Abstract: Provided is a semiconductor device. In a first operation mode, a first modulated signal is input to a plurality of inverter circuits provided in a first amplifier circuit, and a second modulated signal is input to a plurality of inverter circuits provided in a second amplifier circuit. In a second operation mode, a test signal generation circuit modulates a test signal to generate a third modulated signal and a fourth modulated signal. The third modulated signal is input to some of the plurality of inverter circuits provided in the first amplifier circuit, and outputs of other inverter circuits have high impedances. The fourth modulated signal is input to some of the plurality of inverter circuits provided in the second amplifier circuit, and outputs of other inverter circuits have high impedances. A peak frequency detection circuit detects a frequency range including a frequency of the test signal at which an impedance of a sound reproduction device peaks.

Abstract: Provided is a semiconductor device including: a first modulation circuit configured to receive a first sound source signal, sigma-delta modulate a signal based on the first sound source signal, and output a first sigma-delta modulated signal; a second modulation circuit configured to pulse-width modulate a signal based on the first sigma-delta modulated signal, and output a first pulse-width modulated signal; a first modulation inspection circuit configured to inspect the first modulation circuit; and a second modulation inspection circuit configured to inspect the second modulation circuit, in which the first modulation inspection circuit and the second modulation inspection circuit are separated from each other.

Abstract: A circuit device includes an A/D conversion unit, a processing unit that performs a temperature compensation process of an oscillation frequency based on temperature detection data and outputs frequency control data of the oscillation frequency, a D/A conversion unit, and an oscillation circuit. The D/A conversion unit (area DAC) is disposed on a first direction DR1 side of the A/D conversion unit (area ADC). When a direction crossing the first direction DR1 is defined as a second direction DR2, the processing unit (area DSPL) is disposed on the second direction DR2 side of the A/D conversion unit and the D/A conversion unit. When a direction opposite to the second direction DR2 is defined as a third direction DR3, the oscillation circuit (area OSC) is disposed on the third direction DR3 side or the first direction DR1 side of the D/A conversion unit.

Abstract: An oscillator includes a package having a first side, a second side, a third side, and a fourth side, a resonator and an oscillation circuit disposed in the package, an output terminal arranged along the first side of the package, and outputting a clock signal generated by the oscillation circuit, and a control terminal arranged along the second side of the package, and supplied with a digital control signal adapted to update an operation state of the oscillation circuit.

Abstract: A circuit device includes an A/D conversion section adapted to perform an A/D conversion of a temperature detection voltage from a temperature sensor to output temperature detection data, a processing section adapted to perform a temperature compensation process of an oscillation frequency based on the temperature detection data to output frequency control data of the oscillation frequency, and an oscillation signal generation circuit adapted to generate an oscillation signal using the frequency control data and a resonator. The processing section may change the frequency control data in increments of k×LSB (k?1) based on a change in temperature.

Abstract: A circuit device includes a power supply circuit and a digital temperature compensated oscillation circuit. The digital temperature compensated oscillation circuit includes an A/D conversion unit, a processing unit, and an oscillation signal generation circuit. The A/D conversion unit performs A/D conversion of a temperature detection voltage from a temperature sensor unit. The processing unit performs temperature compensation processing of an oscillation frequency based on temperature detection data. The oscillation signal generation circuit generates an oscillation signal of the oscillation frequency using frequency control data and a vibrator. The power supply circuit includes at least one reference voltage generation circuit that generates a reference voltage based on a work function difference between transistors.

Abstract: A oscillator includes a substrate having a first surface and a second surface, a first wiring layer and a second wiring layer disposed respectively on the first and second surfaces, and a plurality of through holes electrically connecting the first and second wiring layers to each other, a resonator disposed above the first surface of the substrate, and having a resonator element, a pair of electrodes sandwiching the resonator element, and a pair of terminals adapted to electrically connect the pair of electrodes to the first electrode layer, and at least one semiconductor device disposed on the second surface of the substrate, adapted to generate an oscillation signal, and having first and second terminals electrically connected respectively to the pair of terminals of the resonator via the second wiring layer and the first wiring layer, and a third terminal supplied with a digital control signal, wherein a distance between each of the first and second terminals and the pair of terminals of the resonator is

Abstract: A circuit device includes an A/D conversion unit that performs A/D conversion of a temperature detection voltage applied from a temperature sensor unit and outputs temperature detection data, a processing unit that performs a temperature compensation process of an oscillation frequency on the basis of the temperature detection data, and an oscillation signal generation circuit that includes a D/A conversion unit and an oscillation circuit and generates an oscillation signal using frequency control data received from the processing unit and a vibrator. The D/A conversion unit includes modulation circuit that receives the frequency control data of (n+m) bits and modulates n-bit data on the basis of m-bit data of the frequency control data, a D/A converter that performs D/A conversion of the modulated n-bit data, and a filter circuit that smoothes the output voltage of the D/A converter.

Abstract: An IC for heating includes a semiconductor, substrate on which a diffusion layer is formed; a first pad that applies a power source voltage to the diffusion layer; and a second pad that applies a ground voltage to the diffusion layer. A semiconductor substrate includes slits such that the slits intersect a virtual straight line connecting the pads when the semiconductor substrate is seen in a plan view.

Abstract: An oscillator includes a control voltage generator that generates a control voltage between a first reference voltage and a second reference voltage with a digital signal, and a voltage controlled oscillation circuit that outputs a signal at a frequency in response to the control voltage. The control voltage generator includes a first D/A conversion circuit of resistor voltage-dividing type that generates a voltage between the first reference voltage and the second reference voltage.

Abstract: An IC for heating includes a semiconductor substrate on which a diffusion layer is formed; a first pad and a first via that apply a power voltage to the diffusion layer; and a second pad and a second via that apply a ground voltage to the diffusion layer. The vias overlap with an area on which the diffusion layer is formed in a plan view, the first pad overlaps with the first via in a plan view, and the second pad overlaps with the second via in a plan view. The current flowing through the first pad and the first via, the second pad and the second via, and the diffusion layer flows between an upper surface of the first pad and a lower surface of the first via, and a lower surface of the second via and an upper surface of the second pad.

Abstract: An oscillator includes a control voltage generator that generates a control voltage between a first reference voltage and a second reference voltage with a digital signal, and a voltage controlled oscillation circuit that outputs a signal at a frequency in response to the control voltage. The control voltage generator includes a first D/A conversion circuit of resistor voltage-dividing type that generates a voltage between the first reference voltage and the second reference voltage.

Abstract: An oscillator includes an input terminal, an oscillation circuit section configured to cause a resonator to resonate to output an oscillator signal, a digital input section to which a signal for controlling an oscillation frequency of the oscillation circuit section is input via the input terminal, and a first bias circuit section including a constant current source configured to supply a reference current to the digital input section.

Abstract: An oscillator includes a control voltage generator that generates a control voltage between a first reference voltage and a second reference voltage with a digital signal, and a voltage controlled oscillation circuit that outputs a signal at a frequency in response to the control voltage. The control voltage generator includes a first D/A conversion circuit of resistor voltage-dividing type that generates a voltage between the first reference voltage and the second reference voltage.

Abstract: A circuit device includes a power supply circuit and a digital temperature compensated oscillation circuit. The digital temperature compensated oscillation circuit includes an A/D conversion unit, a processing unit, and an oscillation signal generation circuit. The A/D conversion unit performs A/D conversion of a temperature detection voltage from a temperature sensor unit. The processing unit performs temperature compensation processing of an oscillation frequency based on temperature detection data. The oscillation signal generation circuit generates an oscillation signal of the oscillation frequency using frequency control data and a vibrator. The power supply circuit includes at least one reference voltage generation circuit that generates a reference voltage based on a work function difference between transistors.

Abstract: A circuit device includes an A/D conversion unit, a processing unit that performs a temperature compensation process of an oscillation frequency based on temperature detection data and outputs frequency control data of the oscillation frequency, a D/A conversion unit, and an oscillation circuit. The D/A conversion unit (area DAC) is disposed on a first direction DR1 side of the A/D conversion unit (area ADC). When a direction crossing the first direction DR1 is defined as a second direction DR2, the processing unit (area DSPL) is disposed on the second direction DR2 side of the A/D conversion unit and the D/A conversion unit. When a direction opposite to the second direction DR2 is defined as a third direction DR3, the oscillation circuit (area OSC) is disposed on the third direction DR3 side or the first direction DR1 side of the D/A conversion unit.

Abstract: An oscillator includes a package having a first side, a second side, a third side, and a fourth side, a resonator and an oscillation circuit disposed in the package, an output terminal arranged along the first side of the package, and outputting a clock signal generated by the oscillation circuit, and a control terminal arranged along the second side of the package, and supplied with a digital control signal adapted to update an operation state of the oscillation circuit.

Abstract: A circuit device includes an A/D conversion unit that performs A/D conversion of a temperature detection voltage applied from a temperature sensor unit and outputs temperature detection data, a processing unit that performs a temperature compensation process of an oscillation frequency on the basis of the temperature detection data, and an oscillation signal generation circuit that includes a D/A conversion unit and an oscillation circuit and generates an oscillation signal using frequency control data received from the processing unit and a vibrator. The D/A conversion unit includes modulation circuit that receives the frequency control data of (n+m) bits and modulates n-bit data on the basis of m-bit data of the frequency control data, a D/A converter that performs D/A conversion of the modulated n-bit data, and a filter circuit that smoothes the output voltage of the D/A converter.

Abstract: A circuit device includes an A/D conversion section adapted to perform an A/D conversion of a temperature detection voltage from a temperature sensor to output temperature detection data, a processing section adapted to perform a temperature compensation process of an oscillation frequency based on the temperature detection data to output frequency control data of the oscillation frequency, and an oscillation signal generation circuit adapted to generate an oscillation signal using the frequency control data and a resonator. The processing section may change the frequency control data in increments of k×LSB (k?1) based on a change in temperature.

Abstract: An oscillation circuit includes a terminal XO, a terminal XI, an oscillation unit, and a voltage generation circuit that generates a first voltage and a second voltage. The oscillation unit includes a variable capacitive element connected to the terminal XO or the terminal XI. In a first mode, a signal having a first amplitude is applied between the terminal XO and the terminal XI, and a first voltage is applied to the other end of the variable capacitive element. In a second mode, a signal having a second amplitude larger than an amplitude of the signal having the first amplitude is applied between the terminal XO and the terminal XI, a second voltage is applied to the other end of the variable capacitive element, and a voltage applied to the both ends of the variable capacitive element is lower than the maximum rated voltage of the variable capacitive element.