Abstract: According to the present invention, there is provided an coating apparatus including means for holding an object to be process, the object holding means rotating in a state in which the object is placed thereon, a ring-like cup situated on an outer side of the object holding means, processing solution supply means, provided above the object, for supplying a processing solution on a surface of the object, discharge means, provided underneath the ring-like cup, for discharging processing solution portions scattered around when the processing solution is supplied on the surface of the object as a waste solution, together with a gas, and storage means, connected to the discharge means, for storing the waste solution and the gas discharged from the discharge means, wherein the waste solution and the gas are separated from each other in the storage means.

Abstract: The present invention provides a substrate processing method including the coating step of coating a processing liquid on an object to be processed in a first processing unit of a processing chamber having first and second processing units, the step of conveying the object from the first processing unit to the second processing unit, the rinse step of rinsing an unnecessary processing liquid remaining on a peripheral portion of the object in the second processing unit to remove the unnecessary processing liquid, and the exposure step of conveying the rinsed object to an exposure apparatus to perform exposure processing for the object, wherein a time from the end of the rinse step for one object to be processed to the end of the rinse step for a next object to be processed is shorter than a time required for the exposure step for the one object.

Abstract: An apparatus for forming a coating film, comprises a spin chuck for supporting a substrate with one surface facing upward and rotating the substrate about a vertical axis, a first nozzle for supplying a solvent of a coating solution on the substrate, and a second nozzle for supplying the coating solution on a central portion of the substrate. The first and second nozzles are supported by a head such that the supported nozzle moves between a dropping position above the substrate and a waiting position offset from the substrate. The solvent and coating solution are diffused along the surface of the substrate by rotating the spin chuck.

Abstract: The present invention provides a test head cooling system for cooling test heads of a semiconductor IC test apparatus in an enclosed structure. A sealed housing is provided in a test head wherein an air duct is formed in a wall of the sealed box so that cooling air flow effectively. Several thousands of cables are connected to sockets of a plurality of boards. The boards are fixed in board racks by inserting the boards to sockets of the board racks. Gaps between the boards are arranged to provide good ventilation. A cooling pipe is connected to two heat exchangers for circulating cooling medium. A flexible hose for circulating the cooling medium is connected to one of the heat exchangers. The flexible hose is connected to an outside cooling apparatus so as to freely control the temperature of the cooling medium circulating inside the heat exchanger.

Abstract: A coating apparatus comprises a chuck on which a semiconductor wafer is adhered, a resist liquid supplying system for supplying a resist liquid to the semiconductor wafer, a motor for rotating the semiconductor wafer, thereby spreading the resist liquid over the semiconductor wafer, and a plate, on which the semiconductor wafer is placed, for creating a temperature distribution on the semiconductor wafer.

Abstract: A substrate processing apparatus according to this invention includes an interface section having a first transfer member for transferring an object from a coating process section for applying a process solution to the object in accordance with a single sheet process to an object holding member, and a moving member for detachably supplying a plurality of object holding member and simultaneously moving the plurality of object holding member, and a heat-treatment section having a second transfer member for transferring the object placed on the object holding member to a heat-treatment section for heat-treating the plurality of objects, which have undergone the coating process, in accordance with a batch process.

Abstract: There is provided a double-sided substrate cleaning apparatus including a carrier station for loading/unloading a carrier in which objects to be processed are stored, a convey mechanism for conveying an object taken out from the carrier station, at least one cleaning mechanism, arranged along a convey path on which the convey mechanism conveys the object, for cleaning the object, and an object reversing mechanism, arranged along the convey path, for reversing the object.

Abstract: A coating apparatus includes a rotating and holding mechanism which holds and rotates an object to be coated, a container which encloses the rotating and holding mechanism and prevents the dispersion of coating liquid supplied to the object, a washing fitting provided to the rotating and holding mechanism and which supplies washing liquid for washing off coating liquid which has attached to the inside of container. This washing fitting has a collection pool for collecting the washing liquid, and discharge holes through which the washing liquid in the collection pool is discharged by rotation of the rotating and holding mechanism. Thus, it is possible to evenly wash off coating liquid which has attached to the inside of the container in a short time with a small amount of washing liquid.

Abstract: A process for separating Fe(III) from an aqueous solution of metallic salts containing at least Fe(III), comprising: (1) bringing said aqueous solution into contact with an organic extraction solvent containing, as an extractant, an organic phosphinic acid represented by the following general formula to thereby extract at least Fe(III) from the aqueous phase and transfer it into the organic phase; ##STR1## wherein R.sub.1 and R.sub.2 are alkyls, respectively, having carbon number in the range of 1 to 20; the sum of carbon numbers for R.sub.1 and R.sub.2 is in the range of 12 to 36; and R.sub.1 is the same as or different from R.sub.2, and (2) separating the resulting Fe(III) loaded organic phase from said aqueous phase.A process for separating Fe(III) from an organic extraction solvent loaded with at least Fe(III), comprising: (1) bringing said extraction solvent into contact with an aqueous solution of a mineral acid having a low concentration at pH 1.

Abstract: This invention concerns the method of separation of Co from Ni in an aqueous solution containing Co from Ni salts, with an organic solvent containing 2-ethylhexyl phosphonic acid mono-2-ethylhexyl ester and/or 3,5,5-trimethylhexyl phosphonic acid mono-3,5,5-trimethylhexyl ester and/or isodecyl phosphonic acid monoisodecyl ester as an effective extractant for the separation of Co from Ni, the method which requires fewer stages in the solvent extraction equipment and less organic solvent than the conventional method, and which can very effectively separate Co from Ni in high purity and in high yield. The continuous separation of Co from Ni according to this invention enables the separation of Co with purity above 99% in a yield above 99% and Ni with purity above 99% in a yield above 99%.

Abstract: This invention concerns the method of separation of Co from Ni in an aqueous solution containing Co from Ni salts, with an organic solvent containing 2-ethylhexyl phosphonic acid mono-2-ethylhexyl ester and/or 3,5,5-trimethylhexyl phosphonic acid mono-3,5,5-trimethylhexyl ester and/or isodecyl phosphonic acid monoisodecyl ester as an effective extractant for the separation of Co from Ni, the method which requires fewer stages in the solvent extraction equipment and less organic solvent than the conventional method, and which can very effectively separate Co from Ni in high purity and in high yield. The continuous separation of Co from Ni according to this invention enables the separation of Co with purity above 99% in a yield above 99% and Ni with purity above 99% in a yield above 99%.