequency device layer (4). The base substrate (2) is formed by forming a patterned wiring layer (9) on a first major surface (5a) of a core substrate (5) molded of an organic material exhibiting thermal resistance and high frequency characteristics. The uppermost layer of the base substrate (2) is planarized to form a high frequency device layer forming surface (3). The high frequency device layer portion (4) is formed on the high frequency device layer forming surface (3) by a thin film or thick film forming technique and includes intra-layer passive elements, made up of a resistor (27) and a capacitor (26). The passive elements are supplied with power or signals from the side base substrate.

Abstract: A semiconductor device comprising a package board having interconnection patterns on one main surface, a semiconductor chip electrically connected through internal terminations to the interconnection patterns of the package board and having an element forming surface facing the package board across a space, and a conductive plate connected to a back surface of the semiconductor chip of a side opposite to the element forming surface through a conductive bonding layer, the semiconductor chip being sealed in a resin formed in a circumferential direction in the space between the package board and the conductive plate, one main surface of the package board being provided with a depression enlarging the space in the thickness direction of the package board.

Abstract: The present invention is to realize a filter element comprising an element consisting of a strip line having an approximately uniform line width which is effective to improve the production yield and reliability. Cavities are provided on the surface of a dielectric substrate, a strip conductive pattern is formed partially on the cavities to serve as inductance.

Abstract: An optical-electronic integrated circuit device capable of three-dimensionally transmitting optical signals between plural semiconductor substrates on each of which an integrated circuit is previously formed. At least one of the light emitting elements and the light receiving elements are formed on the semiconductor substrate which transmits the light propagated between these elements. In this manner, signals may be transmitted in a direction perpendicular to the semiconductor substrate even without specifically processing the semiconductor substrate. Additionally, signal distortion, transmission losses, mutual intervention or delay are not incurred.

Abstract: The present invention discloses a method of producing a discharge display device which enables formation of a satisfactory LaB.sub.6 cathode without using a LaB.sub.6 paste containing a glass binder. The method of the present invention comprises the steps of applying a conductive paste containing a glass binder, temporarily drying said conductive paste to form a conductive paste layer, forming a LaB.sub.6 layer containing no glass binder on said conductive paste layer, burning said conductive paste layer and said LaB.sub.6 layer, at the same time, and activating said LaB.sub.6 layer after being burnt, and after an exhausting step by gas discharge with large current to form a LaB.sub.6 cathode.